Patents by Inventor Brian Backes
Brian Backes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11856661Abstract: A heating element includes a flexible substrate, a layer of adhesive disposed on a surface of the substrate, and a continuous strand of electrically conductive wire disposed on the adhesive in a pattern of coil structures. Each coil structure includes a first coiled part and a second coiled part. The wire in the first coiled part forms a counterclockwise pattern from an outermost turn to an innermost turn of the first coiled part, and the second coiled part has an innermost turn beginning at an end of the innermost turn of the first coiled part. The wire in the second coiled part forms a clockwise pattern from the innermost turn of the second coiled part to an outermost turn. A connector segment of wire connects outermost turns of adjacent ones of the coil structures.Type: GrantFiled: February 24, 2021Date of Patent: December 26, 2023Assignee: AUTOMATED ASSEMBLY CORPORATIONInventors: David Neuman, Pat Connolly, Brian Backes
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Publication number: 20200350940Abstract: A circuit and computer implemented method tunes an RF switching power amplifier circuit for an antenna by receiving a measurement of reflected RF signal from the antenna, receiving a measurement of current provided to the circuit from a power source, receiving a measurement of RF power provided to the antenna, adjusting a tunable antenna circuit responsive to the measurement of reflected RF signal, and adjusting a first capacitor capacitance value and a second capacitor capacitance value of a waveform shaping circuit in response to the received measurement of current and RF power.Type: ApplicationFiled: April 14, 2020Publication date: November 5, 2020Inventors: Glen Brian Backes, Christian Kenneth Larson, Robert Charles Becker
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Patent number: 9781839Abstract: A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.Type: GrantFiled: October 14, 2015Date of Patent: October 3, 2017Assignee: Automated Assembly CorporationInventors: David Neuman, Robert Neuman, Pat Connolly, Brian Backes
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Patent number: 8244203Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components interconnected with one another through a plurality of circuit paths.Type: GrantFiled: February 28, 2007Date of Patent: August 14, 2012Assignee: ATX Networks Corp.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Patent number: 7197294Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components inter-connected with one another through a plurality of circuit paths.Type: GrantFiled: July 18, 2003Date of Patent: March 27, 2007Assignee: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Publication number: 20040018826Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components inter-connected with one another through a plurality of circuit paths.Type: ApplicationFiled: July 18, 2003Publication date: January 29, 2004Applicant: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Patent number: 6650885Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components interconnected with one another through a plurality of circuit paths.Type: GrantFiled: June 12, 2001Date of Patent: November 18, 2003Assignee: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Publication number: 20020004378Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components inter-connected with one another through a plurality of circuit paths.Type: ApplicationFiled: June 12, 2001Publication date: January 10, 2002Applicant: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Patent number: 6289210Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components interconnected with one another through a plurality of circuit paths.Type: GrantFiled: February 8, 2000Date of Patent: September 11, 2001Assignee: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Patent number: 6049709Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components interconnected with one another through a plurality of circuit paths.Type: GrantFiled: December 6, 1996Date of Patent: April 11, 2000Assignee: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Patent number: 5955930Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components inner connected with one another through a plurality of circuit paths. The components include directional couplers connected in series to combine branch circuits with each branch circuit having a separate attenuator.Type: GrantFiled: December 6, 1996Date of Patent: September 21, 1999Assignee: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Patent number: 5909155Abstract: A splitter/combiner module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Components on the circuit board include splitter/combiners for splitting a signal into a plurality of branch signals each having an individual attenuator component.Type: GrantFiled: December 6, 1996Date of Patent: June 1, 1999Assignee: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone
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Patent number: 5903829Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components inner connected with one another through a plurality of circuit paths. The circuit components include an equalizer removable through the forward face of the housing to equalize an RF attenuation across a broad band.Type: GrantFiled: December 6, 1996Date of Patent: May 11, 1999Assignee: ADC Telecommunications, Inc.Inventors: Andrew Reino Anderson, Glen Brian Backes, Richard Thomas Demulling, Dominic Louwagie, Todd Charles Ortberg, Edward F. Sansone