Abstract: The present disclosure is based on the surprising and unexpected discovery that a ligand molecule with certain characteristics is able to bind to two protein molecules simultaneously and recruit them to form a transient or stable protein-protein interaction complex. The protein-protein interaction and other cross-domain interactions gained in this process contribute additional stabilization energy to the complex beyond the combination of the binary binding energies, and therefore, largely increase the binding potency of the ligand. Accordingly, the present disclosure provides a Protein-Protein Interaction Inducing Technology (PPIIT), which includes a method to design and identify the tripartite or bifunctional compounds and use such compounds to induce protein-protein interactions in various contexts. The present disclosure also provides a composition for the purpose of inducing protein-protein interactions.

Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a direct-exposure heat transfer system are presented. In addition, several embodiments of a multi-processor heat transfer systems are presented. Lastly, several embodiments of heat transfer systems deployed in circuit boards are shown. Each of the heat transfer systems is in liquid communication with a heat exchange system that receives heated liquid from the heat transfer system and returns cooled liquid to the heat transfer system.

Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of thermally coupling to heat generating components and adapted to transfer heat from the heat generating components is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.

Abstract: A connector heat transfer unit is presented. A number of embodiments are presented. Each embodiment includes a housing capable electrically connecting one or more heat generating components to an electronic system and cooling the heat generating components.

Abstract: An extrusion process for forming heat transfer units or portions thereof for use in a cooling system for cooling heat generating components in an electronic system. Several embodiments of the present invention are presented. In one embodiment, a material is extruded through a die and a housing is formed that can be used as the housing or a portion thereof, for the heat transfer unit.

Abstract: A cooling system with one or more coolant regulators is presented. A number of embodiments are presented. The coolant regulators maintain consistent coolant pressure and/or volume regardless of the number of heat-generating components being cooled and such that the consistent coolant pressure and/or volume is maintained while heat generating components are added to or removed from the electronic system while the electronic system remains on-line. One embodiment of the present invention is depicted for large, rack mountable electronic systems such as servers.

Abstract: A cooling system with one or more heat transfer units is presented. A number of embodiments are presented. The heat transfer unit engages heat generating components on a circuit board and creates a thermal coupling with the heat generating components when the circuit board is connected to the electronic system. Another embodiment includes a coil of stiff material inserted into the coolant conduits to prevent crimping of the conduits when bent or angled and to prevent undesired suction effects.

Abstract: A heat exchange easy mount system is presented. A number of embodiments are presented. The easy mount system includes one or more tabs or appendages extending from the heat exchange unit and locking into holes or cavities in surfaces of an electronic system housing. Another embodiment of the easy mount system includes one or more guide pins extending from the heat exchange unit and into holes or cavities in surfaces of an electronic system housing for additional stability. Yet another embodiment of the easy mount system includes one or more shock absorbers disposed on the tabs or guide pins for reducing shocks associated with movement of the electronic system; reducing noise from the heat exchange unit in operation; and reducing the transmission of vibrations from heat exchange unit in operation to the system housing. Another embodiment includes a tool for easy disengagement of the heat exchange unit from the system housing.

Abstract: A leak or spill detector for a system utilizing coolants is presented. A number of embodiments are presented. Each embodiment includes an absorbent material disposed in the system preferably below potential areas for leaks or spills, although other locations as suited to particular application may be used. If a spill or leak occurs, the coolant is absorbed by the absorbent material leaving an indication that leakage occurred chemically or visually. In another embodiment, if a spill or leak occurs, the coolant is absorbed by the compressed absorbent material expanding its size. This expansion of size remains even if the fluid absorbed evaporates, thereby indicating a spill or leak. Detection circuitry can be added to provide a more immediate notification of a leak or spill and/or the severity of the leak or spill.

Abstract: A connector heat transfer unit is presented. A number of embodiments are presented. Each embodiment includes a housing capable electrically connecting one or more heat generating components to an electronic system and cooling the heat generating components.

Abstract: Heat transfer systems and thermal pastes for use with cooling systems for cooling heat generating components with hot spots are presented. A number of embodiments are presented. The heat transfer unit has a housing with one surface open or partially open. A plurality of small heat conducting materials are thermally coupled to known hot spots of the heat generating components. Coolant flowing through the housing, comes into direct contact with the small areas of heat conducting materials and the surface of the heat generating component, absorbing heat from the components and cooling them. A thermal paste comprising a mixture of finely powdered crystalline carbon and an adhesive couples heat transfer units to the heat generating components. Heat transfer systems and heat spreaders using crystalline carbon are also presented.

Abstract: Heat transfer units for use with cooling systems are presented. A number of embodiments are presented. In each embodiment a heat transfer unit is depicted wherein the flow of coolant through the unit is distributed and/or regulated to increase the efficiency of thermal transfer from heat generating components in an electronic system thermally coupled to the heat transfer unit to a coolant flowing through the heat transfer unit.

Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.

Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of thermally coupling to heat generating components and adapted to transfer heat from the heat generating components is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.

Abstract: Liquid cooling systems and apparatus and data processing systems and communication systems with liquid cooling systems are presented. A number of embodiments are presented. An embodiment is disclosed for data processing systems and communication systems having rack mounted sub-assemblies which can be inserted into or retracted from a rack or other holding device (and even while the data processing system or the communication system is operating) wherein the liquid communication to the heat transfer systems on a sub-assembly may be switched on or off.

Abstract: Liquid cooling systems and apparatus and data processing systems and communication systems with liquid cooling systems are presented. A number of embodiments are presented. In each embodiment a plurality of heat transfer systems capable of engaging a plurality heat generating components and each such heat transfer system adapted to transfer heat from the heat generating components is implemented. Each of the heat transfer systems is in liquid communication with a heat exchange system that receives heated liquid from the heat transfer systems and returns cooled liquid to the heat transfer systems. The liquid communication from/to the heat exchange system and the heat transfer systems is in parallel, in series or a combination of parallel and series.

Abstract: A cooling system with quick connectors is presented. A number of embodiments are presented. The cooling system includes one or more heat transfer units disposed on one or more circuit cards and thermally coupled to one or more heat generating components. As the circuit cards are inserted into or disconnected from an electronic system, coolant communication is enabled or disabled, respectively between one or more heat exchange units and the heat transfer units disposed on the circuit card at the time electrical connection of the circuit card is established or disconnected, respectively.

Abstract: A cooling system using a heat differential power system and apparatus for cooling and generating mechanical and/or electrical power in a system are presented. A number of embodiments are presented. In each embodiment a heat differential power system is implemented which dissipates heat created by heat-generating components, such as, but not limited to, microprocessors, within the system and utilizes the heat differential created between the heat generating components and other parts of the system as power to operate the heat differential power system and convert thermal energy into other forms of energy such as, but not limited to, mechanical, and/or electrical energy for powering desired systems such as, but not limited to, fans, or other electrical components, and/or extending the battery life in a portable system.

Abstract: Heat differential power systems and apparatus for powering liquid cooling systems and/or generating electrical power in a data processing system or a telecommunication system are presented. A number of embodiments are presented. In each embodiment a heat differential power system is implemented which utilizes the heat created a heat-generating component such as a microprocessor within the data processing or telecommunications system and the resulting heat differential created with other parts of the system as power to operate the heat differential power system and convert thermal energy into mechanical and/or electrical energy for powering a liquid cooling system, fans, other electrical components, and/or extending the battery life in a portable data processing or telecommunications system.

Abstract: A liquid cooling system and apparatus is presented. A two-piece embodiment is presented. The first component is a heat transfer unit capable of engaging a processor and adapted to transfer heat from the processor to a liquid thereby generating heated liquid. The heated liquid is transported through a detachable input and output transport conduit to a second component. The second component is a heat exchange unit capable of cooling the liquid transported from the heat transfer unit. The heat exchange unit includes an input cavity for receiving the heated liquid, a heat dissipater for dissipating heat from the heated liquid thereby producing cooled liquid, and an output cavity for outputting the cooled liquid back to the heat transfer unit. In one embodiment, the heat exchange unit includes a pumping system for pumping the liquid from the heat exchange unit through the conduit to the heat transfer unit and back.