Abstract: Systems and methods for activating end effectors used to condition microfeature workpiece polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a rotatable end effector having a conditioning surface configured to condition a microfeature workpiece polishing medium, and a driver coupled to the end effector to rotate the end effector. The driver does not include a flexible, continuous belt coupled to the end effector. For example, the driver can include a motor-driven worm meshed with a worm gear. The system can further include a forcing element coupled to the end effector to apply a force to the end effector that is at least approximately normal to a conditioning surface of the end effector. The forcing element can include a first generally rigid member and a second generally rigid member coupled to the end effector and movable relative to the first generally rigid member to apply the force.

Abstract: Systems and methods for activating end effectors used to condition microfeature workpiece polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a rotatable end effector having a conditioning surface configured to condition a microfeature workpiece polishing medium, and a driver coupled to the end effector to rotate the end effector. The driver does not include a flexible, continuous belt coupled to the end effector. For example, the driver can include a motor-driven worm meshed with a worm gear. The system can further include a forcing element coupled to the end effector to apply a force to the end effector that is at least approximately normal to a conditioning surface of the end effector. The forcing element can include a first generally rigid member and a second generally rigid member coupled to the end effector and movable relative to the first generally rigid member to apply the force.

Abstract: Systems and methods for activating end effectors used to condition microfeature workpiece polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a rotatable end effector having a conditioning surface configured to condition a microfeature workpiece polishing medium, and a driver coupled to the end effector to rotate the end effector. The driver does not include a flexible, continuous belt coupled to the end effector. For example, the driver can include a motor-driven worm meshed with a worm gear. The system can further include a forcing element coupled to the end effector to apply a force to the end effector that is at least approximately normal to a conditioning surface of the end effector. The forcing element can include a first generally rigid member and a second generally rigid member coupled to the end effector and movable relative to the first generally rigid member to apply the force.

Abstract: The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level sensor. The storage tank is connected to a fluid delivery line that delivers planarization fluid to the storage tank through a flow control valve and delivers a regulated flow of planarization fluid to a planarization machine through a flow sensor. A gas supply system is connected to the storage tank to provide system pressurization. Regulation of the fluid flow is achieved by a control system in which the flow sensor and the acoustic fluid level sensor comprise feedback elements in a closed feedback system to independently control the pressure in the storage tank and the fluid admitted by the control valve. In an alternate embodiment, the fluid level sensor is comprised of capacitive proximity sensors located outside the wall of the storage tank.

Abstract: The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level sensor. The storage tank is connected to a fluid delivery line that delivers planarization fluid to the storage tank through a flow control valve and delivers a regulated flow of planarization fluid to a planarization machine through a flow sensor. A gas supply system is connected to the storage tank to provide system pressurization. Regulation of the fluid flow is achieved by a control system in which the flow sensor and the acoustic fluid level sensor comprise feedback elements in a closed feedback system to independently control the pressure in the storage tank and the fluid admitted by the control valve. In an alternate embodiment, the fluid level sensor is comprised of capacitive proximity sensors located outside the wall of the storage tank.

Abstract: The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level sensor. The storage tank is connected to a fluid delivery line that delivers planarization fluid to the storage tank through a flow control valve and delivers a regulated flow of planarization fluid to a planarization machine through a flow sensor. A gas supply system is connected to the storage tank to provide system pressurization. Regulation of the fluid flow is achieved by a control system in which the flow sensor and the acoustic fluid level sensor comprise feedback elements in a closed feedback system to independently control the pressure in the storage tank and the fluid admitted by the control valve. In an alternate embodiment, the fluid level sensor is comprised of capacitive proximity sensors located outside the wall of the storage tank.

Abstract: The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level sensor. The storage tank is connected to a fluid delivery line that delivers planarization fluid to the storage tank through a flow control valve and delivers a regulated flow of planarization fluid to a planarization machine through a flow sensor. A gas supply system is connected to the storage tank to provide system pressurization. Regulation of the fluid flow is achieved by a control system in which the flow sensor and the acoustic fluid level sensor comprise feedback elements in a closed feedback system to independently control the pressure in the storage tank and the fluid admitted by the control valve. In an alternate embodiment, the fluid level sensor is comprised of capacitive proximity sensors located outside the wall of the storage tank.

Abstract: The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level sensor. The storage tank is connected to a fluid delivery line that delivers planarization fluid to the storage tank through a flow control valve and delivers a regulated flow of planarization fluid to a planarization machine through a flow sensor. A gas supply system is connected to the storage tank to provide system pressurization. Regulation of the fluid flow is achieved by a control system in which the flow sensor and the acoustic fluid level sensor comprise feedback elements in a closed feedback system to independently control the pressure in the storage tank and the fluid admitted by the control valve. In an alternate embodiment, the fluid level sensor is comprised of capacitive proximity sensors located outside the wall of the storage tank.