Patents by Inventor Brian D. Kennedy

Brian D. Kennedy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11267062
    Abstract: Systems and methods are disclosed that may include identifying a first coefficient of thermal expansion for a first component, the first component including component pins having a first pitch value; identifying a second coefficient of thermal expansion for a second component, the second component associated with electrically conductive pads; determining a relative expansion value based on the first coefficient of thermal expansion and the second coefficient of thermal expansion; determining a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by a soldering process; and determining a second pitch value for the electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the component pins and the electrically conductive pads during the soldering process.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: March 8, 2022
    Assignee: Dell Products L.P.
    Inventors: Brian D. Kennedy, Stephen E. Strickland
  • Publication number: 20210370428
    Abstract: Systems and methods are disclosed that may include identifying a first coefficient of thermal expansion for a first component, the first component including component pins having a first pitch value; identifying a second coefficient of thermal expansion for a second component, the second component associated with electrically conductive pads; determining a relative expansion value based on the first coefficient of thermal expansion and the second coefficient of thermal expansion; determining a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by a soldering process; and determining a second pitch value for the electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the component pins and the electrically conductive pads during the soldering process.
    Type: Application
    Filed: June 2, 2020
    Publication date: December 2, 2021
    Inventors: BRIAN D. KENNEDY, STEPHEN E. STRICKLAND
  • Patent number: 10939572
    Abstract: A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: March 2, 2021
    Assignee: EMC IP Holding Company, LLC
    Inventors: Ryan C. McDaniel, Stephen E. Strickland, Brian D. Kennedy
  • Publication number: 20200214162
    Abstract: A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.
    Type: Application
    Filed: March 9, 2020
    Publication date: July 2, 2020
    Inventors: Ryan C. McDaniel, Stephen E. Strickland, Brian D. Kennedy
  • Patent number: 10595431
    Abstract: A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: March 17, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Ryan C. McDaniel, Stephen E. Strickland, Brian D. Kennedy
  • Patent number: 8693212
    Abstract: A chassis having a cover moveable between open and closed positions and circuitry for detecting whether the cover is in the open or the closed position. The circuitry includes a transmitter of optical energy disposed at a fixed position within the chassis for transmitting pulses of optical energy at a predetermined frequency and a receiver for optical energy disposed at a fixed position within the chassis. A reflector is mounted to an inner surface of the cover and is disposed in a path to intercept and then reflect the intercepted transmitted energy to the receiver when the cover is moved to the closed position and being disposed away from the path to prevent the transmitted energy to be intercepted and then reflected to the receiver when the cover is moved to the open position.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: April 8, 2014
    Assignee: EMC Corporation
    Inventors: Brian D. Kennedy, Antonio L. Fontes