Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.

Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.

Abstract: A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal to approximately a melting point of one of the materials. The annealing can reduce growth formations, such as whiskers, on the one or more conductive leads. Lead frames and other devices having plated conductive leads may be subjected to the process, and the resultant plated conductive leads will have fewer growth formations than plated conductive leads not subjected to the process. The plated conductive leads may be trimmed and formed prior to or after the anneal.

Abstract: This invention provides a holder for releasably engaging a plug component of an optoelectronic device to facilitate automated testing of the optoelectronic device. The plug component of the optoelectronic device has a body and a flange extending radially outwardly from that body. The holder defines a recess configured to releasably engage the body of the plug to resist movement of the plug with respect to the holder in a direction transverse to the axis of the plug's body. The holder also includes a surface oriented for contact with the flange of the plug to resist movement of the plug with respect to the holder in a direction along the axis of the plug's body. A corresponding method is also provided.

Abstract: A support assembly for retaining a laser module of the type having a solid state laser, an optical connector and an optical fiber extending between the laser and the optical connector. The support assembly includes a baseplate having a top surface and a bottom surface. A removable spool extends upwardly from the top surface of the baseplate, wherein the spool is sized to have the optical fiber wound therearound. A laser receptacle disposed on the top surface of the baseplate. The laser receptacle is sized to receive the solid state laser in a first predetermined position and orientation. A connector holder is also disposed on the top surface of the baseplate. The connector holder receives and retains the optical connector at a second predetermined position and orientation.

Abstract: A package housing that is used to retain a wound spool and prevent a wound element from falling away from the spool. The housing includes a base segment having a hub disposed thereon and a recessed area surrounding the hub. The hub is sized to pass into the bottom end of the spool, thereby causing the spool to rest in the recessed area of the base segment of the housing. A cover segment is provided for covering the base segment of the housing and the spool. As a result, the spool becomes interposed between the base segment and the cover segment of the housing. A plurality of feed-through ports are defined between the base segment and the cover of the housing. The first end and the second end of the wound flexible element extend through two of the feed-through ports to points external of the housing.

Abstract: A method for providing fluxless soldering without oxide formation includes mounting a component on a pedestal of a base. A housing is also mounted on the base, the housing and the base together define a closed cavity containing the component. An inert gas is introduced into the cavity to create an inert gas-rich environment. Thereafter, the cavity is heated sufficiently to reflow solder provided between the component and the housing, to join the component to the housing without the formation of additional oxides on the solder joint.

Abstract: An apparatus for performing fluxless soldering includes an enclosure having a gas inlet through which an inert gas is introduced to create an inert gas-rich environment. Components are placed in the enclosure via an access port which also functions as a vent for allowing purge gases to vent from the enclosure. In one embodiment, a heating stage is provided in the enclosure which provides sufficient heat to reflow solder provided between two or more components. The inert gas is constantly flowing, or purging the enclosure in order to displace oxygen that would initially be present in the system. The presence of inert gas exclusive of other materials provides an oxygen-free environment, i.e., the inert gases provide a “shield” or environment around the parts to be soldered to inhibit the formation of additional oxides during soldering.

Abstract: An assembly that assists in the winding of an optical fiber of a laser module around a spool. The assembly contains a spool support that holds the spool as the optical fiber is wound around the spool. The spool support has a top surface with opposing side edges. The top surface of the spool support has a periphery, wherein the top surface of the spool support is beveled between its peripheral edge and the groove. The presence of the bevel helps to guide the optical fiber onto the spool as the optical fiber is wound around the spool. A generally circular groove is disposed in the top surface of spool support, wherein the groove at least partially intersects the opposing side edges of the top surface. As a result, when the spool is attached to the spool supports, opposite sides of the spool protrude beyond the sides of the spool support.