Abstract: A device housing (105) and a method (500) of manufacturing the same. The method can include positioning within a mold (300) an insert (205) of thermally conductive film (210). For example, graphite film can be positioned within the mold. The graphite film can have a first thermal conductivity in an in-plane direction (215) and a second thermal conductivity in a normal direction (220) that is less than one-tenth the first thermal conductivity. For example, the graphite film can have a first thermal conductivity in an in-plane direction that is greater than about 150 W/m-K and a second thermal conductivity in a normal direction that is less than 15 W/m-K. An electronic circuit (400) including at least one thermal energy generator (405) can be positioned into the device housing. The thermal energy generator can be positioned proximate to the insert of thermally conductive film.

Abstract: An electronic product (100) such as a phone includes a base housing assembly (102) and a flip housing assembly (40) coupled to the base housing assembly. The flip housing assembly includes a flexible circuit (10) having an appendage (14) having a hinge contact point, a stiffener (22) adhered to the flexible circuit, a hinge pin (32) formed by insert molding a substantial portion of the appendage to form a flexible circuit assembly (30), and an insert molded housing 42 molded about a substantial portion of the flexible circuit assembly. The base housing assembly and flip housing assembly can electronically couple via the portion of the hinge contact point that remains exposed. The flip housing assembly can include among a lens (52), a transducer (62), a bezel (72), a keypad (82) or a transducer grill (92) mounted on to the flexible circuit assembly.