Abstract: A material delivery assembly includes a delivery fitting attached to a drive shaft and including an outer wall that extends perpendicularly from a receiving surface. Apportioning slots are defined within the outer wall. A dispersion chamber is defined within the outer wall and the receiving surface. A material delivery conduit extends to a delivery port located within the dispersion chamber and is proximate the receiving surface of the delivery fitting. The material delivery port selectively delivers a viscous material to the receiving surface. The drive shaft and the delivery fitting are rotationally operated to define an apportioning state of the delivery fitting that is configured to manipulate the viscous material toward an inner surface of the outer wall. The apportioning slots in the apportioning state are configured to regulate passage of the viscous material from the dispersion chamber, through the outer wall and into a disk-shaped spread pattern.

Abstract: A material delivery assembly includes a delivery fitting attached to a drive shaft and including an outer wall that extends perpendicularly from a receiving surface. Apportioning slots are defined within the outer wall. A dispersion chamber is defined within the outer wall and the receiving surface. A material delivery conduit extends to a delivery port located within the dispersion chamber and is proximate the receiving surface of the delivery fitting. The material delivery port selectively delivers a viscous material to the receiving surface. The drive shaft and the delivery fitting are rotationally operated to define an apportioning state of the delivery fitting that is configured to manipulate the viscous material toward an inner surface of the outer wall. The apportioning slots in the apportioning state are configured to regulate passage of the viscous material from the dispersion chamber, through the outer wall and into a disk-shaped spread pattern.

Abstract: A method for synchronizing multiple data feeds includes receiving a first data feed including user-entered textual data and audio segments acquired concurrently with the user-entered textual data from a first device, receiving an additional data feed including audio segments acquired with the additional device, the first data feed and the additional data feed acquired from a common sporting event, identifying one or more distinctive audio events in the one or more audio segments received from the first device and the additional device, determining a timing offset between the first data feed and the additional data feed by comparing the one or more distinctive audio events of the one or more audio segments received from the first device and the additional device and generating a synchronized output feed by establishing a common absolute time for the first data feed and the additional data feed based on the determined timing offset.

Abstract: A method for synchronizing multiple data feeds includes receiving a first data feed including user-entered textual data and audio segments acquired concurrently with the user-entered textual data from a first device, receiving an additional data feed including audio segments acquired with the additional device, the first data feed and the additional data feed acquired from a common sporting event, identifying one or more distinctive audio events in the one or more audio segments received from the first device and the additional device, determining a timing offset between the first data feed and the additional data feed by comparing the one or more distinctive audio events of the one or more audio segments received from the first device and the additional device and generating a synchronized output feed by establishing a common absolute time for the first data feed and the additional data feed based on the determined timing offset.

Abstract: A method for forming a one-piece integral multi-durometer scraper blade for a conveyor belt cleaner. The scraper blade includes a body extending longitudinally between a first end and a second end and extending transversely between a base and a tip. The body includes a first body portion comprising a first elastomeric material having a first durometer of hardness, and a second body portion comprising a second elastomeric material having a second durometer of hardness.

Abstract: Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.

Abstract: A method for forming a one-piece integral multi-durometer scraper blade for a conveyor belt cleaner. The scraper blade includes a body extending longitudinally between a first end and a second end and extending transversely between a base and a tip. The body includes a first body portion comprising a first elastomeric material having a first durometer of hardness, and a second body portion comprising a second elastomeric material having a second durometer of hardness.

Abstract: The present invention includes forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as organic polymers and organic polymer mixtures. The present invention also includes forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and an embedded capacitor to reduce loop inductance.

Abstract: Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.

Abstract: The present invention includes forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as organic polymers and organic polymer mixtures. The present invention also includes forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and an embedded capacitor to reduce loop inductance.

Abstract: Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.

Abstract: The present invention includes forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as organic polymers and organic polymer mixtures. The present invention also includes forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and an embedded capacitor to reduce loop inductance.

Abstract: A substrate which has a first conductive layer that is attached to a first dielectric layer. A second conductive layer is attached to the first dielectric layer. The second conductive layer may be a plated copper material that extends through a via opening of the dielectric and is attached to the first conductive layer. A third conductive layer is attached to the second conductive layer, including a sidewall of the third layer. A second dielectric can be attached to the third conductive layer. The third conductive layer may be a plated nickel-copper composition which improves the adhesion to subsequent layers in the substrate, particularly between the second dielectric and the sidewall of the second conductive layer.

Abstract: An integrated circuit package which may include a decal that is attached to a substrate which supports an integrated circuit. The decal may have a coefficient of thermal expansion that is different than a coefficient of thermal expansion of the substrate.

Abstract: A method of forming a device having an intermetal dielectric film which is formed and annealed to prevent a significant quantity of ambient moisture from being absorbed by the intermetal dielectric film prior to passivation layer deposition is disclosed. An intermetal dielectric layer is formed over a substrate having a interconnection layer. A second interconnect layer is formed over the IMD layer. The substrate with the intermetal dielectric is annealed anytime between IMD formation and passivation layer deposition to produce a film that does not absorb a significant quantity of ambient moisture, and therefore, longer queue times can be utilized between the anneal and subsequent processing. The present invention reduces the amount of water in the device which reduces hot electron induced device degradation.