Patents by Inventor Breton M. Saunders

Breton M. Saunders has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210318738
    Abstract: Methods and apparatus for enhanced power delivery between devices. In one embodiment, the power delivery is enhanced relative to legacy capabilities, and a source device negotiates with a sink device to establish a high-voltage (HV) power contract. In one variant, such HV operation enables power delivery greater than the legacy USB-C standard maximum of 20 V and 100 W. In one implementation, the source, sink, and/or source and sink collectively ensure that multiple criteria relating to power delivery are met for the interface (i.e., source, the sink, and the interposed cable or power delivery medium). Multiple conditions, including enclosure construction compliance and device capabilities, must be cleared to ensure safety while operating beyond standard maximums. If the criteria are met, HV validation is complete, and the source may offer HV operation to the sink to establish the HV contract. Additional fail-safe mechanisms enable the HV contract to discontinue upon triggering.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Applicant: Apple Inc.
    Inventors: Scott A. JACKSON, Alexei E. KOSUT, William O. FERRY, Reese A. SCHREIBER, Breton M. SAUNDERS, Corey LANGE, David G. CONROY, Srivatsav VENKATESAN, Steven P. HIER, Carlos M. CALDERON
  • Publication number: 20210185808
    Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
    Type: Application
    Filed: February 25, 2021
    Publication date: June 17, 2021
    Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
  • Patent number: 10959331
    Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: March 23, 2021
    Assignee: Apple Inc.
    Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
  • Publication number: 20200329559
    Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
    Type: Application
    Filed: June 26, 2020
    Publication date: October 15, 2020
    Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
  • Patent number: 10701802
    Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: June 30, 2020
    Assignee: Apple Inc.
    Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
  • Publication number: 20200084886
    Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
    Type: Application
    Filed: November 15, 2019
    Publication date: March 12, 2020
    Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang
  • Patent number: 10485103
    Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: November 19, 2019
    Assignee: Apple Inc.
    Inventors: Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian, Breton M. Saunders, Christopher A. Schultz, David A. Bolt, Mark J. Beesley, Peter W. Mash, Steven Keating, Chang Liu, Lan Hoang