Patents by Inventor Brian Beaman
Brian Beaman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080100318Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080100316Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080100324Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: May 1, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080088332Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.Type: ApplicationFiled: October 11, 2007Publication date: April 17, 2008Inventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih
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Publication number: 20080090440Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.Type: ApplicationFiled: October 1, 2007Publication date: April 17, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Joseph Kuczynski, Theron Lewis, Amanda Mikhail, Arvind Sinha
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Publication number: 20080048691Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: February 28, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080047741Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: February 28, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080048697Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: February 28, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080048690Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: October 30, 2007Publication date: February 28, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih, George Walker
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Publication number: 20080030215Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.Type: ApplicationFiled: October 11, 2007Publication date: February 7, 2008Inventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih
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Publication number: 20080032520Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: February 7, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080024155Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.Type: ApplicationFiled: October 11, 2007Publication date: January 31, 2008Inventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih
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Publication number: 20080023845Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080026606Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080026607Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080024154Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.Type: ApplicationFiled: October 11, 2007Publication date: January 31, 2008Inventors: Brian Beaman, Keith Fogel, Paul Lauro, Maurice Norcott, Da-Yuan Shih
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Publication number: 20080026605Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020599Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020601Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas
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Publication number: 20080020596Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.Type: ApplicationFiled: October 1, 2007Publication date: January 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Brian Beaman, Evan Colgan, Paul Coteus, Stefano Oggioni, Enrique Vargas