Abstract: A method of controlling an LED system with a control signal having a first control scheme may include providing a lighting module including a control module, an LED driver connected to the control module, and at least one LED connected to the LED driver; receiving, at the control module, the control signal having a first control scheme; comparing the first control scheme to a predetermined second control scheme; when the comparing determines that the first control scheme is the same as the predetermined second control scheme, transmitting to the LED driver a driver control signal including the predetermined second control scheme; and when the comparing determines that the first control scheme is different from the predetermined second control scheme, translating, with the control module, the first control scheme into the predetermined second control scheme and then transmitting to the LED driver a driver control signal including the predetermined second control scheme.

Abstract: A method of controlling an LED system with a control signal having a first control scheme may include providing a lighting module including a control module, an LED driver connected to the control module, and at least one LED connected to the LED driver; receiving, at the control module, the control signal having a first control scheme; comparing the first control scheme to a predetermined second control scheme; when the comparing determines that the first control scheme is the same as the predetermined second control scheme, transmitting to the LED driver a driver control signal including the predetermined second control scheme; and when the comparing determines that the first control scheme is different from the predetermined second control scheme, translating, with the control module, the first control scheme into the predetermined second control scheme and then transmitting to the LED driver a driver control signal including the predetermined second control scheme.

Abstract: A lighting module may receive control signal having a first control scheme, the lighting module including a driver including at least one channel; and a control module; where the control module translates the received first control scheme into a predetermined second control scheme, when the first control scheme is different from the predetermined second control scheme; wherein the control module generates an identity voltage correlated with the received first control scheme; wherein the control module outputs to the driver a driver control signal including the predetermined second control scheme, and the identity voltage; and wherein the driver generates a driver output based on the identity voltage and the driver control signal.

Abstract: A lighting module may receive control signal having a first control scheme, the lighting module including a driver including at least one channel; and a control module; where the control module translates the received first control scheme into a predetermined second control scheme, when the first control scheme is different from the predetermined second control scheme; wherein the control module generates an identity voltage correlated with the received first control scheme; wherein the control module outputs to the driver a driver control signal including the predetermined second control scheme, and the identity voltage; and wherein the driver generates a driver output based on the identity voltage and the driver control signal.

Abstract: There is provided a system comprising a driver and a control module, the control module capable of translating a received control signal having a first control scheme into a driver control signal having a predetermined second control scheme; and wherein the driver is configured for generating a driver output based on the identity of the first control scheme and the driver control signal. A driver, control module, and a method of controlling an LED system are also provided.

Abstract: There is provided a system comprising a driver and a control module, the control module capable of translating a received control signal having a first control scheme into a driver control signal having a predetermined second control scheme; and wherein the driver is configured for generating a driver output based on the identity of the first control scheme and the driver control signal. A driver, control module, and a method of controlling an LED system are also provided.

Abstract: Aspects include features for improving the reliability of a reflective base structure for light emitting diodes (LED) chip-on-board (COB) array products. The reflective base structure reduces reflective material of a reflective layer (e.g., silver) from migrating into adjacent layers. In one configuration used to reduce the migration of reflective material, a reflective base for a light-emitting diode (LED) may comprise a substrate, a reflective layer, and a diffusion barrier layer between the substrate and the reflective layer. In another configuration used to reduce the migration of reflective material, a reflective base for an LED comprising: a substrate, a reflective layer; and a planarizing layer between the substrate and the reflective layer, a thickness of the planarizing layer between the substrate and the reflective layer being less than 70 nm.

Abstract: Aspects include features for improving the reliability of a reflective base structure for light emitting diodes (LED) chip-on-board (COB) array products. The reflective base structure reduces reflective material of a reflective layer (e.g., silver) from migrating into adjacent layers. In one configuration used to reduce the migration of reflective material, a reflective base for a light-emitting diode (LED) may comprise a substrate, a reflective layer, and a diffusion barrier layer between the substrate and the reflective layer. In another configuration used to reduce the migration of reflective material, a reflective base for an LED comprising: a substrate, a reflective layer; and a planarizing layer between the substrate and the reflective layer, a thickness of the planarizing layer between the substrate and the reflective layer being less than 70 nm.

Abstract: A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.

Abstract: A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.

Abstract: A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.

Abstract: A liquid-filled light emitting diode (LED) bulb including a base, a shell, one or more LEDs, a thermally conductive liquid, and a bladder. The shell is connected to the base and the thermally conductive liquid is held within the shell. The one or more LEDs are disposed within the shell and immersed in the thermally conductive liquid. The bladder is also immersed in the thermally conductive liquid and is configured to compensate for expansion of the thermally conductive liquid.

Abstract: A liquid-filled light emitting diode (LED) bulb including a base, a shell connected to the base forming an enclosed volume, a thermally conductive liquid held within the enclosed volume, a support structure connected to the base, and several LEDs attached to the support structure. The thermally conductive liquid has an oxygen content of at least 5 cubic centimeters of oxygen per liter of the thermally conductive fluid.

Abstract: A liquid-filled light emitting diode (LED) bulb including a base, a shell connected to the base forming an enclosed volume, a thermally conductive liquid held within the enclosed volume, a support structure connected to the base, and several LEDs attached to the support structure. The thermally conductive liquid has an oxygen content of at least 5 cubic centimeters of oxygen per liter of the thermally conductive fluid.

Abstract: Volume compensation in photovoltaic device is provided. The photovoltaic device has an outer transparent casing and a substrate that, together, define an inner volume. At least one solar cell is on the substrate. A filler layer seals the at least one solar cell within the inner volume. A container within the inner volume has an opening in fluid communication with the filler layer. A diaphragm is affixed to the opening thereby sealing the interior of the container from the filler layer. The diaphragm is configured to decrease the volume within the container when the filler layer thermally expands and to increase the volume within the container when the filler layer thermally contracts. In some instances, the substrate is hollowed and the container is formed within this hollow. The container can have multiple openings, each sealed with a diaphragm. There can be multiple containers within the photovoltaic device.

Abstract: Devices for converting light into electric current are provided. A representative device has an encasing structure having at least one portion transparent. The encasing structure is configured to pass light energy into an interior of the encasing structure. The device further has a photovoltaic device positioned within the interior of the encasing structure. The photovoltaic device is positioned to receive light energy. The photovoltaic device is operable to transform the light energy into electric current. The device further has a protective space material, disposed between the encasing structure and the photovoltaic device. The protective space material is operable to transmit the light energy. The protective space material is a non-solid material having a physical property such as a viscosity of less than 1×106 cP and/or a thermal coefficient of expansion of greater than 500×10?6/° C.

Abstract: Disclosed are highly efficient multiphoton absorbing compounds and methods of their use. The compounds generally include a bridge of pi-conjugated bonds connecting electron donating groups or electron accepting groups. The bridge may be substituted with a variety of substituents as well. Solubility, lipophilicity, absorption maxima and other characteristics of the compounds may be tailored by changing the electron donating groups or electron accepting groups, the substituents attached to or the length of the pi-conjugated bridge. Numerous photophysical and photochemical methods are enabled by converting these compounds to electronically excited states upon simultaneous absorption of at least two photons of radiation. The compounds have large two-photon or higher-order absorptivities such that upon absorption, one or more Lewis acidic species, Lewis basic species, radical species or ionic species are formed.

Abstract: A liquid-filled light emitting diode (LED) bulb including a base, a shell, one or more LEDs, a thermally conductive liquid, and a bladder. The shell is connected to the base and the thermally conductive liquid is held within the shell. The one or more LEDs are disposed within the shell and immersed in the thermally conductive liquid. The bladder is also immersed in the thermally conductive liquid and is configured to compensate for expansion of the thermally conductive liquid.

Abstract: Volume compensation in photovoltaic device is provided. The photovoltaic device has an outer transparent casing and a substrate that, together, define an inner volume. At least one solar cell is on the substrate. A filler layer seals the at least one solar cell within the inner volume. A container within the inner volume has an opening in fluid communication with the filler layer. A diaphragm is affixed to the opening thereby sealing the interior of the container from the filler layer. The diaphragm is configured to decrease the volume within the container when the filler layer thermally expands and to increase the volume within the container when the filler layer thermally contracts. In some instances, the substrate is hollowed and the container is formed within this hollow. The container can have multiple openings, each sealed with a diaphragm. There can be multiple containers within the photovoltaic device.

Abstract: Devices for converting light into electric current are provided. A representative device has an encasing structure having at least one portion transparent. The encasing structure is configured to pass light energy into an interior of the encasing structure. The device further has a photovoltaic device positioned within the interior of the encasing structure. The photovoltaic device is positioned to receive light energy. The photovoltaic device is operable to transform the light energy into electric current. The device further has a protective space material, disposed between the encasing structure and the photovoltaic device. The protective space material is operable to transmit the light energy. The protective space material is a non-solid material having a physical property such as a viscosity of less than 1×106 cP and/or a thermal coefficient of expansion of greater than 500×10?6/° C.