Abstract: An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.

Abstract: An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.

Abstract: A heat pipe includes a flow diverter that separates the heat pipe into an evaporator chamber and a condenser chamber. Each of the evaporator chamber and the condenser chamber are coupled to a compressor with a one-way valve. The compressor receives vaporous working fluid from the evaporator chamber, compresses it, and pumps it to the condenser chamber at a higher pressure and temperature. Within the condenser chamber, the working fluid enter a wicking structure and travels around the flow diverter to the evaporator chamber. The compressor can be an acoustic compressor that includes an acoustic resonating chamber. An integrated circuit package can include the combination of the heat pipe and compressor to create a refrigeration cycle that removes heat from an integrated circuit.

Abstract: A circuit card retention mechanism having a base which is mounted around an electrical connecter of a mother board and has various embodiments of an extension piece for securing a circuit card to the electrical connecter of the mother board is presented. The base of the retention mechanism has a number of pointed bites which incline inwardly from the base and, working in opposition to one another, securely fasten the base to the electrical connecter of the mother board. A tie-wrap may be attached to the base and connected by a circuit card hook or a circuit card holder to the circuit card. Alternatively, a retainer clip with a snap lock which snaps onto the circuit card may be utilized.

Abstract: Hair conditioning shampoo comprising an alkyl ether sulphate detergent, 0.2 to 0.8% by weight of a cationic cellulosic resin as hair conditioning agent and, to increase the deposition of the resin on the hair during shampooing, an added amount of S% by weight of a water-soluble simple salt such that (S/MW).times.N is from 0.03 to 0.21 where MW is the molecular weight of the salt and N is the number of ions produced by the salt in aqueous solution.