Patents by Inventor Brian Backes

Brian Backes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11856661
    Abstract: A heating element includes a flexible substrate, a layer of adhesive disposed on a surface of the substrate, and a continuous strand of electrically conductive wire disposed on the adhesive in a pattern of coil structures. Each coil structure includes a first coiled part and a second coiled part. The wire in the first coiled part forms a counterclockwise pattern from an outermost turn to an innermost turn of the first coiled part, and the second coiled part has an innermost turn beginning at an end of the innermost turn of the first coiled part. The wire in the second coiled part forms a clockwise pattern from the innermost turn of the second coiled part to an outermost turn. A connector segment of wire connects outermost turns of adjacent ones of the coil structures.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: December 26, 2023
    Assignee: AUTOMATED ASSEMBLY CORPORATION
    Inventors: David Neuman, Pat Connolly, Brian Backes
  • Patent number: 9781839
    Abstract: A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: October 3, 2017
    Assignee: Automated Assembly Corporation
    Inventors: David Neuman, Robert Neuman, Pat Connolly, Brian Backes