Patents by Inventor Brett E. McGrath

Brett E. McGrath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
    Patent number: 6926589
    Abstract: The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: August 9, 2005
    Assignee: ASM Nutool, Inc.
    Inventors: Douglas W. Young, Brett E. McGrath, Yuchun Wang
  • Advanced chemical mechanical polishing system with smart endpoint detection
    Patent number: 6857947
    Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: February 22, 2005
    Assignee: ASM NuTool, Inc
    Inventors: Yuchun Wang, Bernard M. Frey, Bulent M. Basol, Homayoun Talieh, Douglas W. Young, Brett E. McGrath, Mukesh Desai, Efrain Velazquez, Tuan Truong
  • Advanced chemical mechanical polishing system with smart endpoint detection
    Publication number: 20040023606
    Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.
    Type: Application
    Filed: January 17, 2003
    Publication date: February 5, 2004
    Inventors: Yuchun Wang, Bernard M. Frey, Bulent M. Basol, Homayoun Talieh, Douglas W. Young, Brett E. McGrath, Mukesh Desai, Efrain Velazquez, Tuan Truong
  • Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
    Publication number: 20030181143
    Abstract: The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.
    Type: Application
    Filed: March 22, 2002
    Publication date: September 25, 2003
    Inventors: Douglas W. Young, Brett E. McGrath, Yuchun Wang