Abstract: A system and method dispense resin between substrates. A top substrate device holds a top substrate concave up. A bottom substrate device holds a bottom substrate concave down. A resin dispensing device has a needle and dispenses a trajectory of resin defined by an arc having a tangent that touches a tangent of a concave-up-shaped top substrate. The top substrate device may be arranged to include a dampening mechanism to cause a dampened release of the top substrate. Moreover, the top substrate device may be arranged to hold a top substrate so that the top substrate has a continuous concave-up shape extending from a center portion of the top substrate to its outer diameter, and the bottom substrate device may be arranged to hold a bottom substrate so that the bottom substrate has a continuous concave-down shape extending from a center portion of the bottom substrate to its outer diameter.

Abstract: A vacuum-metallizing machine including a metal platter base (17) having an obverse side and a face side. A substrate-receiving platter (2) is resiliently disposed (3, 3b) in a recess on the face side of the platter base (17). The platter (2) receives a substrate to be metallized. A circumferentially-arranged rigid ring (27) of predetermined dimensions and location is disposed on the face side and mates with a ring (29) around a port (11) on the wall of the vacuum chamber which surrounds an opening in the wall. Engagement of these rings aligns the platter base (17) relative to the port (11, 12, 13 and 14). A compliant ring (42) is disposed between the wall and the platter base (17).