Abstract: An apparatus for use with a digital micromirror device includes a hinge layer that is disposed outwardly from a substrate. The hinge layer including a hinge that is capable of at least partially supporting a micromirror that is disposed outwardly from the hinge. In one particular embodiment, the hinge and the substrate are separated by a first air gap. The device also including a first hinge support that is disposed outwardly from the substrate and inwardly from at least a portion of the hinge layer. The first hinge support being capable of transmitting a voltage to the hinge. At least a portion of the hinge support coupled to at least the portion of the hinge layer. In one particular embodiment, the first hinge support is formed in a process step that is different than a process step that forms the hinge layer.

Abstract: An apparatus for use with a digital micromirror device includes a hinge layer that is disposed outwardly from a substrate. The hinge layer including a hinge that is capable of at least partially supporting a micromirror that is disposed outwardly from the hinge. In one particular embodiment, the hinge and the substrate are separated by a first air gap. The device also including a first hinge support that is disposed outwardly from the substrate and inwardly from at least a portion of the hinge layer. The first hinge support being capable of transmitting a voltage to the hinge. At least a portion of the hinge support coupled to at least the portion of the hinge layer. In one particular embodiment, the first hinge support is formed in a process step that is different than a process step that forms the hinge layer.

Abstract: An apparatus for use with a digital micro-mirror 100 includes a hinge 116 disposed outwardly from a substrate 102. The hinge 116 is capable of at least partially supporting a micro-mirror 104 disposed outwardly from the hinge 116. The micro-mirror 104 is capable of being selectively transitioned between an on-state position and an off-state position. In one particular embodiment, the hinge 116 comprises a substantially flat profile for at least a portion of the hinge 116 disposed between a first hinge post 108 of the hinge 116 and a mid-point of the hinge 116. The apparatus also includes a plurality of process control voids formed within a conductive layer 120 disposed inwardly from the hinge 116. In one particular embodiment, the substantially flat profile is at least partially created from the plurality of process control voids.

Abstract: A method of tilting a micromirror includes providing a substrate, a sloped electrode outwardly from the substrate, and a sloped electrode positioning system outwardly from the substrate. The method also includes applying, by the sloped electrode positioning system, forces sufficient to position the sloped electrode in an orientation that slopes away from the substrate.

Abstract: A method of tilting a micromirror includes providing a substrate, a sloped electrode outwardly from the substrate, and a sloped electrode positioning system outwardly from the substrate. The method also includes applying, by the sloped electrode positioning system, forces sufficient to position the sloped electrode in an orientation that slopes away from the substrate.

Abstract: A method of tilting a micromirror includes providing a substrate, a sloped electrode outwardly from the substrate, and a sloped electrode positioning system outwardly from the substrate. The method also includes applying, by the sloped electrode positioning system, forces sufficient to position the sloped electrode in an orientation that slopes away from the substrate.

Abstract: A MEMS device includes a hinge that is disposed outwardly from a substrate and capable of at least partially supporting a conductor that is disposed outwardly from the hinge. The conductor being capable of pivoting about a first axis. The device also includes one or more electrostatic fins that are disposed inwardly from and in contact with the conductor. The one or more electrostatic fins being disposed substantially along a second axis that is different than the first axis. The MEMS device further includes one or more electrodes that are formed outwardly from the substrate and inwardly from the conductor. The one or more electrodes being separated from the conductor by a first air gap. The one or more electrodes also being separated from the one or more electrostatic fins by a second air gap that is different than the first air gap.

Abstract: An apparatus for use with a digital micro-mirror 100 includes a hinge 116 disposed outwardly from a substrate 102. The hinge 116 is capable of at least partially supporting a micro-mirror 104 disposed outwardly from the hinge 116. The micro-mirror 104 is capable of being selectively transitioned between an on-state position and an off-state position. In one particular embodiment, the hinge 116 comprises a substantially flat profile for at least a portion of the hinge 116 disposed between a first hinge post 108 of the hinge 116 and a mid-point of the hinge 116. The apparatus also includes a plurality of process control voids formed within a conductive layer 120 disposed inwardly from the hinge 116. In one particular embodiment, the substantially flat profile is at least partially created from the plurality of process control voids.

Abstract: A method of tilting a micromirror includes providing a substrate, a sloped electrode outwardly from the substrate, and a sloped electrode positioning system outwardly from the substrate. The method also includes applying, by the sloped electrode positioning system, forces sufficient to position the sloped electrode in an orientation that slopes away from the substrate.

Abstract: An apparatus for use with a digital micromirror device includes a hinge layer that is disposed outwardly from a substrate. The hinge layer including a hinge that is capable of at least partially supporting a micromirror that is disposed outwardly from the hinge. In one particular embodiment, the hinge and the substrate are separated by a first air gap. The device also including a first hinge support that is disposed outwardly from the substrate and inwardly from at least a portion of the hinge layer. The first hinge support being capable of transmitting a voltage to the hinge. At least a portion of the hinge support coupled to at least the portion of the hinge layer. In one particular embodiment, the first hinge support is formed in a process step that is different than a process step that forms the hinge layer.

Abstract: A MEMS device includes a hinge that is disposed outwardly from a substrate and capable of at least partially supporting a conductor that is disposed outwardly from the hinge. The conductor being capable of pivoting about a first axis. The device also includes one or more electrostatic fins that are disposed inwardly from and in contact with the conductor. The one or more electrostatic fins being disposed substantially along a second axis that is different than the first axis. The MEMS device further includes one or more electrodes that are formed outwardly from the substrate and inwardly from the conductor. The one or more electrodes being separated from the conductor by a first air gap. The one or more electrodes also being separated from the one or more electrostatic fins by a second air gap that is different than the first air gap.

Abstract: An apparatus for use with a digital micro-mirror includes a hinge disposed outwardly from a substrate. The hinge is capable of at least partially supporting a micro-mirror disposed outwardly from the hinge. The micro-mirror is capable of being selectively transitioned between an on-state position and an off-state position. In one particular embodiment, the hinge comprises a substantially flat profile for at least a portion of the hinge disposed between a first hinge post of the hinge and a mid-point of the hinge. The apparatus also includes a plurality of process control voids formed within a conductive layer disposed inwardly from the hinge. In one particular embodiment, the substantially flat profile is at least partially created from the plurality of process control voids.

Abstract: A system and method of providing a micromirror pixel 400 that is highly resistant to bright failure states. The micromirror 400 uses an asymmetric yoke 402 to ensure the mirror is only attracted to the address electrode in one rotation direction. The landing mechanism on the other side of the torsion binge axis also is altered to allow the pixel to over rotate in the “off” direction. The over rotation ensures that light reflected by the mirror when in the off direction will miss the projection lens pupil, allowing the corresponding pixel to remain dark in both an operational and failed state.

Abstract: An apparatus for use with a digital micro-mirror includes a hinge disposed outwardly from a substrate and capable of at least partially supporting a micro-mirror disposed outwardly from the hinge. The micro-mirror capable of being selectively transitioned between an on-state position and an off-state position based at least in part on a bias voltage received by a conductive conduit. The apparatus also includes a conductive layer disposed inwardly from the at least one micro-mirror. In one particular embodiment, the conductive layer enables a conductive path for the bias voltage substantially inwardly from a periphery of the micro-mirror.

Abstract: An apparatus for use with a digital micro-mirror includes a hinge disposed outwardly from a substrate and capable of at least partially supporting a micro-mirror disposed outwardly from the hinge. The micro-mirror capable of being selectively transitioned between an on-state position and an off-state position based at least in part on a bias voltage received by a conductive conduit. The apparatus also includes a conductive layer disposed inwardly from the at least one micro-mirror. In one particular embodiment, the conductive layer enables a conductive path for the bias voltage substantially inwardly from a periphery of the micro-mirror.

Abstract: An apparatus for use with a digital micro-mirror includes a hinge disposed outwardly from a substrate. The hinge is capable of at least partially supporting a micro-mirror disposed outwardly from the hinge. The micro-mirror is capable of being selectively transitioned between an on-state position and an off-state position. In one particular embodiment, the hinge comprises a substantially flat profile for at least a portion of the hinge disposed between a first hinge post of the hinge and a mid-point of the hinge. The apparatus also includes a plurality of process control voids formed within a conductive layer disposed inwardly from the hinge. In one particular embodiment, the substantially flat profile is at least partially created from the plurality of process control voids.

Abstract: A system and method of providing a micromirror pixel 400 that is highly resistant to bright failure states. The micromirror 400 uses an asymmetric yoke 402 to ensure the mirror is only attracted to the address electrode in one rotation direction. The landing mechanism on the other side of the torsion binge axis also is altered to allow the pixel to over rotate in the “off” direction. The over rotation ensures that light reflected by the mirror when in the off direction will miss the projection lens pupil, allowing the corresponding pixel to remain dark in both an operational and failed state.

Abstract: A system and method of providing a micromirror pixel 400 that is highly resistant to bright failure states. The micromirror 400 uses an asymmetric yoke 402 to ensure the mirror is only attracted to the address electrode in one rotation direction. The landing mechanism on the other side of the torsion binge axis also is altered to allow the pixel to over rotate in the “off” direction. The over rotation ensures that light reflected by the mirror when in the off direction will miss the projection lens pupil, allowing the corresponding pixel to remain dark in both an operational and failed state.