Patents by Inventor Brian Caffarel

Brian Caffarel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular HVAC-SHW system and a method of integrating thereof
    Patent number: 12729865
    Abstract: A modular HVAC-SHW/DHW system that provides comfort conditioning, sanitary hot water, and ventilation in the buildings is disclosed. The system includes HVAC units, SHW/DHW units, and one or more air-to-water heat pump (AWHP) units fluidically connected to the HVAC units and the SHW/DHW units through at least one water-to-water heat pump (WWHPs). The AWHP units are configured to enable the exchange of heat between the environment and the WWHPs, and the WWHP is configured to enable the exchange of rejected heat between any of the AWHP units, the HVAC units, and the SHW/DHW units. The system is designed in a packaged form factor or modular design, where the components/units of the system are configured within a housing that is easily installable at the desired locations in the building.
    Type: Grant
    Filed: November 20, 2023
    Date of Patent: September 8, 2026
    Assignee: CARRIER CORPORATION
    Inventors: Luke Dorna, Michel Grabon, Brian Caffarel
  • MODULAR HVAC-SHW SYSTEM AND A METHOD OF INTEGRATING THEREOF
    Publication number: 20240167701
    Abstract: A modular HVAC-SHW/DHW system that provides comfort conditioning, sanitary hot water, and ventilation in the buildings is disclosed. The system includes HVAC units, SHW/DHW units, and one or more air-to-water heat pump (AWHP) units fluidically connected to the HVAC units and the SHW/DHW units through at least one water-to-water heat pump (WWHPs). The AWHP units are configured to enable the exchange of heat between the environment and the WWHPs, and the WWHP is configured to enable the exchange of rejected heat between any of the AWHP units, the HVAC units, and the SHW/DHW units. The system is designed in a packaged form factor or modular design, where the components/units of the system are configured within a housing that is easily installable at the desired locations in the building.
    Type: Application
    Filed: November 20, 2023
    Publication date: May 23, 2024
    Inventors: Luke Dorna, Michel Grabon, Brian Caffarel