Patents by Inventor Brian Bedwell

Brian Bedwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9359513
    Abstract: Printable dopant formulations, methods of making such dopant formulations, and methods of using such dopant formulations are disclosed. The dopant formulations provide a printable dopant ink with a viscosity sufficient to prevent ink spreading when deposited in a pattern on a substrate. Furthermore, an ion exchange purification process provides the dopant formulation with a reduced metal ion concentration, and thus a relatively high purity level. Consequently, the dopant residue remaining on the substrate after curing and/or dopant activation process is relatively uniform, and therefore can be easily removed.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: June 7, 2016
    Assignee: Thin Film Electronics ASA
    Inventors: Mao Takashima, Inna Tregub, Wenzhuo Guo, Brian Bedwell, Klaus Kunze, Aditi Chandra, Arvind Kamath, Jun Li, Li Li, Junfeng Mei
  • Patent number: 8678203
    Abstract: Embodiments in accordance with the present invention provide forming polynorbornenes useful for forming pervaporation membranes, the membranes themselves and methods of making such membranes.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: March 25, 2014
    Assignee: Promerus, LLC
    Inventors: Brian Knapp, Edmund Elce, Brian Bedwell, Leah J. Langsdorf, Ryan Wilks
  • Publication number: 20130292872
    Abstract: Embodiments in accordance with the present invention provide forming polynorbornenes useful for forming pervaporation membranes, the membranes themselves and methods of making such membranes.
    Type: Application
    Filed: May 21, 2013
    Publication date: November 7, 2013
    Inventors: Brian Knapp, Edmund Elce, Brian Bedwell, Leah J. Langsdorf, Ryan Wilks
  • Patent number: 8470944
    Abstract: Embodiments in accordance with the present invention provide forming polynorbornenes useful for forming pervaporation membranes, the membranes themselves and methods of making such membranes.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: June 25, 2013
    Assignee: Promerus, LLC
    Inventors: Brian Knapp, Edmund Elce, Brian Bedwell, Leah Langsdorf, Ryan Wilks
  • Publication number: 20120283404
    Abstract: Embodiments in accordance with the present invention provide forming polynorbornenes useful for forming pervaporation membranes, the membranes themselves and methods of making such membranes.
    Type: Application
    Filed: June 26, 2012
    Publication date: November 8, 2012
    Applicant: PROMERUS LLC
    Inventors: Brian Knapp, Edmund Elce, Brian Bedwell, Leah J. Langsdorf, Ryan Wilks
  • Patent number: 8215496
    Abstract: Embodiments in accordance with the present invention provide forming polynorbornenes useful for forming pervaporation membranes, the membranes themselves and methods of making such membranes.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: July 10, 2012
    Assignee: Promerus LLC
    Inventors: Brain Knapp, Edmund Elce, Brian Bedwell, Leah J. Langsdorf, Ryan Wilks
  • Patent number: 7858721
    Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: December 28, 2010
    Assignee: Promerus LLC
    Inventors: Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom, Ramakrishna Ravikiran, Robert Shick, Xiaoming Wu, Hiroaki Makabe, Yasunori Takahashi, Etsu Takeuchi, Daoji Gan, Seok Ho Kang
  • Publication number: 20090215976
    Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
    Type: Application
    Filed: April 27, 2009
    Publication date: August 27, 2009
    Inventors: Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom, Ramakrishna Ravikiran, Robert Shick, Xiaoming Wu, Hiroaki Makabe, Yasunori Takahashi, Daoji Gan, Etsu Takeuchi, Seok Ho Kang
  • Publication number: 20090188863
    Abstract: Embodiments in accordance with the present invention provide forming polynorbornenes useful for forming pervaporation membranes, the membranes themselves and methods of making such membranes.
    Type: Application
    Filed: January 27, 2009
    Publication date: July 30, 2009
    Applicant: PROMERUS LLC
    Inventors: Brain Knapp, Edmund Elce, Brian Bedwell, Leah J. Langsdorf, Ryan Wilks
  • Patent number: 7524594
    Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: April 28, 2009
    Assignee: Promerus LLC
    Inventors: Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Raja Puthenkovilakom, Ramakrishna Ravikiran, Robert Shick, Xiaoming Wu, Hiroaki Makabe, Yasunori Takahashi, Etsu Takeuchi, Daoji Gan, Seok Ho Kang
  • Publication number: 20060008734
    Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
    Type: Application
    Filed: July 1, 2005
    Publication date: January 12, 2006
    Inventors: Dino Amoroso, Brian Bedwell, Andrew Bell, Edmund Elce, Rajesh Puthenkovilakom, Ramakrishna Ravikiran, Robert Shick, Xiaoming Wu, Hiroaki Makabe, Yasunori Takahashi, Etsu Takeuchi, Daoji Gan, Seok Kang
  • Publication number: 20040247896
    Abstract: The present composition provides a composition comprising: (a) thermosetting component wherein the thermosetting component comprises monomer having the structure dimer having the structure or a mixture of the monomer and the dimer wherein Y is selected from cage compound and silicon atom; R1, R2, R3, R4, R5, and R6 are independently selected from aryl, branched aryl, and arylene ether; at least one of the aryl, the branched aryl, and the arylene ether has an ethynyl group; R7 is aryl or substituted aryl; and at least one of the R1, R2, R3, R4, R5, and R6 comprises at least two isomers; and (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to a substrate.
    Type: Application
    Filed: May 25, 2004
    Publication date: December 9, 2004
    Inventors: Paul Apen, Brian Bedwell, Nancy Iwamoto, Boris Korolev, Bo Li, Kreiser Lau