Patents by Inventor Brian Chock

Brian Chock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11719822
    Abstract: An underwater imaging system is carried by a submersible platform to capture images that are processed into three-dimensional images stitched together to create a 3D dimensional video at video rate speeds that are transmitted to a control unit above the surface of the water. The imaging system utilizes a high speed image sensor or camera to capture sequential gated images that are synced via a gating module to two sequential laser beam pulses. The laser beam pulses illuminate an object in each gated image. When the object is within a gate overlap region, the two images may be processed using 3D imaging techniques to generate a 3D representation of the object in the overlap region of the two gates.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: August 8, 2023
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Michael J. DeWeert, Brian Chock, Jacob D. Garan, Reid A. Noguchi, Gary Sawai, Dugan C. Yoon
  • Publication number: 20230003889
    Abstract: An underwater imaging system is carried by a submersible platform to capture images that are processed into three-dimensional images stitched together to create a 3D dimensional video at video rate speeds that are transmitted to a control unit above the surface of the water. The imaging system utilizes a high speed image sensor or camera to capture sequential gated images that are synced via a gating module to two sequential laser beam pulses. The laser beam pulses illuminate an object in each gated image. When the object is within a gate overlap region, the two images may be processed using 3D imaging techniques to generate a 3D representation of the object in the overlap region of the two gates.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 5, 2023
    Inventors: Michael J. DeWeert, Brian Chock, Jacob D. Garan, Reid A. Noguchi, Gary Sawai, Dugan C. Yoon