Patents by Inventor Brenton L. Dickey
Brenton L. Dickey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6975021Abstract: The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments of the carrier include easier handling, reduced probability of defective end products, and increased control in choosing the thinness of the substrate film. For example, the substrate film carrier can be used for lead-over-chip (LOC) assemblies and lead-under-chip (LUC) assemblies to create ball grid arrays (BGA), pin grid arrays (PGA), dual in-line packages (DIP), and the like.Type: GrantFiled: September 3, 1999Date of Patent: December 13, 2005Assignee: Micron Technology, Inc.Inventor: Brenton L. Dickey
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Patent number: 6897092Abstract: The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments of the carrier include easier handling, reduced probability of defective end products, and increased control in choosing the thinness of the substrate film. For example, the substrate film carrier can be used for lead-over-chip (LOC) assemblies and lead-under-chip (LUC) assemblies to create ball grid arrays (BGA), pin grid arrays (PGA), dual in-line packages (DIP), and the like.Type: GrantFiled: June 12, 2003Date of Patent: May 24, 2005Assignee: Micron Technology, Inc.Inventor: Brenton L. Dickey
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Patent number: 6707147Abstract: An apparatus and method for adhesively bonding a back surface of a substrate to an active surface of at least one semiconductor die having adhesive tape interposed therebetween. A wetting agent layer is provided on at least one of the back surface of the substrate and the active surface of at least one semiconductor die. The wetting agent layer interacts with an adhesive on the adhesive tape when the substrate is heated so that the substrate is adhesively bonded to at least one semiconductor die. The interaction of the wetting agent layer allows the adhesive tape to bond thereto at a lower temperature than that of the conventional bonding methods, and more importantly, enhances adhesion thereto.Type: GrantFiled: December 30, 2002Date of Patent: March 16, 2004Assignee: Micron Technology, Inc.Inventors: Brenton L. Dickey, Tongbi Jiang
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Publication number: 20030190769Abstract: The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments of the carrier include easier handling, reduced probability of defective end products, and increased control in choosing the thinness of the substrate film. For example, the substrate film carrier can be used for lead-over-chip (LOC) assemblies and lead-under-chip (LUC) assemblies to create ball grid arrays (BGA), pin grid arrays (PGA), dual in-line packages (DIP), and the like.Type: ApplicationFiled: June 12, 2003Publication date: October 9, 2003Inventor: Brenton L. Dickey
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Patent number: 6589812Abstract: An apparatus and method for adhesively bonding a back surface of a substrate to an active surface of at least one semiconductor die having adhesive tape interposed therebetween. A wetting agent layer is provided on at least one of the back surface of the substrate and the active surface of at least one semiconductor die. The wetting agent layer interacts with an adhesive on the adhesive tape when the substrate is heated so that the substrate is adhesively bonded to at least one semiconductor die. The interaction of the wetting agent layer allows the adhesive tape to bond thereto at a lower temperature than that of the conventional bonding methods, and more importantly, enhances adhesion thereto.Type: GrantFiled: February 21, 2002Date of Patent: July 8, 2003Assignee: Micron Technology, Inc.Inventors: Brenton L. Dickey, Tongbi Jiang
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Publication number: 20030094690Abstract: An apparatus and method for adhesively bonding a back surface of a substrate to an active surface of at least one semiconductor die having adhesive tape interposed therebetween. A wetting agent layer is provided on at least one of the back surface of the substrate and the active surface of at least one semiconductor die. The wetting agent layer interacts with an adhesive on the adhesive tape when the substrate is heated so that the substrate is adhesively bonded to at least one semiconductor die. The interaction of the wetting agent layer allows the adhesive tape to bond thereto at a lower temperature than that of the conventional bonding methods, and more importantly, enhances adhesion thereto.Type: ApplicationFiled: December 30, 2002Publication date: May 22, 2003Inventors: Brenton L. Dickey, Tongbi Jiang
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Patent number: 6521980Abstract: An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.Type: GrantFiled: October 4, 2000Date of Patent: February 18, 2003Assignee: Micron Technology, Inc.Inventors: Patrick W. Tandy, Joseph M. Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken, Edward A. Schrock, Brenton L. Dickey
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Patent number: 6501170Abstract: An apparatus and method for adhesively bonding a back surface of a substrate to an active surface of at least one semiconductor die having adhesive tape interposed therebetween. A wetting agent layer is provided on at least one of the back surface of the substrate and the active surface of at least one semiconductor die. The wetting agent layer interacts with an adhesive on the adhesive tape when the substrate is heated so that the substrate is adhesively bonded to at least one semiconductor die. The interaction of the wetting agent layer allows the adhesive tape to bond thereto at a lower temperature than that of the conventional bonding methods, and more importantly, enhances adhesion thereto.Type: GrantFiled: June 9, 2000Date of Patent: December 31, 2002Assignee: Micron Technology, Inc.Inventors: Brenton L. Dickey, Tongbi Jiang
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Publication number: 20020074645Abstract: An apparatus and method for adhesively bonding a back surface of a substrate to an active surface of at least one semiconductor die having adhesive tape interposed therebetween. A wetting agent layer is provided on at least one of the back surface of the substrate and the active surface of at least one semiconductor die. The wetting agent layer interacts with an adhesive on the adhesive tape when the substrate is heated so that the substrate is adhesively bonded to at least one semiconductor die. The interaction of the wetting agent layer allows the adhesive tape to bond thereto at a lower temperature than that of the conventional bonding methods, and more importantly, enhances adhesion thereto.Type: ApplicationFiled: February 21, 2002Publication date: June 20, 2002Inventors: Brenton L. Dickey, Tongbi Jiang
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Patent number: 6395579Abstract: An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.Type: GrantFiled: February 21, 2001Date of Patent: May 28, 2002Assignee: Micron Technology, Inc.Inventors: Patrick W. Tandy, Joseph M. Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken, Edward A. Schrock, Brenton L. Dickey
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Publication number: 20020008307Abstract: The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments of the carrier include easier handling, reduced probability of defective end products, and increased control in choosing the thinness of the substrate film. For example, the substrate film carrier can be used for lead-over-chip (LOC) assemblies and lead-under-chip (LUC) assemblies to create ball grid arrays (BGA), pin grid arrays (PGA), dual in-line packages (DIP), and the like.Type: ApplicationFiled: May 15, 2001Publication date: January 24, 2002Inventor: Brenton L. Dickey
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Publication number: 20010008780Abstract: An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.Type: ApplicationFiled: February 21, 2001Publication date: July 19, 2001Inventors: Patrick W. Tandy, Joseph M. Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken, Edward A. Schrock, Brenton L. Dickey
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Patent number: 6210992Abstract: An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.Type: GrantFiled: August 31, 1999Date of Patent: April 3, 2001Assignee: Micron Technology, Inc.Inventors: Patrick W. Tandy, Joseph M. Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken, Edward A. Schrock, Brenton L. Dickey