Abstract: A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.

Abstract: A shuttering system for a scanning projector having a laser source, a grating light valve light modulator, and a light steering scanner includes a feedback system interconnecting the scanner with the light modulator. The feedback system is configured to deactivate the light modulator in case of scanner malfunction, so as to redirect laser light away from the scanner.

Abstract: A microscopic optical structure controller for providing singular control of individual microscopic optical structures of a microelectromechanical optical device by a multiplexed stream of individual pixel values generated by a pixel value source. The microscopic optical structure controller includes at least one interconnect coupled to the pixel value source for receiving the multiplexed stream of individual pixel values and at least one mapper communicating with the interconnect for extracting individual pixel values from the multiplexed stream and applying the individual pixel values to one or more individual microscopic optical structures according to a configurable mapping. A method and a driver for providing singular control of individual microscopic optical structures of a microelectromechanical optical device are also disclosed.

Abstract: A system and method for polishing an optical fiber with a polishing lap. The system comprises a substrate, an optical fiber disposed on the substrate so as to be outwardly curved, and an electrical conductor disposed over the outward curve of the optical fiber. A voltage source is connected to the electrical conductor, and the polishing lap is configured to initially abrade the electrical conductor to cause severance thereof. The position of the polishing lap when the electrical conductor is severed represents a reference point approximately indicating the surface of the optical fiber. A detector connected to the electrical conductor detects a change in voltage therein, indicating severance of the electrical conductor, and subsequently monitors the polishing depth relative to the reference point.

Abstract: A system and method for polishing an optical fiber with a polishing lap. The system comprises a substrate, an optical fiber disposed on the substrate so as to be outwardly curved, and an electrical conductor disposed over the outward curve of the optical fiber. A voltage source is connected to the electrical conductor, and the polishing lap is configured to initially abrade the electrical conductor to cause severance thereof. The position of the polishing lap when the electrical conductor is severed represents a reference point approximately indicating the surface of the optical fiber. A detector connected to the electrical conductor detects a change in voltage therein, indicating severance of the electrical conductor, and subsequently monitors the polishing depth relative to the reference point.