Patents by Inventor Brett BERENS
Brett BERENS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11841692Abstract: A method includes identifying a recipe for depositing layers on a substrate in a processing chamber of a substrate processing system. The recipe comprises iterations of a set of one or more processes, and wherein each iteration of the iterations is for depositing at least one layer of the layers. The method further includes determining changes to parameters for depositing the at least one layer on the substrate. Each of the changes corresponds to a respective iteration of the iterations and is associated with a relative position of a corresponding layer. The layers are to be deposited on one or more substrates based on the recipe and the changes.Type: GrantFiled: September 16, 2022Date of Patent: December 12, 2023Assignee: Applied Materials, Inc.Inventors: Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
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Publication number: 20230014145Abstract: A method includes identifying a recipe for depositing layers on a substrate in a processing chamber of a substrate processing system. The recipe comprises iterations of a set of one or more processes, and wherein each iteration of the iterations is for depositing at least one layer of the layers. The method further includes determining changes to parameters for depositing the at least one layer on the substrate. Each of the changes corresponds to a respective iteration of the iterations and is associated with a relative position of a corresponding layer. The layers are to be deposited on one or more substrates based on the recipe and the changes.Type: ApplicationFiled: September 16, 2022Publication date: January 19, 2023Inventors: Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
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Patent number: 11449026Abstract: A method includes identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system. The recipe includes iterations of a set of processes. Each iteration is for depositing at least one layer. The method further includes determining iteration adjustments to cause uniformity of the layers. Each iteration adjustment corresponds to a respective iteration. The method further includes determining multipliers to cause an adjustment in thickness of one or more layers of the layers. Each multiplier of the multipliers corresponds to a corresponding iteration. The method further includes storing the iteration adjustments and the multipliers as stored iteration adjustments and stored multipliers. The layers are deposited on substrates based on the recipe and the stored iteration adjustments and the stored multipliers.Type: GrantFiled: May 21, 2021Date of Patent: September 20, 2022Assignee: Applied Materials, Inc.Inventors: Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
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Publication number: 20210373523Abstract: A method includes identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system. The recipe includes iterations of a set of processes. Each iteration is for depositing at least one layer. The method further includes determining iteration adjustments to cause uniformity of the layers. Each iteration adjustment corresponds to a respective iteration. The method further includes determining multipliers to cause an adjustment in thickness of one or more layers of the layers. Each multiplier of the multipliers corresponds to a corresponding iteration. The method further includes storing the iteration adjustments and the multipliers as stored iteration adjustments and stored multipliers. The layers are deposited on substrates based on the recipe and the stored iteration adjustments and the stored multipliers.Type: ApplicationFiled: May 21, 2021Publication date: December 2, 2021Inventors: Venkatanarayana Shankaramurthy, Anton Baryshnikov, Brett Berens, Mitesh Sanghvi, Shuang Liu
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Patent number: 11031262Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: GrantFiled: April 2, 2020Date of Patent: June 8, 2021Assignee: Applied Materials, Inc.Inventors: Saptarshi Basu, Jeongmin Lee, Paul Connors, Dale R. Du Bois, Prashant Kumar Kulshreshtha, Karthik Thimmavajjula Narasimha, Brett Berens, Kalyanjit Ghosh, Jianhua Zhou, Ganesh Balasubramanian, Kwangduk Douglas Lee, Juan Carlos Rocha-Alvarez, Hiroyuki Ogiso, Liliya Krivulina, Rick Gilbert, Mohsin Waqar, Venkatanarayana Shankaramurthy, Hari K. Ponnekanti
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Publication number: 20200234982Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: ApplicationFiled: April 2, 2020Publication date: July 23, 2020Inventors: Saptarshi BASU, Jeongmin LEE, Paul CONNORS, Dale R. DU BOIS, Prashant Kumar KULSHRESHTHA, Karthik Thimmavajjula NARASIMHA, Brett BERENS, Kalyanjit GHOSH, Jianhua ZHOU, Ganesh BALASUBRAMANIAN, Kwangduk Douglas LEE, Juan Carlos ROCHA-ALVAREZ, Hiroyuki OGISO, Liliya KRIVULINA, Rick GILBERT, Mohsin WAQAR, Venkatanarayana SHANKARAMURTHY, Hari K. PONNEKANTI
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Patent number: 10636684Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: GrantFiled: August 14, 2019Date of Patent: April 28, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Saptarshi Basu, Jeongmin Lee, Paul Connors, Dale R. Du Bois, Prashant Kumar Kulshreshtha, Karthik Thimmavajjula Narasimha, Brett Berens, Kalyanjit Ghosh, Jianhua Zhou, Ganesh Balasubramanian, Kwangduk Douglas Lee, Juan Carlos Rocha-Alvarez, Hiroyuki Ogiso, Liliya Krivulina, Rick Gilbert, Mohsin Waqar, Venkatanarayana Shankaramurthy, Hari K. Ponnekanti
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Publication number: 20190371630Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: ApplicationFiled: August 14, 2019Publication date: December 5, 2019Inventors: Saptarshi Basu, Jeongmin Lee, Paul Connors, Dale R. Du Bois, Prashant Kumar Kulshreshtha, Karthik Thimmavajjula Narasimha, Brett Berens, Kalyanjit Ghosh, Jianhua Zhou, Ganesh Balasubramanian, Kwangduk Douglas Lee, Juan Carlos Rocha-Alvarez, Hiroyuki Ogiso, Liliya Krivulina, Rick Gilbert, Mohsin Waqar, Venkatanarayana Shankaramurthy, Hari K. Ponnekanti
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Patent number: 10403515Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: GrantFiled: February 2, 2016Date of Patent: September 3, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Saptarshi Basu, Jeongmin Lee, Paul Connors, Dale R. Du Bois, Prashant Kumar Kulshreshtha, Karthik Thimmavajjula Narasimha, Brett Berens, Kalyanjit Ghosh, Jianhua Zhou, Ganesh Balasubramanian, Kwangduk Douglas Lee, Juan Carlos Rocha-Alvarez, Hiroyuki Ogiso, Liliya Krivulina, Rick Gilbert, Mohsin Waqar, Venkatanarayana Shankaramurthy, Hari K. Ponnekanti
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Publication number: 20170092511Abstract: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.Type: ApplicationFiled: February 2, 2016Publication date: March 30, 2017Inventors: Saptarshi BASU, Jeongmin LEE, Paul CONNORS, Dale R. DU BOIS, Prashant Kumar KULSHRESHTHA, Karthik Thimmavajjula NARASIMHA, Brett BERENS, Kalyanjit GHOSH, Jianhua ZHOU, Ganesh BALASUBRAMANIAN, Kwangduk Douglas LEE, Juan Carlos ROCHA-ALVAREZ, Hiroyuki OGISO, Liliya KRIVULINA, Rick GILBERT, Mohsin WAQAR, Venkatanarayana SHANKARAMURTHY, Hari K. PONNEKANTI