Abstract: In a method of physical vapor deposition (PVD), a first arrangement of material patterns can be deposited on different parts of a substrate in the same deposition chamber or vessel via a first number of shadow masks, or one pattern at a time can be deposited on different parts of the substrate using the same shadow mask. A second arrangement of material patterns can be deposited on different parts of the substrate in another deposition chamber or vessel via a second number of shadow masks. The each material pattern of the second arrangement of material patterns are deposited so as to not overlap a material pattern of the first arrangement of material patterns.