Patents by Inventor Brian Carl Hicks

Brian Carl Hicks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular printed circuit board enclosure
    Patent number: 11586795
    Abstract: Systems and methods are provided for a turnkey modular printed circuit board enclosure that is generated using a template generator. The template generator accepts a user input comprising an enclosure parameter, based on which a manufacturing file may be generated. The manufacturing file may be provided to a fabricator for fabricating the enclosure or the manufacturing file may be modified in a printed circuit board design environment to incorporate a printed circuit board into the enclosure. The printed circuit board may be a separate printed circuit board that is inserted into the enclosure or it may be embedded in a face of the enclosure.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: February 21, 2023
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Blerta Bajramaj Markowski, Brian Carl Hicks, David Bonanno, Freddie Santiago
  • MODULAR PRINTED CIRCUIT BOARD ENCLOSURE
    Publication number: 20220229964
    Abstract: Systems and methods are provided for a turnkey modular printed circuit board enclosure that is generated using a template generator. The template generator accepts a user input comprising an enclosure parameter, based on which a manufacturing file may be generated. The manufacturing file may be provided to a fabricator for fabricating the enclosure or the manufacturing file may be modified in a printed circuit board design environment to incorporate a printed circuit board into the enclosure. The printed circuit board may be a separate printed circuit board that is inserted into the enclosure or it may be embedded in a face of the enclosure.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 21, 2022
    Inventors: Blerta Bajramaj Markowski, Brian Carl Hicks, David Bonanno, Freddie Santiago