Patents by Inventor Brett D. Lowe

Brett D. Lowe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10658380
    Abstract: In an example, a method of forming a stacked memory array includes forming a stack of alternating first and second dielectrics, forming a termination structure through the stack, the termination structure comprising a dielectric liner around a conductor, forming a set of contacts concurrently with forming the termination structure, forming a third dielectric over an upper surface of the stack and an upper surface of the termination structure, forming a first opening through the third dielectric and the stack between first and second groups of semiconductor structures so that the first opening exposes an upper surface of the conductor, and removing the conductor from the termination structure to form a second opening lined with the dielectric liner. In some examples, the dielectric liner can include a rectangular or a triangular tab or a pair of prongs that can have a rectangular profile or that can be tapered.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: May 19, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Matthew J. King, Anilkumar Chandolu, Indra V. Chary, Darwin A. Clampitt, Gordon Haller, Thomas George, Brett D. Lowe, David A. Daycock
  • Publication number: 20200119036
    Abstract: A termination opening can be formed through the stack alternating dielectrics concurrently with forming contact openings through the stack. A termination structure can be formed in the termination opening. An additional opening can be formed through the termination structure and through the stack between groups of semiconductor structures that pass through the stack. In another example, an opening can be formed through the stack so that a first segment of the opening is between groups of semiconductor structures in a first region of the stack and a second segment of the opening is in a second region of the stack that does not include the groups of semiconductor structures. A material can be formed in the second segment so that the first segment terminates at the material. In some instances, the material can be implanted in the dielectrics in the second region through the second segment.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 16, 2020
    Inventors: Matthew J. King, Anilkumar Chandolu, Indra V. Chary, Darwin A. Clampitt, Gordon Haller, Thomas George, Brett D. Lowe, David A. Daycock
  • Publication number: 20200119040
    Abstract: In an example, a method of forming a stacked memory array includes forming a stack of alternating first and second dielectrics, forming a termination structure through the stack, the termination structure comprising a dielectric liner around a conductor, forming a set of contacts concurrently with forming the termination structure, forming a third dielectric over an upper surface of the stack and an upper surface of the termination structure, forming a first opening through the third dielectric and the stack between first and second groups of semiconductor structures so that the first opening exposes an upper surface of the conductor, and removing the conductor from the termination structure to form a second opening lined with the dielectric liner. In some examples, the dielectric liner can include a rectangular or a triangular tab or a pair of prongs that can have a rectangular profile or that can be tapered.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 16, 2020
    Inventors: Matthew J. King, Anilkumar Chandolu, Indra V. Chary, Darwin A. Clampitt, Gordon Haller, Thomas George, Brett D. Lowe, David A. Daycock
  • Patent number: 10541252
    Abstract: Some embodiments include a memory array which has a vertical stack of alternating insulative levels and wordline levels. The wordline levels have terminal ends corresponding to control gate regions. Charge-trapping material is along the control gate regions of the wordline levels and not along the insulative levels. The charge-trapping material is spaced from the control gate regions by charge-blocking material. Channel material extends vertically along the stack and is laterally spaced from the charge-trapping material by dielectric material. Some embodiments include methods of forming NAND memory arrays.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: January 21, 2020
    Assignee: Micron Technology, Inc.
    Inventors: David Daycock, Richard J. Hill, Christopher Larsen, Woohee Kim, Justin B. Dorhout, Brett D. Lowe, John D. Hopkins, Qian Tao, Barbara L. Casey
  • Publication number: 20190386021
    Abstract: A method of forming a semiconductor device structure comprises forming a stack structure comprising stacked tiers. Each of the stacked tiers comprises a first structure comprising a first material and a second structure comprising a second, different material longitudinally adjacent the first structure. A patterned hard mask structure is formed over the stack structure. Dielectric structures are formed within openings in the patterned hard mask structure. A photoresist structure is formed over the dielectric structures and the patterned hard mask structure. The photoresist structure, the dielectric structures, and the stack structure are subjected to a series of material removal processes to form apertures extending to different depths within the stack structure. Dielectric structures are formed over side surfaces of the stack structure within the apertures. Conductive contact structures are formed to longitudinally extend to bottoms of the apertures.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Roger W. Lindsay, Michael A. Smith, Brett D. Lowe
  • Patent number: 10446579
    Abstract: A method of forming a semiconductor device structure comprises forming a stack structure comprising stacked tiers. Each of the stacked tiers comprises a first structure comprising a first material and a second structure comprising a second, different material longitudinally adjacent the first structure. A patterned hard mask structure is formed over the stack structure. Dielectric structures are formed within openings in the patterned hard mask structure. A photoresist structure is formed over the dielectric structures and the patterned hard mask structure. The photoresist structure, the dielectric structures, and the stack structure are subjected to a series of material removal processes to form apertures extending to different depths within the stack structure. Dielectric structures are formed over side surfaces of the stack structure within the apertures. Conductive contact structures are formed to longitudinally extend to bottoms of the apertures.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: October 15, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Roger W. Lindsay, Michael A. Smith, Brett D. Lowe
  • Publication number: 20190267396
    Abstract: Some embodiments include a memory array which has a vertical stack of alternating insulative levels and wordline levels. The wordline levels have terminal ends corresponding to control gate regions. Charge-trapping material is along the control gate regions of the wordline levels and not along the insulative levels. The charge-trapping material is spaced from the control gate regions by charge-blocking material. Channel material extends vertically along the stack and is laterally spaced from the charge-trapping material by dielectric material. Some embodiments include methods of forming NAND memory arrays.
    Type: Application
    Filed: May 13, 2019
    Publication date: August 29, 2019
    Applicant: Micron Technology, Inc.
    Inventors: David Daycock, Richard J. Hill, Christopher Larsen, Woohee Kim, Justin B. Dorhout, Brett D. Lowe, John D. Hopkins, Qian Tao, Barbara L. Casey
  • Publication number: 20190229126
    Abstract: Some embodiments include a method of forming vertically-stacked memory cells. An opening is formed through a stack of alternating insulative and conductive levels. Cavities are formed to extend into the conductive levels along sidewalls of the opening. At least one of the cavities is formed to be shallower than one or more others of the cavities. Charge-blocking dielectric and charge-storage structures are formed within the cavities. Some embodiments include an integrated structure having a stack of alternating insulative and conductive levels. Cavities extend into the conductive levels. At least one of the cavities is shallower than one or more others of the cavities by at least about 2 nanometers. Charge-blocking dielectric is within the cavities. Charge-storage structures are within the cavities.
    Type: Application
    Filed: April 1, 2019
    Publication date: July 25, 2019
    Applicant: Micron Technology, Inc.
    Inventors: Hongbin Zhu, Gordon A. Haller, Charles H. Dennison, Anish A. Khandekar, Brett D. Lowe, Lining He, Brian Cleereman
  • Patent number: 10304853
    Abstract: Some embodiments include a memory array which has a vertical stack of alternating insulative levels and wordline levels. The wordline levels have terminal ends corresponding to control gate regions. Charge-trapping material is along the control gate regions of the wordline levels and not along the insulative levels. The charge-trapping material is spaced from the control gate regions by charge-blocking material. Channel material extends vertically along the stack and is laterally spaced from the charge-trapping material by dielectric material. Some embodiments include methods of forming NAND memory arrays.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: May 28, 2019
    Assignee: Micron Technology, Inc.
    Inventors: David Daycock, Richard J. Hill, Christopher Larsen, Woohee Kim, Justin B. Dorhout, Brett D. Lowe, John D. Hopkins, Qian Tao, Barbara L. Casey
  • Patent number: 10269819
    Abstract: Some embodiments include a method of forming vertically-stacked memory cells. An opening is formed through a stack of alternating insulative and conductive levels. Cavities are formed to extend into the conductive levels along sidewalls of the opening. At least one of the cavities is formed to be shallower than one or more others of the cavities. Charge-blocking dielectric and charge-storage structures are formed within the cavities. Some embodiments include an integrated structure having a stack of alternating insulative and conductive levels. Cavities extend into the conductive levels. At least one of the cavities is shallower than one or more others of the cavities by at least about 2 nanometers. Charge-blocking dielectric is within the cavities. Charge-storage structures are within the cavities.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: April 23, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Hongbin Zhu, Gordon A. Haller, Charles H. Dennison, Anish A. Khandekar, Brett D. Lowe, Lining He, Brian Cleereman
  • Publication number: 20190096906
    Abstract: A method of forming a semiconductor device structure comprises forming a stack structure comprising stacked tiers. Each of the stacked tiers comprises a first structure comprising a first material and a second structure comprising a second, different material longitudinally adjacent the first structure. A patterned hard mask structure is formed over the stack structure. Dielectric structures are formed within openings in the patterned hard mask structure. A photoresist structure is formed over the dielectric structures and the patterned hard mask structure. The photoresist structure, the dielectric structures, and the stack structure are subjected to a series of material removal processes to form apertures extending to different depths within the stack structure. Dielectric structures are formed over side surfaces of the stack structure within the apertures. Conductive contact structures are formed to longitudinally extend to bottoms of the apertures.
    Type: Application
    Filed: November 7, 2018
    Publication date: March 28, 2019
    Inventors: Roger W. Lindsay, Michael A. Smith, Brett D. Lowe
  • Publication number: 20180342530
    Abstract: A method of forming a semiconductor device structure comprises forming a stack structure comprising stacked tiers. Each of the stacked tiers comprises a first structure comprising a first material and a second structure comprising a second, different material longitudinally adjacent the first structure. A patterned hard mask structure is formed over the stack structure. Dielectric structures are formed within openings in the patterned hard mask structure. A photoresist structure is formed over the dielectric structures and the patterned hard mask structure. The photoresist structure, the dielectric structures, and the stack structure are subjected to a series of material removal processes to form apertures extending to different depths within the stack structure. Dielectric structures are formed over side surfaces of the stack structure within the apertures. Conductive contact structures are formed to longitudinally extend to bottoms of the apertures.
    Type: Application
    Filed: May 26, 2017
    Publication date: November 29, 2018
    Inventors: Roger W. Lindsay, Michael A. Smith, Brett D. Lowe
  • Patent number: 10141330
    Abstract: A method of forming a semiconductor device structure comprises forming a stack structure comprising stacked tiers. Each of the stacked tiers comprises a first structure comprising a first material and a second structure comprising a second, different material longitudinally adjacent the first structure. A patterned hard mask structure is formed over the stack structure. Dielectric structures are formed within openings in the patterned hard mask structure. A photoresist structure is formed over the dielectric structures and the patterned hard mask structure. The photoresist structure, the dielectric structures, and the stack structure are subjected to a series of material removal processes to form apertures extending to different depths within the stack structure. Dielectric structures are formed over side surfaces of the stack structure within the apertures. Conductive contact structures are formed to longitudinally extend to bottoms of the apertures.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: November 27, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Roger W. Lindsay, Michael A. Smith, Brett D. Lowe
  • Publication number: 20180323212
    Abstract: Some embodiments include a memory array which has a vertical stack of alternating insulative levels and wordline levels. The wordline levels have terminal ends corresponding to control gate regions. Charge-trapping material is along the control gate regions of the wordline levels and not along the insulative levels. The charge-trapping material is spaced from the control gate regions by charge-blocking material. Channel material extends vertically along the stack and is laterally spaced from the charge-trapping material by dielectric material. Some embodiments include methods of forming NAND memory arrays.
    Type: Application
    Filed: July 10, 2018
    Publication date: November 8, 2018
    Applicant: Micron Technology, Inc.
    Inventors: David Daycock, Richard J. Hill, Christopher Larsen, Woohee Kim, Justin B. Dorhout, Brett D. Lowe, John D. Hopkins, Qian Tao, Barbara L. Casey
  • Patent number: 10083981
    Abstract: Some embodiments include a memory array which has a vertical stack of alternating insulative levels and wordline levels. The wordline levels have terminal ends corresponding to control gate regions. Charge-trapping material is along the control gate regions of the wordline levels and not along the insulative levels. The charge-trapping material is spaced from the control gate regions by charge-blocking material. Channel material extends vertically along the stack and is laterally spaced from the charge-trapping material by dielectric material. Some embodiments include methods of forming NAND memory arrays.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: September 25, 2018
    Assignee: Micron Technology, Inc.
    Inventors: David Daycock, Richard J. Hill, Christopher Larsen, Woohee Kim, Justin B. Dorhout, Brett D. Lowe, John D. Hopkins, Qian Tao, Barbara L. Casey
  • Publication number: 20180219021
    Abstract: Some embodiments include a memory array which has a vertical stack of alternating insulative levels and wordline levels. The wordline levels have terminal ends corresponding to control gate regions. Charge-trapping material is along the control gate regions of the wordline levels and not along the insulative levels. The charge-trapping material is spaced from the control gate regions by charge-blocking material. Channel material extends vertically along the stack and is laterally spaced from the charge-trapping material by dielectric material. Some embodiments include methods of forming NAND memory arrays.
    Type: Application
    Filed: February 1, 2017
    Publication date: August 2, 2018
    Inventors: David Daycock, Richard J. Hill, Christopher Larsen, Woohee Kim, Justin B. Dorhout, Brett D. Lowe, John D. Hopkins, Qian Tao, Barbara L. Casey
  • Publication number: 20170229470
    Abstract: Some embodiments include a method of forming vertically-stacked memory cells. An opening is formed through a stack of alternating insulative and conductive levels. Cavities are formed to extend into the conductive levels along sidewalls of the opening. At least one of the cavities is formed to be shallower than one or more others of the cavities. Charge-blocking dielectric and charge-storage structures are formed within the cavities. Some embodiments include an integrated structure having a stack of alternating insulative and conductive levels. Cavities extend into the conductive levels. At least one of the cavities is shallower than one or more others of the cavities by at least about 2 nanometers. Charge-blocking dielectric is within the cavities. Charge-storage structures are within the cavities.
    Type: Application
    Filed: April 25, 2017
    Publication date: August 10, 2017
    Inventors: Hongbin Zhu, Gordon A. Haller, Charles H. Dennison, Anish A. Khandekar, Brett D. Lowe, Lining He, Brian Cleereman
  • Patent number: 9659949
    Abstract: Some embodiments include a method of forming vertically-stacked memory cells. An opening is formed through a stack of alternating insulative and conductive levels. Cavities are formed to extend into the conductive levels along sidewalls of the opening. At least one of the cavities is formed to be shallower than one or more others of the cavities. Charge-blocking dielectric and charge-storage structures are formed within the cavities. Some embodiments include an integrated structure having a stack of alternating insulative and conductive levels. Cavities extend into the conductive levels. At least one of the cavities is shallower than one or more others of the cavities by at least about 2 nanometers. Charge-blocking dielectric is within the cavities. Charge-storage structures are within the cavities.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: May 23, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Hongbin Zhu, Gordon A. Haller, Charles H. Dennison, Anish A. Khandekar, Brett D. Lowe, Lining He, Brian Cleereman
  • Publication number: 20160284719
    Abstract: Some embodiments include a method of forming vertically-stacked memory cells. An opening is formed through a stack of alternating insulative and conductive levels. Cavities are formed to extend into the conductive levels along sidewalls of the opening. At least one of the cavities is formed to be shallower than one or more others of the cavities. Charge-blocking dielectric and charge-storage structures are formed within the cavities. Some embodiments include an integrated structure having a stack of alternating insulative and conductive levels. Cavities extend into the conductive levels. At least one of the cavities is shallower than one or more others of the cavities by at least about 2 nanometers. Charge-blocking dielectric is within the cavities. Charge-storage structures are within the cavities.
    Type: Application
    Filed: March 23, 2015
    Publication date: September 29, 2016
    Inventors: Hongbin Zhu, Gordon A. Haller, Charles H. Dennison, Anish A. Khandekar, Brett D. Lowe, Lining He, Brian Cleereman
  • Patent number: 8575716
    Abstract: A method of forming memory array and peripheral circuitry isolation includes chemical vapor depositing a silicon dioxide-comprising liner over sidewalls of memory array circuitry isolation trenches and peripheral circuitry isolation trenches formed in semiconductor material. Dielectric material is flowed over the silicon dioxide-comprising liner to fill remaining volume of the array isolation trenches and to form a dielectric liner over the silicon dioxide-comprising liner in at least some of the peripheral isolation trenches. The dielectric material is furnace annealed at a temperature no greater than about 500° C. The annealed dielectric material is rapid thermal processed to a temperature no less than about 800° C. A silicon dioxide-comprising material is chemical vapor deposited over the rapid thermal processed dielectric material to fill remaining volume of said at least some peripheral isolation trenches.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: November 5, 2013
    Assignee: Micron Technology, Inc.
    Inventors: James Mathew, Brett D. Lowe, Yunjun Ho, H. Jim Fulford, Jie Sun, Zhaoli Sun