Patents by Inventor Brian A. Muskopf

Brian A. Muskopf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8297129
    Abstract: Provided is a strain gage mount, including an instrument carrier mount configured to secure a strain gage during use, a specimen mount configured to couple to a specimen during use, and a thermal insulating layer configured to be disposed between the instrument carrier mount and the specimen mount during use.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: October 30, 2012
    Inventor: Brian A. Muskopf
  • Publication number: 20100319462
    Abstract: Provided is a strain gage mount, including an instrument carrier mount configured to secure a strain gage during use, a specimen mount configured to couple to a specimen during use, and a thermal insulating layer configured to be disposed between the instrument carrier mount and the specimen mount during use.
    Type: Application
    Filed: June 17, 2010
    Publication date: December 23, 2010
    Inventor: Brian A. Muskopf
  • Patent number: 6517774
    Abstract: The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: February 11, 2003
    Assignee: Ideas to Market, L.P.
    Inventors: Alan V. Bray, Brian A. Muskopf, Michael L. Dingus
  • Patent number: 6048379
    Abstract: The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein.
    Type: Grant
    Filed: June 27, 1997
    Date of Patent: April 11, 2000
    Assignee: Ideas to Market, L.P.
    Inventors: Alan V. Bray, Brian A. Muskopf, Michael L. Dingus