Patents by Inventor Brian Burg

Brian Burg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11785938
    Abstract: The present invention relates to a perfusion loop assembly for an ex vivo liver perfusion including: a pump for providing a fluid flow of a perfusion fluid through a first branch line and a second branch line; the first branch line being configured to provide a first portion of the perfusion fluid to the hepatic artery of the liver; the first branch line being coupled with a first gas exchanger, the second branch line being configured to provide a second portion of the perfusion fluid to the portal vein of the liver; the second branch line further including a first valve for controlling the flow of the perfusion fluid into the portal vein of the liver, a liver chamber assembly configured to hold the liver ex vivo, a liver outlet line attached to the vena cava of the ex vivo liver, at least one reservoir connected to the liver outlet and upstream from the pump.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: October 17, 2023
    Assignees: ETH Zurich, Universität Zurich
    Inventors: Pierre-Alain Clavien, Philipp Rudolf von Rohr, Philipp Dutkowski, Rolf Graf, Martin Schuler, Dilmurodjon Eshmuminov, Brian Burg
  • Publication number: 20230077285
    Abstract: The invention relates to an endoprosthesis (60), in particular a vascular stent or a heart stent, comprising a graft (2) with a graft surface (3). The endoprosthesis (60) further comprises at least one fiber (1) which is arranged on the graft surface (3). The graft surface is adapted to directly attach the fiber (1).
    Type: Application
    Filed: January 22, 2021
    Publication date: March 9, 2023
    Inventors: Nathalie VANDAELE-FENOUIL, Oriane CHAPUT, Brian BURG
  • Publication number: 20230071374
    Abstract: The invention relates to an endoprosthesis (60) which comprises a graft (2), a stent structure (5), a fiber (1) and a suture (3). The suture (3) fixedly attaches the stent structure (5) to the graft (2). The fiber is attached to the endoprosthesis (60) via the suture (3).
    Type: Application
    Filed: January 22, 2021
    Publication date: March 9, 2023
    Inventors: Nathalie VANDAELE-FENOUIL, Oriane CHAPUT, Brian BURG
  • Publication number: 20230075855
    Abstract: The invention relates to an endoprosthesis (60), in particular a vascular stent or a heart stent. The endoprosthesis comprises a stent structure (2) with a stent surface (3) and has at least one fiber (1) arranged on the stent surface (3). The stent structure (2), preferably the stent surface (3), comprises an attachment mechanism (4,5,6,7) to directly attach a fiber (1) on the stent.
    Type: Application
    Filed: January 22, 2021
    Publication date: March 9, 2023
    Inventors: Nathalie VANDAELE-FENOUIL, Oriane CHAPUT, Brian BURG
  • Publication number: 20200253194
    Abstract: The present invention relates to a perfusion loop assembly for an ex vivo liver perfusion including: a pump for providing a fluid flow of a perfusion fluid through a first branch line and a second branch line; the first branch line being configured to provide a first portion of the perfusion fluid to the hepatic artery of the liver; the first branch line being coupled with a first gas exchanger, the second branch line being configured to provide a second portion of the perfusion fluid to the portal vein of the liver; the second branch line further including a first valve for controlling the flow of the perfusion fluid into the portal vein of the liver, a liver chamber assembly configured to hold the liver ex vivo, a liver outlet line attached to the vena cava of the ex vivo liver, at least one reservoir connected to the liver outlet and upstream from the pump.
    Type: Application
    Filed: July 21, 2017
    Publication date: August 13, 2020
    Inventors: Pierre-Alain Clavien, Philipp Rudolf von Rohr, Philipp Dutkowski, Rolf Graf, Martin Schuler, Dilmurodjon Eshmuminov, Brian Burg
  • Patent number: 10683776
    Abstract: A device for converting heat into mechanical energy is disclosed. The device includes a channel flow boiler having at least one channel adapted to heat a working fluid for generating a liquid-gas mixture; an expansion device adapted to expand the liquid-gas mixture; and a movable element arranged such that the expanding liquid-gas mixture at least partially converts an internal and/or kinetic energy of the liquid-gas mixture into mechanical energy associated with the movable element; wherein the channel flow boiler and/or the expansion device is adapted to supply heat to the liquid-gas mixture.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: June 16, 2020
    Assignee: International Business Machines Corporation
    Inventors: Brian Burg, Bruno Michel, Chin Lee Ong, Stephan Paredes, Patrick Ruch
  • Patent number: 9739179
    Abstract: A working fluid (6) for a device (4) for converting heat into mechanical energy is disclosed. The working fluid (6) comprises a fluid (7) having a boiling temperature in the range between 30 and 250° C. at a pressure of 1 bar and nanoparticles (8) which are dispersed or suspended in the liquid phase of the fluid (7). Said nanoparticles (8) are instrumented as condensation and/or boiling nuclei and the surface of said nanoparticles (8) is adapted to support condensation and/or boiling.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: August 22, 2017
    Assignee: International Business Machines Corporation
    Inventors: Brian Burg, Bruno Michel, Stephan Paredes
  • Publication number: 20170200659
    Abstract: The disclosure generally relates to methods for manufacturing a filled gap region or cavity between two surfaces forming a device microchip. In one embodiment, the cavity results from two surfaces, for example, a PCB and a chip or two chips. More specifically, the disclosure relates to a method of manufacture and the resulting apparatus having porous underfill to enable rework of the electrical interconnects of a microchip on a multi-chip module. In one embodiment, the disclosure builds on the thermal underfill concept and achieves high thermal conductivity by the use of alumina fillers. Alternatively, other material such as silica filler particles may be selected to render the underfill a poor thermal conductive. In one embodiment, the disclose is concerned with reworkability of the material.
    Type: Application
    Filed: January 8, 2016
    Publication date: July 13, 2017
    Inventors: Michael Gaynes, Jeffrey Gelorme, Thomas Brunschwiler, Brian Burg, Gerd Schlottig, Jonas Zuercher
  • Publication number: 20160319703
    Abstract: A device for converting heat into mechanical energy is disclosed. The device includes a channel flow boiler having at least one channel adapted to heat a working fluid for generating a liquid-gas mixture; an expansion device adapted to expand the liquid-gas mixture; and a movable element arranged such that the expanding liquid-gas mixture at least partially converts an internal and/or kinetic energy of the liquid-gas mixture into mechanical energy associated with the movable element; wherein the channel flow boiler and/or the expansion device is adapted to supply heat to the liquid-gas mixture.
    Type: Application
    Filed: December 16, 2014
    Publication date: November 3, 2016
    Inventors: Brian Burg, Bruno Michel, Chin Lee Ong, Stephan Paredes, Patrick Ruch
  • Publication number: 20160265390
    Abstract: A working fluid (6) for a device (4) for converting heat into mechanical energy is disclosed. The working fluid (6) comprises a fluid (7) having a boiling temperature in the range between 30 and 250° C. at a pressure of 1 bar and nanoparticles (8) which are dispersed or suspended in the liquid phase of the fluid (7). Said nanoparticles (8) are instrumented as condensation and/or boiling nuclei and the surface of said nanoparticles (8) is adapted to support condensation and/or boiling.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 15, 2016
    Inventors: Brian Burg, Bruno Michel, Stephan Paredes
  • Publication number: 20160126202
    Abstract: A bridging arrangement includes a first and a second surface defining a gap therebetween. At least one surface of the first and second surface has an anisotropic energy landscape. A plurality of particles defines a path between the first and second surface bridging the gap.
    Type: Application
    Filed: October 12, 2015
    Publication date: May 5, 2016
    Inventors: Thomas J. Brunschwiler, Brian Burg, Richard Dixon, Helge Kristiansen, Piotr Warszynski, Jonas Zuercher
  • Patent number: 9012849
    Abstract: A system for measuring the absorption spectrum of a sample is provided that includes a broadband light source that produces broadband light defined within a range of an absorptance spectrum. An interferometer modulates the intensity of the broadband light source for a range of modulation frequencies. A bi-layer cantilever probe arm is thermally connected to a sample arm having at most two layers of materials. The broadband light modulated by the interferometer is directed towards the sample and absorbed by the sample and converted into heat, which causes a temperature rise and bending of the bi-layer cantilever probe arm. A detector mechanism measures and records the deflection of the probe arm so as to obtain the absorptance spectrum of the sample.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: April 21, 2015
    Assignee: Massachusetts Institute of Technology
    Inventors: Wei-Chun Hsu, Jonathan Kien-Kwok Tong, Bolin Liao, Brian Burg, Gang Chen
  • Publication number: 20140014841
    Abstract: A system for measuring the absorption spectrum of a sample is provided that includes a broadband light source that produces broadband light defined within a range of an absorptance spectrum. An interferometer modulates the intensity of the broadband light source for a range of modulation frequencies. A bi-layer cantilever probe arm is thermally connected to a sample arm having at most two layers of materials. The broadband light modulated by the interferometer is directed towards the sample and absorbed by the sample and converted into heat, which causes a temperature rise and bending of the bi-layer cantilever probe arm. A detector mechanism measures and records the deflection of the probe arm so as to obtain the absorptance spectrum of the sample.
    Type: Application
    Filed: July 9, 2013
    Publication date: January 16, 2014
    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Wei-Chun Hsu, Jonathan Kien-Kwok Tong, Bolin Liao, Brian Burg, Gang Chen