Patents by Inventor Bret Adams

Bret Adams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080064300
    Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
    Type: Application
    Filed: October 24, 2007
    Publication date: March 13, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Boguslaw Swedek, Bret Adams, Sanjay Rajaram, David Chan, Manoocher Birang
  • Publication number: 20060286904
    Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
    Type: Application
    Filed: August 24, 2006
    Publication date: December 21, 2006
    Applicant: Applied Materials, Inc.
    Inventors: Boguslaw Swedek, Bret Adams, Sanjay Rajaram, David Chan, Manoocher Birang
  • Publication number: 20060240651
    Abstract: A method for processing a substrate, such as a semiconductor wafer, includes performing a measurement to determine a substrate parameter distribution to be compensated, determining an adjusted implant parameter distribution to compensate for the substrate parameter distribution, and implanting the substrate in accordance with the adjusted implant parameter distribution. The substrate parameter distribution to be compensated may result from another process step and may be uniform or non-uniform. In another embodiment, an implant parameter may be varied as a function of implant position on the substrate to achieve different substrate parameter values in different areas of the substrate.
    Type: Application
    Filed: April 26, 2005
    Publication date: October 26, 2006
    Applicant: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Anthony Renau, Dennis Rodier, Joseph Olson, Bret Adams
  • Publication number: 20050245170
    Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
    Type: Application
    Filed: June 23, 2005
    Publication date: November 3, 2005
    Inventors: Boguslaw Swedek, Bret Adams, Sanjay Rajaram, David Chan, Manoocher Birang
  • Patent number: 6045670
    Abstract: An improved target assembly for a deposition chamber wherein the backing plate which mounts a metal target has a groove for receiving a target shield. The target shield can be replaced during normal cleaning operations without replacement of the remainder of the target assembly. The target shield can be used with targets having tapered edges.
    Type: Grant
    Filed: January 8, 1997
    Date of Patent: April 4, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Bret Adams, Gregory N. Hamilton
  • Patent number: D365727
    Type: Grant
    Filed: August 17, 1994
    Date of Patent: January 2, 1996
    Assignee: Advanced Sports Concepts, Inc.
    Inventors: Bret A. Adams, Paul P. Kolada, Michael J. Painter, Sherry L. Jones