Patents by Inventor Brian C. Wadell
Brian C. Wadell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11431379Abstract: An example front-end module includes a channel to connect to a device under test (DUT). The front-end module includes a transmission line between the DUT and the front-end module that is configured for bidirectional transmission of oscillating signals including test signals and response signals, and in-phase and quadrature (IQ) circuitry configured to modulate a test signal for transmission over the transmission line to the DUT and to demodulate a response received over the transmission line from the DUT. The front-end module include at least four taps into the transmission line to obtain direct current (DC) voltage values based on the oscillating signals. Scattering (s) parameters of the channel are based on the DC voltage values. The front-end module includes at least six ports.Type: GrantFiled: March 31, 2021Date of Patent: August 30, 2022Assignee: TERADYNE, INC.Inventor: Brian C. Wadell
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Patent number: 10345418Abstract: Example automatic test equipment (ATE) includes: a test instrument for outputting test signals to test a device under test (DUT), and for receiving response signals based on the test signals; a device interface board (DIB) connected to the test instrument, with the DIB including an application space having a site to which the DUT connects, and with the test signals and the response signals passing through the site; and calibration circuitry in the application space on the DIB. The calibration circuitry includes a communication interface over which communications pass, with the communications comprising control signals to the calibration circuitry and measurement signals from the calibration circuitry. The calibration circuitry also includes non-volatile memory to store calibration data and is controllable, based on the control signals, to pass the test signals from the test instrument to the DUT and to pass the response signals from the DUT to the test instrument.Type: GrantFiled: November 20, 2015Date of Patent: July 9, 2019Assignee: Teradyne, Inc.Inventors: Brian C. Wadell, Richard Pye
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Patent number: 9786977Abstract: An example circuit board structure includes: a substrate; and vias that are electrically conductive and that pass through the substrate to enable electrical connection through the circuit board structure. The substrate is thinner, and lengths of the vias are shorter, in first areas of the circuit board structure that deliver first speed signals than in second areas of the circuit board structure that deliver second speed signals and power. The first speed signals have a shorter rise time than the second speed signals.Type: GrantFiled: December 10, 2015Date of Patent: October 10, 2017Assignee: Teradyne, Inc.Inventors: Timothy Daniel Lyons, Frank B. Parrish, Roger Allen Sinsheimer, Brian G. Donovan, Vladimir Vayner, Brandon E. Creager, Brian C. Wadell
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Patent number: 9755766Abstract: Example automatic test equipment (ATE) includes: a test instrument for outputting test signals to test a device under test (DUT), and for receiving output signals from the DUT, with the test instrument including a front-end module, and with the front-end module including internal circuitry for performing functions relating to the DUT; and external circuitry for performing the functions relative to the DUT via the test instrument, with the external circuitry being external to the front-end module and being shared among multiple front-end modules or channels of the test instrument. The test instrument is configurable to use either (i) the internal circuitry, (ii) the external circuitry, or (iii) a combination of circuits in the internal circuitry and the external circuitry to perform the functions.Type: GrantFiled: December 7, 2015Date of Patent: September 5, 2017Assignee: Teradyne, Inc.Inventors: Brian C. Wadell, Daniel Rosenthal
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Publication number: 20170170537Abstract: An example circuit board structure includes: a substrate; and vias that are electrically conductive and that pass through the substrate to enable electrical connection through the circuit board structure. The substrate is thinner, and lengths of the vias are shorter, in first areas of the circuit board structure that deliver first speed signals than in second areas of the circuit board structure that deliver second speed signals and power. The first speed signals have a shorter rise time than the second speed signals.Type: ApplicationFiled: December 10, 2015Publication date: June 15, 2017Inventors: Timothy Daniel Lyons, Frank B. Parrish, Roger Allen Sinsheimer, Brian G. Donovan, Vladimir Vayner, Brandon E. Creager, Brian C. Wadell
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Publication number: 20170163358Abstract: Example automatic test equipment (ATE) includes: a test instrument for outputting test signals to test a device under test (DUT), and for receiving output signals from the DUT, with the test instrument including a front-end module, and with the front-end module including internal circuitry for performing functions relating to the DUT; and external circuitry for performing the functions relative to the DUT via the test instrument, with the external circuitry being external to the front-end module and being shared among multiple front-end modules or channels of the test instrument. The test instrument is configurable to use either (i) the internal circuitry, (ii) the external circuitry, or (iii) a combination of circuits in the internal circuitry and the external circuitry to perform the functions.Type: ApplicationFiled: December 7, 2015Publication date: June 8, 2017Inventors: Brian C. Wadell, Daniel Rosenthal
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Publication number: 20170146632Abstract: Example automatic test equipment (ATE) includes: a test instrument for outputting test signals to test a device under test (DUT), and for receiving response signals based on the test signals; a device interface board (DIB) connected to the test instrument, with the DIB including an application space having a site to which the DUT connects, and with the test signals and the response signals passing through the site; and calibration circuitry in the application space on the DIB. The calibration circuitry includes a communication interface over which communications pass, with the communications comprising control signals to the calibration circuitry and measurement signals from the calibration circuitry. The calibration circuitry also includes non-volatile memory to store calibration data and is controllable, based on the control signals, to pass the test signals from the test instrument to the DUT and to pass the response signals from the DUT to the test instrument.Type: ApplicationFiled: November 20, 2015Publication date: May 25, 2017Inventors: Brian C. Wadell, Richard Pye
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Patent number: 6204813Abstract: A radio frequency positioning system is described that determines identity and positional data of numerous objects. The system includes a plurality of spread spectrum radio transceivers where at least one transceiver is positioned on each of the numerous objects. At least three spread spectrum radio transceivers transmit to and receive signals from the plurality of radio transceivers. A signal processor is coupled to the spread spectrum radio transceivers and determines the identity and the positional data of the objects.Type: GrantFiled: February 20, 1998Date of Patent: March 20, 2001Assignee: Trakus, Inc.Inventors: Brian C. Wadell, Robert J. McCarthy, Eric L. Gravengaard, Eric Spitz, Vahe Katros
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Patent number: 6066953Abstract: An RF module useful for configuring RF sources and receivers to make a wide range of measurements on a device under test. The module includes a directional element which allows one receiver to measure both the input and the output signals from one test point. In addition, the module allows multiple input signals to be combined for intermodulation testing. Multiple copies of the module are used to construct multiple channels in an RF tester. At least one RF source and one RF receiver can be connected to each channel. Each lead of a device under test is assigned to a channel, but one channel may be multiplexed to more than one lead. Switching circuitry included in each module allows the source from one channel to be used as an intermodulation signal for another channel. The module includes calibration standards for source and receiver level accuracy. With this arrangement, numerous RF measurements, including measurement of s-parameters, can be made on a device under test without dedicated instruments.Type: GrantFiled: August 19, 1996Date of Patent: May 23, 2000Assignee: Teradyne, Inc.Inventor: Brian C. Wadell
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Patent number: 5572160Abstract: An RF useful for configuring RF sources and receivers to make a wide range of measurements on a device under test. The module includes a directional element which allows one receiver to measure both the input and the output signals from one test point. In addition, the module allows multiple input signals to be combined for intermodulation testing. Multiple copies of the module are used to construct multiple channels in an RF tester. At least one RF source and one RF receiver can be connected to each channel. Each lead of a device under test is assigned to a channel, but one channel may be multiplexed to more than one lead. Switching circuitry included in each module allows the source from one channel to be used as an intermodulation signal for another channel. The module includes calibration standards for source and receiver level accuracy. With this arrangement, numerous RF measurements, including measurement of s-parameters, can be made on a device under test without dedicated instruments.Type: GrantFiled: December 1, 1994Date of Patent: November 5, 1996Assignee: Teradyne, Inc.Inventor: Brian C. Wadell
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Patent number: 4894753Abstract: Electrical circuitry support apparatus including a card cage having slots for removably receiving circuit boards, and a plurality of circuit boards in the slots, at least one circuit board being a high-frequency board carrying an enclosure containing a high-frequency device. The enclosure provides shielding inhibiting transmission of high-frequency signals to or from the device.Type: GrantFiled: September 9, 1988Date of Patent: January 16, 1990Assignee: Teradyne, Inc.Inventors: Brian C. Wadell, Bernard M. Cuddy
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Patent number: 4864077Abstract: A shielded enclosure for electronic devices utilizing alternating current signals, the enclosure having first and second storage members that have a geniculated (i.e., abrupt angle) junction between them so as to inhibit transmission of alternating current radiation from the devices.Type: GrantFiled: June 10, 1988Date of Patent: September 5, 1989Assignee: Teradyne, Inc.Inventor: Brian C. Wadell