Abstract: A packaging system for abrasive articles that includes a container portion sized to receive the abrasive articles. The system also includes a lid portion that removably couples to the container portion. The system also includes a rechargeable moisture control feature, housed within the packaging system. The rechargeable moisture control feature removes moisture from an atmosphere within the packaging system. The system also includes a moisture indicator that indicates whether moisture is present within the container portion.

Abstract: A method providing damping during an abrading operation is provided. The method includes removably coupling the abrasive wheel to a hub. The abrasive wheel has an outer circumference and an inner circumference. A layer of abrasive material extends between the inner and outer circumference. The method also includes abrading a worksurface by contacting the abrasive disc to the worksurface. The hub includes a housing and a plurality of damping units within the housing. The plurality of damping units are shaped to reduce vibrations during a grinding operation.

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Abstract: According to various embodiment of the present disclosure, a bonded abrasive article precursor includes a curable composition. The curable composition includes a curative component. The curable composition further includes one or more resins. The curable composition further includes a plurality of shaped abrasive particles. The curable composition is curable in an amount of time in a range of from about 0.1 minutes to about 20 minutes at a temperature of about 25° C. to about 160° C.

Abstract: Various embodiments of the present disclosure provide a bonded abrasive article precursor (100). The bonded abrasive article precursor (100) includes an abrasive layer comprising a plurality of shaped abrasive particles (102) disposed on an adhesive (106) and forming a predetermined pattern.

Abstract: The disclosure relates to, among other things, an abrasive article comprising a plurality of 4D-ceramic structures, wherein the 4D-ceramic structures are made by a method comprising sequentially: at least partially removing a strain from a second strained primary polymer ceramic precursor, comprising a polymeric substrate and ceramic precursor particles dispersed therein, to give a 4-D ceramic precursor comprising a polymeric substrate; and thermolytically removing the polymeric substrate from the 4-D ceramic precursor comprising a polymeric substrate to provide a 4D-ceramic structure.

Abstract: An abrasive wheel maker apparatus comprising: a wheel substrate (710) having a dispensing surface; an abrasive material dispenser (720) to dispose a binder precursor onto a circular section of the dispensing surface and to dispose a plurality of abrasive particles at least partially within the binder precursor; and a rotation device (700) to rotate the dispensing surface relative to the abrasive material dispenser (720) to form a continuous single layer bonded abrasive wheel.

Abstract: According to various embodiment of the present disclosure, a bonded abrasive article precursor includes a curable composition. The curable composition includes a curative component. The curable composition further includes one or more resins. The curable composition further includes a plurality of shaped abrasive particles. The curable composition is curable in an amount of time in a range of from about 0.1 minutes to about 20 minutes at a temperature of about 25° C. to about 160° C.

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Abstract: A curable composition includes a polyamide composition comprising a polyamide. The polyamide comprises a tertiary amide in the backbone thereof and is amine terminated. The curable composition also comprises an epoxy composition that includes an epoxy resin.

Abstract: An air filter including a filter support that supports metal-containing sorbent particles, the sorbent particles comprising a precursor that is a porous siliceous material that has been treated with a surface treatment agent, and a divalent metal incorporated into the siliceous precursor material.

Abstract: Provided are curable compositions that include an epoxy resin; a 9,9-bis(aminophenyl)fluorene or derivative therefrom; and core shell particles, each comprising an elastomeric core and a polymeric outer shell layer coated on the elastomeric core. The core shell particles can be at least partially aggregated with each other, include polymeric intermediate layers between the core and outer shell layers, and/or have a multimodal particle diameter distribution. The curable compositions may also optionally include inorganic sub-micron particles dispersed in the curable composition, the inorganic sub-micron particles having surface-bonded organic groups that compatibilize the inorganic sub-micron particles and the epoxy resin.

Abstract: Metal-containing sorbent materials are provided, methods of making the metal-containing sorbent materials, methods of using the metal-containing sorbent materials, and metal complex-containing composite materials resulting from the sorption of basic, nitrogen-containing compounds on the metal-containing sorbent materials are provided. The sorbent materials are prepared by incorporating divalent metals into a precursor material that is formed by treating a porous siliceous material having mesopores with a silane or disilazane surface treatment agent. The metal-containing sorbent materials can be used to capture basic, nitrogen-containing compounds having a molecular weight no greater than 150 grams/mole.

Abstract: Metal-containing sorbent materials are provided, methods of making the metal-containing sorbent materials, methods of using the metal-containing sorbent materials, and metal complex-containing composite materials resulting from the sorption of basic, nitrogen-containing compounds on the metal-containing sorbent materials are provided. The sorbent materials are prepared by incorporating divalent metals into a precursor material that is formed by treating a porous siliceous material having mesopores with a silane or disilazane surface treatment agent. The metal-containing sorbent materials can be used to capture basic, nitrogen-containing compounds having a molecular weight no greater than 150 grams/mole.

Abstract: A laminate material may include a first flexible layer, and a self-healing composite layer in contact with the first flexible layer. The composite layer includes an elastomer matrix, a plurality of first capsules including a polymerizer, and a corresponding activator for the polymerizer. The laminate material may self-heal when subjected to a puncture or a tear.

Abstract: A reinforced composite material includes a solid polymer matrix, a reinforcing material in the solid polymer matrix, and a first plurality of capsules. The reinforcing material includes a surface. The capsules are on the surface of the reinforcing material, and include a liquid healing agent. The amount of the healing agent of the capsules is at least 0.01 milligrams per square centimeter of the surface area of the reinforcing material.

Abstract: A reinforced composite material includes a solid polymer matrix, a reinforcing material in the solid polymer matrix, and a first plurality of capsules. The reinforcing material includes a surface. The capsules are on the surface of the reinforcing material, and include a liquid healing agent. The amount of the healing agent of the capsules is at least 0.01 milligrams per square centimeter of the surface area of the reinforcing material.

Abstract: A laminate material may include a first flexible layer, and a self-healing composite layer in contact with the first flexible layer. The composite layer includes an elastomer matrix, a plurality of first capsules including a polymerizer, and a corresponding activator for the polymerizer. The laminate material may self-heal when subjected to a puncture or a tear.