Abstract: An integrated circuit chip package is described wherein the chip has an active face including a plurality of input and output pads. The chip is mounted face down on a pluralilty of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board. A convective heat sink is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden acceleration. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points which are physically connected to the underlying circuit board via resilient connecting means.

Abstract: A money feeding machine having a friction feed mounted to feed from the top of a stack of money is disclosed. The stack of money is contained within a cassette having a moveable bottom. The bottom of the cassette is raised by a motor as money is fed from the top of the stack in order to maintain the top of the stack of money substantially at the top of the cassette and available for feeding by the friction feed. Ramps are mounted a predetermined distance down from the top of the cassette to squeeze sheets of money inwardly and cause them to bow upwardly as they are pushed up by the motor. The ramps cause blocks of mint money to be separated into a short loose stack of sheets above the ramps for reliable feeding by the friction feed.