Patents by Inventor Brian A. Regione

Brian A. Regione has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having recessed die cavity walls
    Patent number: 4926240
    Abstract: A semiconductor package having recessed die cavity walls to prevent rejectable packages due to excess die attach material overflow. A recessed area is disposed beneath a wire bond shelf and serves as an area into which excess die attach material may flow so that it does not impede wire bonding by flowing onto the bond posts disposed on the wire bond shelf or the bond pads disposed on the top of a semiconductor die.
    Type: Grant
    Filed: March 28, 1989
    Date of Patent: May 15, 1990
    Assignee: Motorola, Inc.
    Inventor: Brian A. Regione