Abstract: An apparatus or system for handling and processing of substrates, more specifically electro-chemically active metal substrates, including a bath or dipping station having an autodepositable coating composition. In one embodiment, the apparatus is a square transfer apparatus having a plurality of stations including at least one metal pretreatment or cleaning station, and at least one autodepositable coating composition station. An operation as performed at each station is completed within a predetermined unit cycle time. A method for utilizing a square transfer apparatus including at least one step comprising coating a substrate with an autodepositable coating composition at an autodeposition station is disclosed.

Abstract: What is disclosed is a no-rinse autodeposition process to dip-apply a metal part in an aqueous resin coating bath with an immersion time and, wherein the removal rate of the dipped part is kept equal or below drainage rate of mobile liquid portion, such that upon removal of the part, drip edge formation is minimized and a DFT is maintained within acceptable tolerance levels.

Abstract: What is disclosed is a no-rinse autodeposition process to dip-apply a metal part in an aqueous resin coating bath with an immersion time and, wherein the removal rate of the dipped part is kept equal or below drainage rate of mobile liquid portion, such that upon removal of the part, drip edge formation is minimized and a DFT is maintained within acceptable tolerance levels.