Patents by Inventor Brian Chislea

Brian Chislea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
    Patent number: 9447308
    Abstract: A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: September 20, 2016
    Assignee: DOW CORNING CORPORATION
    Inventors: John Albaugh, Brian Chislea, Adriana Zambova
  • Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
    Patent number: 9441086
    Abstract: A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conductive metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: September 13, 2016
    Assignee: DOW CORNING CORPORATION
    Inventors: John Albaugh, Brian Chislea, Adriana Zambova
  • Treated Fillers And Uses Thereof
    Publication number: 20160230084
    Abstract: The various embodiments of the present invention relate to condensation curable silicone compositions comprising: a condensation curable polyorganosiloxane; and treated particles comprising a particulate solid having an effective amount of nitrogen-containing base (e.g., a nitrogen-containing superbase) disposed thereon. Other embodiments of the present invention relate to methods for preparing the aforementioned treated particles; the treated particles themselves; and methods of using the treated particles and compositions of the various embodiments of the present invention.
    Type: Application
    Filed: August 18, 2015
    Publication date: August 11, 2016
    Inventors: Lizhi Liu, Brian Chislea, Steven Swier, Yanhu Wei
  • Curable Silicone Compositions, Electrically Conductive Silicone Adhesives, Methods of Making and Using Same, and Electrical Devices Containing Same
    Publication number: 20160017185
    Abstract: A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.
    Type: Application
    Filed: March 13, 2014
    Publication date: January 21, 2016
    Inventors: John ALBAUGH, Brian CHISLEA, Adriana ZAMBOVA
  • Curable Silicone Compositions, Electrically Conductive Silicone Adhesives, Methods Of Making And Using Same, And Electrical Devices Containing Same
    Publication number: 20150315437
    Abstract: A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conduct metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.
    Type: Application
    Filed: December 13, 2013
    Publication date: November 5, 2015
    Applicant: Dow Corning Corporation
    Inventors: John Albaugh, Brian Chislea, Adriana Zambova