Abstract: A metal substrate with insulated vias (MSIV) has a metallic layer with through-holes defined through a thickness of the layer, a dielectric layer formed on part of the surface of the metallic layer and extending to cover internal walls of the through-hole, a conductive material extending through the insulated through-hole to form an insulated via, and an electrical circuit formed on a portion of the dielectric layer in thermal and/or electrical contact with the conductive via. The dielectric layer is a dielectric nanoceramic layer having an equiaxed crystalline structure with an average grain size of 500 nanometres or less, a thickness of between 0.1 and 100 micrometres, a dielectric strength of greater than 20 KV mm?1, and a thermal conductivity of greater than 3 W/mK. Such a MSIV can be used as an electronic substrate to support devices such as power, microwave, optoelectronic, solid-state lighting and thermoelectric devices.

Abstract: A thermal management circuit material comprises a thermally conductive metallic core substrate having at least one through-hole via, non-metallic dielectric layers deposited on both sides of the metallic core substrate and on the containing walls of the through-hole via, electrically conductive metal layers on the non-metallic dielectric layers and an electrically conductive metal-containing core element filling the insulated through-hole via connecting at least a portion of each of the electrically conductive metal layers. Also disclosed are methods of making such circuit materials, comprising forming non-metallic dielectric layers by vapor deposition of a non-metallic material, for example by reacting an oxygen-containing precursor with an aluminum containing precursor and/or reacting a nitrogen-containing precursor with an aluminum or boron containing precursor on the surface of the metallic core substrate.

Abstract: A thermal management circuit material comprises a thermally conductive metallic core substrate, metal oxide dielectric layers on both sides of the metallic core substrate, electrically conductive metal layers on the metal oxide metal oxide dielectric layers, and at least one through-hole via filled with an electrically conductive metal-containing core element connecting at least a portion of each of the electrically conductive metal layers, wherein the containing walls of the through-hole via are covered by a metal oxide dielectric layer connecting at least a portion of the metal oxide dielectric layers on opposite sides of the metallic core substrate. Also disclosed are methods of making such circuit materials, comprising forming metal oxide dielectric layers by oxidative conversion of a surface portion of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed.

Abstract: A foam cushion tape comprising a compressible polyurethane foam layer having a first side and an opposite second side; a composite reinforcing film comprising an anchoring layer and a reinforcing layer, wherein the second aide of the polyurethane foam is disposed on the anchoring layer of the reinforcing film; a first adhesive disposed on the first side of the compressible polyurethane foam; and a second adhesive disposed an the reinforcing layer of the composite reinforcing film. The anchoring layer comprises at least one non-olefinio polymer, such as polyvinylidene chloride (PVDC), polyurethane, nylon, or the like. A method for the manufacture of thin, foam cushion tapes for flexographic printing is provided, comprising casting a curable polyurethane foam composition directly onto the anchoring layer of a composite reinforcing film having a first anchoring layer and a second reinforcing layer, followed by curing the foam composition to form a compressible polyurethane foam.

Abstract: An improved foam cushion tape comprises a compressible polyurethane foam layer having a first side and an opposite second side; a composite reinforcing film comprising an anchoring layer and a reinforcing layer, wherein the second side of the polyurethane foam is disposed on the anchoring layer of the reinforcing film; a first adhesive disposed on the first side of the compressible polyurethane foam; and a second adhesive disposed on the reinforcing layer of the composite reinforcing film. The anchoring layer comprises at least one non-olefinic polymer, such as polyvinylidene chloride (PVDC), polyurethane, nylon, or the like.

Abstract: An electrical circuit board fluoropolymer substrate and method of manufacture thereof, comprising a fluoropolymer matrix that includes a mixture of a granular first fluoropolymer resin and a dispersion second fluoropolymer resin. Preferably, the first and second fluoropolymer is polytetrafluoroethylene (PTFE). This mixture is suitable for forming unfilled or filled casting compositions to form thick films, or for dip-coating glass webs.

Abstract: An improved foam cushion tape comprises a compressible polyurethane foam layer having a first side and an opposite second side; a composite reinforcing film comprising an anchoring layer and a reinforcing layer, wherein the second side of the polyurethane foam is disposed on the anchoring layer of the reinforcing film; a first adhesive disposed on the first side of the compressible polyurethane foam; and a second adhesive disposed on the reinforcing layer of the composite reinforcing film. The anchoring layer comprises at least one non-olefinic polymer, such as polyvinylidene chloride (PVDC), polyurethane, nylon, or the like.

Abstract: An electrical circuit board fluoropolymer substrate and method of manufacture thereof, comprising a fluoropolymer matrix that includes a mixture of a granular first fluoropolymer resin and a dispersion second fluoropolymer resin. Preferably, the first and second fluoropolymer is polytetrafluoroethylene (PTFE). This mixture is suitable for forming unfilled or filled casting compositions to form thick films, or for dip-coating glass webs.

Abstract: An electrical circuit board fluoropolymer substrate and method of manufacture thereof, comprising a fluoropolymer matrix that includes a mixture of a granular first fluoropolymer resin and a dispersion second fluoropolymer resin. Preferably, the first and second fluoropolymer is polytetrafluoroethylene (PTFE). This mixture is suitable for forming unfilled or filled casting compositions to form thick films, or for dip-coating glass webs.

Abstract: A flexible circuit is presented having a flexing (cyclic bending) section of lower stiffness than adjacent parts of the circuit. The lower stiffness in the flexing section is achieved by reducing the thickness of the flexing section, either by omitting or removing some or all of the dielectric material of the flexible circuit in the flexing section, or by replacing conventional dielectric material in the flexing section with a polymer of lower modulus of elasticity.