Abstract: A substrate plate or device adapted for use with biological or chemical assays is disclosed. The device may take the form of a multi-well plate having a three- dimensional, porous layer as part of a support surface within each well for immobilizing probe species. The porous layer is characterized as having a plurality of interconnected voids defined by a matrix of contiguous solid material. A method and its variants are also described.

Abstract: Buffered assay solutions for performing 1) binding or 2) functional assays on GPCR arrays, along with methods for their use are described. The buffered assay solution has an underlying composition having: a buffer reagent with a pH in the range of about 6.5 to about 7.9; an inorganic salt of either a monovalent or divalent species, at a concentration from about 1 mM to about 500 mM; and optionally a combination of: c) a blocker reagent at a concentration of about 0.01 wt. % to about 2 wt. % of the composition, or d) protease-inhibitor at a concentration of about 0.001 mM to about 100 mM. In an embodiment for functional assay uses, the composition is modified to also include a GTP-analogue, a guanosine 5?-diphosphate (GDP) salt, and/or an anti-oxidant reagent.

Abstract: The present invention provides a method for the detection of a material comprising ammonium nitrate and a sugar, the method comprising sensing for the presence of hydrogen isocyanate (HNCO). The present invention further provides an apparatus suitable for the examination of a material suspected of comprising ammonium nitrate and a sugar, the apparatus comprising heating means in thermal communication with a sample holder suitable for the containment of the material, the sample holder being in gaseous communication with sensing region, the apparatus being further provided with a means for inducing flow of gas from the sample holder to the sensing region and a means for sensing the presence of hydrogen isocyanate in the sensing region.

Abstract: A thematic microarray and methods for multiplexed binding assays using a cocktail solution of labeled ligands in the presence or absence of a target compound is provided. The methods enables researchers to screening compounds against multiple targets using a microarray format.

Abstract: Screens generated by a host application are reformatted for viewing by applying styles to the host screens in response to recognized components included therein. In particular, a style defines a desired look and layout to be applied to a respective host screen. The styles are applied to the respective host screens based on recognizing components of the host screen at run time. For example, first and second styles can be associated with respective first and second components included in host screens. The first style is applied to the host screen in which the first component is recognized and the second style is applied to the host screen in which the second component is recognized. Accordingly, the application of the first and second styles provide respective first and second reformatted screens.

Abstract: A method of growing semi-insulating GaN epilayers by ammonia-molecular beam epitaxy (MBE) through intentional doping with carbon is described. Thick GaN layers of high resistivity are an important element in GaN based heterostructure field-effect transistors. A methane ion source is preferably used as the carbon dopant source.

Abstract: A semiconductor package (8) with a die (10) having die pads (16) coupled to inner ends (22) of interconnects (20), the die (10) and the interconnects (20) are molded in mold compound (30) with mounting surface (12) and outer ends (24) exposed. A semiconductor die has an interconnect surface opposite the mounting surface.

Abstract: A package assembly (31) has a leadframe (10) including a locating flange (30), an optical transmitter (22) such as a laser diode mounted to the leadframe, and a package (32) enclosing both the optical transmitter and a portion of the leadframe so that the locating flange of the leadframe is disposed outside of the package. The locating flange is used as a reference datum to align the optical transmitter's relative height and lateral position during manufacture. Also, the locating flange is used as a reference datum in mating the package assembly to other, standard optical components when mounting to other components in an optical end product.

Abstract: A capacitor (30) compatible with wirebonding processes and a method for manufacturing the capacitor (30). The capacitor (30) includes a first plurality of conductive layers and a second plurality of conductive layers spaced apart by a plurality of dielectric layers. The first plurality of conductive layers is electrically connected to a peripheral contact (74) of the capacitor (30). The second plurality of conductive layers is electrically connected to an interior portion of the capacitor (30). The first plurality of conductive layers is interleaved with the second plurality of conductive layers.

Abstract: A method of encapsulating organic electroluminescent (EL) devices including providing an EL device on a substrate and a metallic sheet having a stand-off structure depending therefrom, the stand-off structure bounding a cavity larger than the EL device. The stand-off structure is positioned over the EL device with the EL device nested within the cavity. The metallic sheet is adhesively bonded to the substrate at a perimeter outboard of the stand-off structure to seal the organic electroluminescent device in the cavity. When a plurality of EL devices are manufactured on a single substrate, the metallic sheet is perforated at the perimeter of each device so that excess metal can be separated and the substrate separated to provide individual EL devices.

Abstract: An optical device package (18) includes an optical transmitter die (10) encapsulated within mold material (20). The mold material (20) allows light emitted from the optical transmitter (10) to pass through the package (18) and can have a lens pattern (22) molded therein to focus the light emitted from the optical transmitter. The mold material (20) can also have coupling patterns (32) formed therein to allow a supplemental lens assembly (28) to be coupled thereto so that supplemental lens patterns (30) formed in the supplemental lens assembly (28) can focus the light emitted from the optical transmitter (10). The optical device package (18) can also include an optical receiver (40) enclosed within the mold material (20) and mounted on a substrate (42) with the optical transmitter (10) to provide a complete optical product in one package (18).

Abstract: An electronic assembly (10) includes a chip capacitor (11) having two major surfaces (12, 15) and a pair of electrodes (13, 14). A plurality of electrically conductive traces (20-23, 25-28) are formed on one (12) of the major surfaces. Some of the plurality of electrically conductive traces are electrically coupled to a first electrode (14) and some of the plurality of electrically conductive traces are coupled to a second electrode (14) of the pair of electrodes. Electronic circuit elements (16, 17, 18) are coupled to the plurality of electrically conductive traces (20-23, 25-28), thereby forming the electronic assembly (10).

Abstract: A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive interconnects (14) and a semiconductor receiving area (17) on a top surface and solder pads (13) on a bottom surface. An optoelectronic component (24) is mounted on the semiconductor receiving area (17) and encapsulated with the optically transmissive material (29, 31). Solder balls (18) are formed on the solder pads (13).

Abstract: A semiconductor component can be manufactured by providing a leadframe (12) with leads (13) and a flag (14) substantially coplanar with at least one of the leads (13) wherein the flag (14) has a hole (15). An electronic substrate (11) is adhered to the flag (14) wherein a perimeter of the electronic substrate (11) has bonding pads (21), wherein the bonding pads (21) face toward the flag (14), wherein the electronic substrate (11) covers the hole (15), and wherein the flag (14) is absent over the bonding pads (21). Next, the pads (21) are wire bonded to the leads (13), and then the electronic substrate (11) and the leadframe (12) are encapsulated with a packaging material (17) wherein the packaging material (17) has an opening (23) and is devoid of covering the hole (15) in the flag (14).

Abstract: An organic electroluminescent device array encapsulating package including an organic electroluminescent device on a supporting substrate. A cover having a rim engaging the supporting substrate is spaced from and hermetically encloses the organic electroluminescent device. A dielectric liquid having benign chemical properties fills the space between the cover and the organic electroluminescent device, providing both an efficient medium for heat transmission and an effective barrier to oxygen and moisture.

Abstract: A package assembly (31) has a leadframe (10) including a locating flange (30), an optical transmitter (22) such as a laser diode mounted to the leadframe, and a package (32) enclosing both the optical transmitter and a portion of the leadframe so that the locating flange of the leadframe is disposed outside of the package. The locating flange is used as a reference datum to align the optical transmitter's relative height and lateral position during manufacture. Also, the locating flange is used as a reference datum in mating the package assembly to other, standard optical components when mounting to other components in an optical end product.

Abstract: An optical package including a housing defining a mounting area with leads formed in the housing each having a first end in the mounting area and a second end external to the housing. A semiconductor die with photonic devices thereon is mounted in the mounting area and electrically connected to the leads. The active light areas of the photonic devices is accessible through the mounting area. Optical fiber alignment structure is mounted in the mounting area for receiving optical fibers and aligning the optical fibers with the active light areas of the photonic devices.

Abstract: A connector affixed to the end of a cable of optical fibers and having alignment pins extending axially in parallel with the cable and beyond the end thereof. A substrate with alignment holes and light transmitting openings therethrough in axial alignment with the ends of the optical fibers when the alignment pins and holes are engaged. The substrate including mounting pads, electrical connection pins and electrical traces connecting the pads to the pins. A semiconductor die, with photonic devices thereon, mounted on the mounting pads of the substrate so that each photonic device is aligned with a light transmitting opening and electrically connected to the electrical connection pins. A sleeve surrounding and securing the connector to the mounting member.

Abstract: A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).

Abstract: A smart optical connector (100) sends and recieves optical signals over optical fibers (200, 202). The smart otical connector (100) is capable of converting electrical signals to optical signals for transmission, and capable of converting optical signals to electrical signals for reception. Addtionally, the smart optical connector (100) comprises circuitry (217) for modifying the format of the electrical signals-to provide compatibility between various equiptment (414, 416, 418) which require differing formats.