Patents by Inventor Brian Bircumshaw

Brian Bircumshaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250248309
    Abstract: Disclosed are multi-poled piezoelectric devices with improved packing density and methods for making such multi-poled piezoelectric devices with improved packing density. The multi-poled piezoelectric devices comprise: a) a top electrode, a piezoelectric layer, and a bottom electrode fabricated on a substrate; b) vias generated by etching the piezoelectric layer, the top electrode, or both; and c) a re-distribution layer (RDL) deposited over one or more of: the top electrode, the piezoelectric layer, the bottom electrode, or the one or more vias.
    Type: Application
    Filed: April 17, 2025
    Publication date: July 31, 2025
    Inventors: Brian BIRCUMSHAW, Sandeep AKKARAJU
  • Publication number: 20250248310
    Abstract: Disclosed herein are ultrasonic transducer systems with hybrid contacts comprising: an ultrasonic transducer element comprising a substrate and a membrane; an electrical circuitry; and one or more contacts connected to the ultrasonic transducer element and the electrical circuitry, wherein the one or more contacts are: designed geometrically using a set of rules; arranged with respect to the membrane based on the set of rules or a second set of rules, or both.
    Type: Application
    Filed: March 5, 2025
    Publication date: July 31, 2025
    Inventors: Haesung KWON, Brian BIRCUMSHAW, Sandeep AKKARAJU
  • Patent number: 12289999
    Abstract: Disclosed are multi-poled piezoelectric devices with improved packing density and methods for making such multi-poled piezoelectric devices with improved packing density. The multi-poled piezoelectric devices comprise: a) a top electrode, a piezoelectric layer, and a bottom electrode fabricated on a substrate; b) vias generated by etching the piezoelectric layer, the top electrode, or both; and c) a re-distribution layer (RDL) deposited over one or more of: the top electrode, the piezoelectric layer, the bottom electrode, or the one or more vias.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: April 29, 2025
    Assignee: Exo Imaging, Inc.
    Inventors: Brian Bircumshaw, Sandeep Akkaraju
  • Publication number: 20250121408
    Abstract: The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.
    Type: Application
    Filed: December 23, 2024
    Publication date: April 17, 2025
    Inventors: Brian BIRCUMSHAW, Sandeep AKKARAJU
  • Patent number: 12274174
    Abstract: Disclosed herein are ultrasonic transducer systems with hybrid contacts comprising: an ultrasonic transducer element comprising a substrate and a membrane; an electrical circuitry; and one or more contacts connected to the ultrasonic transducer element and the electrical circuitry, wherein the one or more contacts are: designed geometrically using a set of rules; arranged with respect to the membrane based on the set of rules or a second set of rules, or both.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: April 8, 2025
    Assignee: Exo Imaging, Inc.
    Inventors: Haesung Kwon, Brian Bircumshaw, Sandeep Akkaraju
  • Patent number: 12263507
    Abstract: The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: April 1, 2025
    Assignee: Exo Imaging, Inc.
    Inventors: Brian Bircumshaw, Sandeep Akkaraju
  • Publication number: 20250001455
    Abstract: Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.
    Type: Application
    Filed: May 30, 2024
    Publication date: January 2, 2025
    Inventors: Brian BIRCUMSHAW, Sandeep AKKARAJU, Haesung KWON
  • Publication number: 20240427014
    Abstract: An imaging device can include a transducer that includes an array of piezoelectric elements formed on a substrate. Each piezoelectric element can include at least one membrane suspended from the substrate, at least one bottom electrode disposed on the membrane, at least one piezoelectric layer disposed on the bottom electrode, and at least one top electrode disposed on the at least one piezoelectric layer. Adjacent piezoelectric elements can be configured to be isolated acoustically from each other. The device is utilized to measure flow or flow along with imaging anatomy.
    Type: Application
    Filed: June 24, 2024
    Publication date: December 26, 2024
    Inventors: Yusuf HAQUE, Sandeep AKKARAJU, Janusz BRYZEK, Brian BIRCUMSHAW
  • Patent number: 12172189
    Abstract: The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: December 24, 2024
    Assignee: Exo Imaging, Inc.
    Inventors: Brian Bircumshaw, Sandeep Akkaraju
  • Publication number: 20240310209
    Abstract: An array of micromachined ultrasonic transducers (MUTs). The array has first and second rows, the MUTs in the first row being equally spaced by a horizontal pitch in a horizontal direction, the MUTs in the second row being equally spaced by the horizontal pitch in the horizontal direction. The MUTs in the second row are shifted along the horizontal direction by a first horizontal distance relative to the MUTs in the first row and shifted along a vertical direction by a first vertical distance relative to the MUTs in the first row. The first horizontal distance is greater than zero and less than the horizontal pitch. The first vertical distance ranges from one tenth of a horizontal width of a MUT to a half of a vertical height of a MUT.
    Type: Application
    Filed: May 30, 2024
    Publication date: September 19, 2024
    Inventors: Sandeep AKKARAJU, Haesung KWON, Brian BIRCUMSHAW
  • Publication number: 20240286173
    Abstract: Described are micromachined ultrasonic transducers (MUTs) with convex or concave electrodes, which have enhanced pressure amplitude and frequency response behavior when driven at fundamental and harmonic frequencies, as well as methods of making the same.
    Type: Application
    Filed: May 6, 2024
    Publication date: August 29, 2024
    Inventors: Haesung KWON, Brian BIRCUMSHAW, Sandeep AKKARAJU
  • Patent number: 12059708
    Abstract: Disclosed herein are ultrasonic transducer systems comprising: an ultrasonic transducer comprising a substrate, a diaphragm, and a piezoelectric element; a first electrical circuitry coupled to the ultrasonic transducer, the first electrical circuitry configured for driving the ultrasonic transducer or detecting motion of the diaphragm; a plurality of electrical ports coupled to the ultrasonic transducer; and a second electrical circuitry connected to two or more of the plurality of electrical ports, the electrical circuitry comprising one or more of: a resistor, a capacitor, a switch, and an amplifier, wherein the second electrical circuitry is independent from the first electrical circuitry, and wherein the second electrical circuitry is configured to dampen the motion of the diaphragm.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: August 13, 2024
    Assignee: Exo Imaging, Inc.
    Inventors: Brian Bircumshaw, Sandeep Akkaraju, Haesung Kwon
  • Patent number: 12019155
    Abstract: An imaging device includes a transducer that includes an array of piezoelectric elements formed on a substrate. Each piezoelectric element includes at least one membrane suspended from the substrate, at least one bottom electrode disposed on the membrane, at least one piezoelectric layer disposed on the bottom electrode, and at least one top electrode disposed on the at least one piezoelectric layer. Adjacent piezoelectric elements are configured to be isolated acoustically from each other. The device is utilized to measure flow or flow along with imaging anatomy.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: June 25, 2024
    Assignee: Exo Imaging, Inc.
    Inventors: Yusuf Haque, Sandeep Akkaraju, Janusz Bryzek, Brian Bircumshaw
  • Patent number: 11998950
    Abstract: Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: June 4, 2024
    Assignee: Exo Imaging, Inc.
    Inventors: Brian Bircumshaw, Sandeep Akkaraju, Haesung Kwon
  • Patent number: 12000728
    Abstract: An array of micromachined ultrasonic transducers (MUTs). The array has first and second rows, the MUTs in the first row being equally spaced by a horizontal pitch in a horizontal direction, the MUTs in the second row being equally spaced by the horizontal pitch in the horizontal direction. The MUTs in the second row are shifted along the horizontal direction by a first horizontal distance relative to the MUTs in the first row and shifted along a vertical direction by a first vertical distance relative to the MUTs in the first row. The first horizontal distance is greater than zero and less than the horizontal pitch. The first vertical distance ranges from one tenth of a horizontal width of a MUT to a half of a vertical height of a MUT.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: June 4, 2024
    Assignee: Exo Imaging, Inc.
    Inventors: Sandeep Akkaraju, Haesung Kwon, Brian Bircumshaw
  • Publication number: 20240151838
    Abstract: An apparatus, a method, and computer-implemented media.
    Type: Application
    Filed: March 31, 2021
    Publication date: May 9, 2024
    Applicant: Exo Imaging, Inc.
    Inventors: Anthony E. Brock, Brian Bircumshaw, Jonathan R. Strode
  • Patent number: 11975360
    Abstract: Described are micromachined ultrasonic transducers (MUTs) with convex or concave electrodes, which have enhanced pressure amplitude and frequency response behavior when driven at fundamental and harmonic frequencies, as well as methods of making the same.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: May 7, 2024
    Assignee: EXO IMAGING, INC.
    Inventors: Haesung Kwon, Brian Bircumshaw, Sandeep Akkaraju
  • Patent number: 11951512
    Abstract: Described are micromachined ultrasonic transducers (MUTs) with convex or concave electrodes, which have enhanced pressure amplitude and frequency response behavior when driven at fundamental and harmonic frequencies, as well as methods of making the same.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 9, 2024
    Assignee: Exo Imaging, Inc.
    Inventors: Haesung Kwon, Brian Bircumshaw, Sandeep Akkaraju
  • Publication number: 20240082876
    Abstract: A micromachined ultrasonic transducer (MUT) which comprises a first piezoelectric layer and a second piezoelectric layer. The first piezoelectric layer is disposed between a first electrode and a second electrode. The second piezoelectric layer is disposed between the second electrode and a third electrode. At least the first electrode has first and second ends along a first axis, one or more of which is defined by a radius of curvature R. A second axis normal to the first passes through a midpoint of the first axis. A half-width of the first electrode is defined by a length L measured from the midpoint, in the direction of the second axis, to an outer perimeter of the first electrode. A total width of the first electrode at its narrowest point along the first axis is at most 2L such that the first electrode has a concave shape. R/L is greater than 1.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Haesung KWON, Brian BIRCUMSHAW, Sandeep AKKARAJU
  • Publication number: 20240075500
    Abstract: Provided herein are micromachined ultrasonic transducers as well as imaging devices and assemblies comprising micromachined ultrasonic transducers (MUTs). The MUTs described herein have a plurality of membranes so as to improve acoustic power at higher frequencies.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 7, 2024
    Inventors: Haesung KWON, Brian BIRCUMSHAW, Sandeep AKKARAJU