Abstract: The description relates to devices, such as computing devices that have hinged portions. One example can include a first portion and a second portion. This example can also include a sequential multi-pivot hinge assembly rotatably securing the first portion and the second portion. The sequential multi-pivot hinge assembly can include a first set of links configured to control a relative order of rotation around individual axes of rotation of the sequential multi-pivot hinge assembly when the first and second portions are being rotated away from one another and a second different set of links configured to control the relative order of rotation around the individual axes of rotation of the sequential multi-pivot hinge assembly when the first and second portions are being rotated toward one another.

Abstract: The description relates to devices, such as computing devices that have hinged portions. One example can include a first portion and a second portion. This example can also include a sequential multi-pivot hinge assembly rotatably securing the first portion and the second portion. The sequential multi-pivot hinge assembly can include rotation control elements configured to control a relative order of rotation around axes of rotation of the sequential multi-pivot hinge assembly.

Abstract: The description relates to devices, such as computing devices that have hinged portions. One example can include a first portion and a second portion. This example can also include a multi-pivot hinge unit rotatably securing the first and second portions. This example can further include a covered sequentially rotating multi-pivot hinge assembly rotatably securing the first portion and the second portion in a manner that extends a footprint of the computing device as the first portion is rotated away from the second portion.

Abstract: Technologies are generally described for a kickstand or similar support device connection mechanism in conjunction with computing devices. A substantially constant gap may be maintained between the kickstand and the device enclosure across the hinge rotation spectrum allowing the hinge and/or the kickstand to be level with the device enclosure. The connection mechanism may support various usage loads and rotation angles up to about 180 degrees, as well as allow for low force opening to a first position.

Abstract: A process for preparing an imaging surface of an imaging transfer member in a printing machine, the process comprises providing a surface roughness to the imaging surface to produce a plurality of pits having sharp features on the surface, and then exposing the pitted imaging surface to an acid dip for a time period sufficient to substantially reduce the sharp features on the imaging surface. This process may be followed by anodization. The process produces an imaging surface having a pit structure providing reduced oil consumption and wear of components of the printing machine that contact the imaging surface.

Abstract: A process for preparing an imaging surface of an imaging transfer member in a printing machine, the process comprises providing a surface roughness to the imaging surface to produce a plurality of pits having sharp features on the surface, and then exposing the pitted imaging surface to an acid dip for a time period sufficient to substantially reduce the sharp features on the imaging surface. This process may be followed by anodization. The process produces an imaging surface having a pit structure providing reduced oil consumption and wear of components of the printing machine that contact the imaging surface.