Abstract: Methods and apparatuses associated with flow sensing devices are provided. An example flow sensing device includes a flow cap component and a sensor component. The flow cap component or sensor component may include a heating element. The flow cap component can at least partially define a flow channel configured for a media to flow therethrough. The heater element may be orthogonal or perpendicular to the flow channel. The sensor component may include at least one thermal sensing element disposed upstream of the heater element and at least one thermal sensing element disposed downstream of the heater element. The sensor component may include two or more thermal sensing elements disposed in either the upstream direction or downstream direction of the heater element. Thermal sensing elements may be spaced different distances from the heater element to increase the accuracy and precision of flow rate measurement at low flow rates.

Abstract: A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.

Abstract: A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.

Abstract: A sensor method and system are disclosed. A fluid flow sensor can be provided, which measures the thermal conductivity of a fluid. The sensor itself can be configured to comprise one or more sensing element associated with a sensor substrate. A heater can be associated with said sensor wherein said heater provides heat to said fluid. A film component can also be provided that that isolates said fluid from said heater and said sensor, such that said film component conducts heat in a direction from said heater to said sensor, thereby forming a thermal coupling between said sensor, said heater and said fluid, which permits said sensor to determine a composition of said fluid by measuring thermal conductivity thereof without undesired losses of heat in other directions. The film component can be configured on or in the shape of a tubing or a flow channel.

Abstract: A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.