Patents by Inventor Brian Alsberg

Brian Alsberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11815274
    Abstract: A thermostat assembly powered by line voltage and capable of wireless communication with a heat source, comprising a first portion and a second portion separated by a barrier. The first portion receives power via internal housing wiring at a first high voltage level and converts the power from the first high voltage level to a second low voltage level. The second portion is removably connected to the first portions to receive power at the second low voltage level, which powers at least a temperature sensor that measures an ambient temperature of an outside environment and a communication chip for wireless communication with a primary heat source. The barrier inhibits dissipation of heat between the first and second portions to reduce an effect of a temperature of the first portion on the temperature sensor, and prevents a user from contacting any high voltage components when the second portion is removed.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: November 14, 2023
    Assignee: Warmboard, Inc.
    Inventors: Terry Wayne Alsberg, David Diepersloot, Brian Alsberg
  • Publication number: 20200263898
    Abstract: A thermostat assembly powered by line voltage and capable of wireless communication with a heat source, comprising a first portion and a second portion separated by a barrier. The first portion receives power via internal housing wiring at a first high voltage level and converts the power from the first high voltage level to a second low voltage level. The second portion is removably connected to the first portions to receive power at the second low voltage level, which powers at least a temperature sensor that measures an ambient temperature of an outside environment and a communication chip for wireless communication with a primary heat source. The barrier inhibits dissipation of heat between the first and second portions to reduce an effect of a temperature of the first portion on the temperature sensor, and prevents a user from contacting any high voltage components when the second portion is removed.
    Type: Application
    Filed: February 12, 2020
    Publication date: August 20, 2020
    Inventors: Terry Wayne Alsberg, David Diepersloot, Brian Alsberg