Patents by Inventor Brian Aspnes

Brian Aspnes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190387634
    Abstract: In one embodiment, a circuit board includes: a plurality of layers including interconnects to carry processor-to-processor signaling between a first processor and a second processor; a first connector adapted to a first peripheral portion of the circuit board to couple to a first contact member of the first processor; and a second connector adapted to a second peripheral portion of the circuit board to couple to a first contact member of the second processor. Other embodiments are described and claimed.
    Type: Application
    Filed: August 29, 2019
    Publication date: December 19, 2019
    Inventors: Brian Aspnes, Marc Milobinski, Mark A. Schmisseur