Patents by Inventor Brian D. Veeder

Brian D. Veeder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device chip carriers, modules, and methods of forming thereof
    Patent number: 8710523
    Abstract: The present invention provides novel methods of forming component carriers, component modules, and the carriers and modules formed therefrom which utilize thick film technology. In some embodiments, these methods are used to form lighting device chip carriers and modules. In further embodiments, these lighting device chip carriers and modules are used in LED applications.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: April 29, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Joel Slutsky, Brian D. Veeder, Thomas Lin
  • Method of forming an external electrode fluorescent lamp, thick film electrode compositions used therein, and lamps and LCD devices formed thereof
    Patent number: 7677945
    Abstract: This invention relates to method(s) of fabricating electrodes of an external electrode fluorescence lamp (EEFL) for use in thin film transistor-liquid crystal display (TFT-LCD) applications. Also disclosed is a structure with electrodes for external electrode fluorescence lamps used in TFT-LCD backlight units.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: March 16, 2010
    Assignees: E.I. du Pont de Nemours and Company, Wellpower Optronics Co Ltd
    Inventors: Joel Skutsky, Brian D. Veeder, Andy Zao, Thomas Lin, Hsiu-Wei Wu, Tjong-Ren Chang, Shuang-Chang Yang, Wen-Chun Chiu, Jin-Yuh Lu
  • Device chip carriers, modules, and methods of forming thereof
    Publication number: 20080035943
    Abstract: The present invention provides novel methods of forming component carriers, component modules, and the carriers and modules formed therefrom which utilize thick film technology. In some embodiments, these methods are used to form lighting device chip carriers and modules. In further embodiments, these lighting device chip carriers and modules are used in LED applications.
    Type: Application
    Filed: August 10, 2007
    Publication date: February 14, 2008
    Applicant: E. I. DUPONT DE NEMOURS AND COMPANY
    Inventors: Joel Slutsky, Brian D. Veeder, Thomas Lin