Patents by Inventor Brett Michael Dunn Sawyer

Brett Michael Dunn Sawyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240159979
    Abstract: A system includes a housing having a front panel, a substrate that is positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 16, 2024
    Inventors: Peter Johannes Winzer, Peter James Pupalaikis, Brett Michael Dunn Sawyer, Ron Zhang, Clinton Randy Giles
  • Publication number: 20240097796
    Abstract: A system includes a first chiplet, a second chiplet, an electronic amplification module, and a converter module. The first chiplet includes, e.g., a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, an application specific integrated circuit (ASIC), or a data storage device. The second chiplet includes a photonic module having, e.g., optical switches, optical couplers, optical routers, optical splitters, optical multiplexers, optical demultiplexers, optical filters, optical modulators, optical phase shifters, lasers, optical amplifiers, optical-to-electrical signal converters, or electrical-to-optical signal converters. The electronic amplification module includes, e.g., a driver amplifier or a transimpedance amplifier, and configured to process electrical signals sent to or from the photonic module.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Inventors: Peter Johannes Winzer, Brett Michael Dunn Sawyer, Guilhem de Valicourt, Jonathan Proesel, Marco Lamponi
  • Publication number: 20240064922
    Abstract: A system includes a housing and a first circuit board positioned inside the housing. The housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel, and a rear panel. The front panel is at an angle relative to the bottom panel in which the angle is in a range from 30 to 150°. The first circuit board has a length, a width, and a thickness, in which the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30 to 150°. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 22, 2024
    Inventors: Peter Johannes Winzer, Brett Michael Dunn Sawyer, Peter James Pupalaikis, Clinton Randy Giles, Guilhem de Valicourt
  • Patent number: 11895798
    Abstract: A system includes a housing and a first circuit board positioned inside the housing. The housing has top, bottom, left side, right side, front, and rear panels. The first circuit board has a length, a width, and a thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: February 6, 2024
    Assignee: Nubis Communications, Inc.
    Inventors: Peter Johannes Winzer, Brett Michael Dunn Sawyer, Peter James Pupalaikis, Clinton Randy Giles, Guilhem de Valicourt
  • Publication number: 20240036254
    Abstract: A system includes a wafer-scale processing module that has an array of data processors. Optical input/output modules are provided near edges of the wafer-scale processing module. Each optical input/output module includes an array of photonic integrated circuits that convert optical signals received from optical links to electrical signals that are transmitted to the data processors, and convert electrical signals received from the data processors to optical signals that are output to the optical links.
    Type: Application
    Filed: March 28, 2023
    Publication date: February 1, 2024
    Inventors: Peter Johannes Winzer, Peter James Pupalaikis, Brett Michael Dunn Sawyer, Karen Liu
  • Publication number: 20230380095
    Abstract: A system includes a housing and a first circuit board positioned inside the housing. The housing has top, bottom, left side, right side, front, and rear panels. The first circuit board has a length, a width, and a thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.
    Type: Application
    Filed: February 24, 2023
    Publication date: November 23, 2023
    Inventors: Peter Johannes Winzer, Brett Michael Dunn Sawyer, Ron Zhang, Peter James Pupalaikis, Clinton Randy Giles, Guilhem de Valicourt, Jonathan Proesel
  • Publication number: 20230358979
    Abstract: A system includes a housing having a front panel, a substrate that is positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 9, 2023
    Inventors: Peter Johannes Winzer, Peter James Pupalaikis, Brett Michael Dunn Sawyer, Ron Zhang, Clinton Randy Giles
  • Publication number: 20230258873
    Abstract: A system includes a housing that has a front panel; a substrate that is positioned at a distance from the front panel, in which a data processor is mounted on the substrate; and a pluggable module. The pluggable module includes a co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector. The co-packaged optical module is configured to receive optical signals from the first optical connector, generate electrical signals based on the received optical signals, and transmit the electrical signals to the data processor.
    Type: Application
    Filed: March 14, 2023
    Publication date: August 17, 2023
    Inventors: Peter James Pupalaikis, Ron Zhang, Brett Michael Dunn Sawyer, Clinton Randy Giles, Peter Johannes Winzer
  • Publication number: 20230209761
    Abstract: A system includes a housing and a first circuit board positioned inside the housing. The housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel, and a rear panel. The front panel is at an angle relative to the bottom panel in which the angle is in a range from 30 to 150°. The first circuit board has a length, a width, and a thickness, in which the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30 to 150°. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°.
    Type: Application
    Filed: February 24, 2023
    Publication date: June 29, 2023
    Inventors: Peter Johannes Winzer, Brett Michael Dunn Sawyer, Ron Zhang, Peter James Pupalaikis, Clinton Randy Giles, Guilhem de Valicourt
  • Publication number: 20230176304
    Abstract: A system includes a substrate on which a data processor and a connector block are mounted. The connector block has a first array of electrical connectors on a first surface, and a second array of electrical conducts on a second surface that is oriented at an angle between 45° to 135° relative to a main surface of the substrate. At least a portion of the first array of electrical connectors are electrically coupled to the data processor, and the second array of electrical contacts are electrically connected to the electrical contacts of a pluggable module. The pluggable module includes an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector.
    Type: Application
    Filed: January 30, 2023
    Publication date: June 8, 2023
    Inventors: Peter Johannes Winzer, Peter James Pupalaikis, Brett Michael Dunn Sawyer
  • Publication number: 20230161109
    Abstract: A system includes a housing that has a front panel; a substrate that is positioned at a distance from the front panel, in which a data processor is mounted on the substrate; and a pluggable module. The pluggable module includes a co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector. The co-packaged optical module is configured to receive optical signals from the first optical connector, generate electrical signals based on the received optical signals, and transmit the electrical signals to the data processor.
    Type: Application
    Filed: September 16, 2022
    Publication date: May 25, 2023
    Inventors: Peter James Pupalaikis, Ron Zhang, Brett Michael Dunn Sawyer, Clinton Randy Giles, Peter Johannes Winzer
  • Publication number: 20230018654
    Abstract: A system includes a housing having a front panel, a substrate that is positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.
    Type: Application
    Filed: June 16, 2022
    Publication date: January 19, 2023
    Inventors: Peter Johannes Winzer, Peter James Pupalaikis, Brett Michael Dunn Sawyer, Ron Zhang, Clinton Randy Giles
  • Publication number: 20220264759
    Abstract: An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45° to 90°.
    Type: Application
    Filed: November 19, 2021
    Publication date: August 18, 2022
    Inventors: Brett Michael Dunn Sawyer, Ron Zhang, Peter James Pupalaikis, Peter Johannes Winzer, Clinton Randy Giles, Guilhem de Valicourt