Abstract: An adjustable booster seat can raise and lower to provide a variable height so that a seat belt can properly fit a child as they grow. Therefore, as the child grows, the booster seat height can be adjusted, providing the shoulder strap of the seat belt a proper, safe, and non-irritating fit about the child. The adjustable booster seat could include a knob for manual adjustment of the height of the seat, or could include a motor to provide for motorized adjustment of the height of the seat.

Abstract: An apparatus for use with an elevator car is operable to selectively lock an elevator car door. The apparatus verifies that the elevator car door is closed, locks the elevator car door, and verifies that a lock is engaged. Once conditions are met, the apparatus signals an elevator controller that the elevator car can move through a hoistway. The apparatus further ensures that passengers can safely disembark from the elevator car by detecting the position of the elevator car relative to a designated landing zone within the hoistway, and confirming the elevator car is stopped at a landing zone prior to disengaging the lock. The apparatus thus ensures that the elevator car door remains closed while the elevator car is in motion or between landing zones.

Abstract: An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.

Abstract: A method and system for heating a circuit board component to an approximately uniform temperature sufficient to reflow the connections between the circuit board component and the circuit board. The method and system include a supplemental gas heater having a diffuser plate. The circuit board is placed against the diffuser plate and heated gas is channeled through openings in the diffuser plate into vias in the circuit board to heat a circuit board component connected on the opposite side of the circuit board. Heated gas can be channeled through selected vias towards predetermined areas and/or specified connections such as towards those areas or connections where there is a temperature differential greater than approximately 10 degrees Celsius compared to other areas or connections across the circuit board component. Hot gas can be channeled through selected vias by baffling or patterning the diffuser plate, accordingly.

Abstract: Disclosed are a tool and a procedure for flattening a site on a printed circuit board. The tool comprises three sections: a nozzle, a throat and a flattening block. The nozzle connects the tool to a hot air source and receives hot air from said source, and the throat is connected to the nozzle section for receiving the hot air from the nozzle section. The flattening block has a generally planar bottom surface for engaging a site on a printed circuit board. The flattening block forms a vent for venting the hot air from the flattening block to the ambient to help maintain said site at an approximately constant temperature when said bottom surface engages said site. A resilient mechanism is mounted on the throat section, for forcing said bottom surface against said site, with a constant, known force.

Abstract: This invention relates to a method comprising (1) heating in the presence of a catalyst a mixture comprising (i) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule or a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation, (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form silicon-bonded hydrogen containing branched polymers.

Abstract: A composition comprising (A) at least one compound having at least one aliphatic unsaturation; (B) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and (C) a platinum group metal-containing catalyst.

Abstract: A method comprising heating in the presence of a catalyst, a mixture comprising (i) a reaction product obtained by mixing in the presence of a platinum group metal-containing catalyst at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and at least one compound having at least one aliphatic unsaturation; (ii) at least one endblocker, and optionally (iii) at least one organosiloxane chosen from a hydrolyzate or a cyclosiloxane, so to cause polymerization of components (i), (ii), and optionally (iii) to form branched polymers.

Abstract: An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.

Abstract: Organohydrogensilicon compounds containing at least one silicon-bonded hydrogen atom per molecule and at least one cyclosiloxane.

Abstract: An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.

Abstract: A solid imaging apparatus and method produces an integral three-dimensional object from a multiplicity of cross sectional portions of the object by selectively exposing successive layers of a liquid photoformable composition to actinic radiation. The apparatus includes a vessel for containing the composition so as to present a free surface, and a movable platform disposed within the vessel below the free surface. Part of the composition is transferred above the free surface by lowering and raising a dispenser at predetermined positions located away from the platform. A doctor blade contacts the composition transferred above the free surface, and then moves over the platform to form a substantially uniform layer of the composition.

Abstract: A novel extract from the root of Harpagophytum procumbens (Devil's Claw) which contains high levels of the compound harpagoside and a method for producing the extract.

Abstract: A baseline correction circuit (BCC) that compensates for the offset present on a PWM signal in an optical readback system when associated transients first appear in the PWM signal, and then compensates for the decay in the PWM signal so that significant baseline variations are minimized. The BCC includes a BCC switch coupled to switch the PWM signal responsive to a control unit and a low pass filter coupled through the BCC switch to receive the PWM signal. The low pass filter includes a capacitor coupled between the PWM signal and a ground reference, which stores the voltage of the baseline variation. A difference amplifier is connected to receive the low pass filtered output and also the PWM signal, and to provide a difference signal responsive to the difference between these two signals. The resultant signal is a high-pass filtered version of the PWM signal originally supplied to the BCC.

Abstract: A method of preparation of an artemisinin extract comprising the steps of extraction of Artemisia annua with liquid carbon dioxide and allowing the carbon dioxide to evaporate from the resultant mixture.

Abstract: A baseline correction circuit (BCC) compensates for the offset present on a pulse width modulated (PWM) signal in an optical readback system when associated transients first appear in the PWM signal, then compensates for the decay in the PWM signal so that significant baseline variations are minimized. The BCC includes a BCC switch coupled to switch the PWM signal responsive to a control unit and a low pass filter coupled through the BCC switch to receive the PWM signal. The low pass filter includes a capacitor coupled between the PWM signal and a ground reference, which stores the voltage of the baseline variation. A difference amplifier is connected to receive the low pass filtered output and also the PWM signal, and to provide a difference signal responsive to the difference between these two signals. The resultant signal is a high-pass filtered version of the PWM signal originally supplied to the BCC.

Abstract: A driver circuit (10), with a minimum number of interconnects between itself and a conventional output driver device (14), controls the normal on/off operation of the output driver device, and additionally senses various fault conditions within the output driver device. The driver circuit (10) also preferably shuts down the output driver device when the latter device begins to operate in a current limiting mode, and generates diagnostic signals which identify the type of fault condition that is sensed.

Abstract: Overvoltage protection circuit (10) has a power transistor (11) that drives an inductive load (19). A resistor (16) is connected between an output electrode (14) of the transistor and a control electrode (12) of the transistor, and a constant current source (18) is also connected to the control electrode. The resistor and constant current source determine an effective zener voltage to limit the maximum voltage which can exist at the transistor output electrode (14), and this is accomplished without the use of a zener diode while utilizing a minimum number of components. This effective zener diode voltage can be readily adjusted by adjusting either the magnitude of the resistor (16) or the constant current source (18).

Abstract: A method and apparatus is disclosed for measuring and/or controlling the level of current in a Sense FET which includes a power transistor (M1) and a sense transistor (M2). The transistors (M1) and (M2) are both biased to operate in a linear mode, and the Vds of the sense transistor (M2) is compared to a predetermined fraction of the Vds of the power transistor (M1). A control signal is generated that is representative of the results of the comparison, and, in one embodiment, that control signal is used in a feedback arrangement to drive the Vds of the sense transistor (M2) to the predetermined fraction of the Vds of the power transistor (M1). Consequently, the level of current carried by the sense transistor (M2) is caused to be equal to the same predetermined fraction of the current carried by the power transistor (M1).