Abstract: A method of bonding first and second substrates to each other the substrates having respective bonding surfaces to be bonded together, comprising: (a) applying to the bonding surface of at least the first substrate a redox-active metal catalyst primer to form a primed surface; (b) activating the primed bonding surface of the first substrate by exposing the primed bonding surface to actinic radiation; (c) applying, to the so activated bonding surface of the first substrate, and/or or to the bonding surface of the second substrate, a UV curable anaerobic adhesive; (d) mating the bonding surfaces together with the UV curable anaerobic adhesive therebetween; and (e) exposing the UV curable anaerobic adhesive between the mated surfaces to actinic UV radiation. The method is particularly suited for obtaining bonds with good tensile shear strength with electrical substrates coated with an insulating varnish.

Abstract: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2.

Abstract: An image processing method comprises: performing a spectral analysis of a HDR image (220) to determine whether the HDR image (220) comprises spectral components indicative of a lighting of the scene by a modulated light source; analysing meta-data associated with a set of component images (221) for the HDR image to determine a difference between meta-data for one component image of the set and meta-data for at least one other component image of the set, any difference being indicative of an artefact caused by illumination of the scene by a modulated light source; combining a result of the spectral analysis and the meta-data analysis to provide an indication that illumination of the scene by a modulated light source is causing a visible artefact in at least one of the HDR images; and changing a HDR operating mode of the image processing system (200) accordingly.

Abstract: The present invention relates to a radiation curable (meth)acrylic adhesive composition comprising, consisting essentially of: i) a (meth)acrylated polydiene resin; ii) a multi-functional (meth)acrylic monomer component; iii) a mono-functional (meth)acrylic monomer component; and iv) a photo initiator component.

Abstract: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2.

Abstract: The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. The cure accelerators may be embraced generally within the structure below where X is CH2, O, S, NR?, CR?R?? or C?O; R is hydrogen or (meth)acryl; R6 is hydrogen, halogen, amino, carboxyl, nitro, alkyl, alkenyl, alkynyl, hydroxyalkyl, hydroxyalkenyl, hydroxyalkynyl, or alkaryl; and A and A1 are each individually selected from hydrogen or taken together create a ring structure of 5 to 12 total ring atoms, wherein the ring structure may be cycloaliphatic, cycloheteroaliphatic or aromatic or combinations thereof with or without substitution by one or more hydroxyl or (meth)acryl groups; and n is 0 or 1, provided that when R is hydrogen, A and A? cannot both be hydrogen or taken together cannot be naphthyl.

Abstract: A curable primer composition comprising:(a) a curable component such as methacrylate; (b) a cure initiating component; and (c) a polymer material selected from the group consisting of: (i) block polymers represented by S-A-S where S is polystyrene and A stands for a polymer or copolymer formed from one or more of ethylene, propylene, butylene, and styrene, which are optionally substituted with carboxylic acid or maleic anhydride; provided that when A comprises styrene then A is a copolymer of styrene with at least one of ethylene, propylene and butylene, and is optionally substituted with carboxylic acid or maleic anhydride; and (ii) polystyrene-poly(ethylene-propylene) (“SEP”); and (iii) any combination of said polymer materials. The composition is applied to a part then photocured. It is dry to touch. Thereafter a thermoplastic material such as a polyolefin is overmolded (e.g. injection molded) over the applied composition. It enhances bond strength of the polyolefin to the part.

Abstract: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

Abstract: An image processing method comprises: performing a spectral analysis of a HDR image (220) to determine whether the HDR image (220) comprises spectral components indicative of a lighting of the scene by a modulated light source; analysing meta-data associated with a set of component images (221) for the HDR image to determine a difference between meta-data for one component image of the set and meta-data for at least one other component image of the set, any difference being indicative of an artefact caused by illumination of the scene by a modulated light source; combining a result of the spectral analysis and the meta-data analysis to provide an indication that illumination of the scene by a modulated light source is causing a visible artefact in at least one of the HDR images; and changing a HDR operating mode of the image processing system (200) accordingly.

Abstract: This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.

Abstract: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2.

Abstract: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2.

Abstract: A curable primer composition comprising:(a) a curable component such as methacrylate; (b) a cure initiating component; and (c) a polymer material selected from the group consisting of: (i) block polymers represented by S-A-S where S is polystyrene and A stands for a polymer or copolymer formed from one or more of ethylene, propylene, butylene, and styrene, which are optionally substituted with carboxylic acid or maleic anhydride; provided that when A comprises styrene then A is a copolymer of styrene with at least one of ethylene, propylene and butylene, and is optionally substituted with carboxylic acid or maleic anhydride; and (ii) polystyrene-poly(ethylene-propylene) (“SEP”); and (iii) any combination of said polymer materials. The composition is applied to a part then photocured. It is dry to touch. Thereafter a thermoplastic material such as a polyolefin is overmolded (e.g. injection molded) over the applied composition. It enhances bond strength of the polyolefin to the part.

Abstract: Curable compositions, such as by way of exposure to radiation in the electromagnetic spectrum, for use as a primer composition for injection molding applications, are provided.

Abstract: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

Abstract: A bonding system for bonding a plastic substrate to another substrate, the bonding system comprising a plastic substrate wherein the plastic substrate is impregnated with a transition metal; and an anaerobically curable composition. Cure of the anaerobically curable composition is initiatable by the transition metal when the anaerobically curable composition is contacted with the plastic substrate under anaerobic conditions.

Abstract: A monitoring system has biomechanical sensors, physiological sensors and a controller which receive sensory inputs from the sensors to provide output signals for the output device, and it detects from the sensory inputs risk of a syncopal event The bio-mechanical sensors include sensors arranged to allow the processor to detect a user postures and posture transitions. The processor operates a finite state machine, in which there is a state corresponding to each of a plurality of user physical postures and to each of a plurality of transitions between said postures, and the processor determines a relevant state depending on the sensory inputs. A device output may be muscle stimulation to prevent syncope, and there are stimulation permissions associated with the finite state machine states.

Abstract: The present invention provides adhesive compositions, sometimes in a two part configuration which include a first part containing a (meth)acrylate component, an organic peroxide and an acetal-containing free radically curable component and a second part containing a (meth)acrylate component, and benzoylthiourea derivatives or benzoylthiourethane derivatives.

Abstract: A bonding system for bonding a plastic substrate to another substrate, the bonding system comprising a plastic substrate wherein the plastic substrate is impregnated with a transition metal; and an anaerobically curable composition. Cure of the anaerobically curable composition is initiatable by the transition metal when the anaerobically curable composition is contacted with the plastic substrate under anaerobic conditions.

Abstract: A curable primer composition comprising: (a) a curable component such as methacrylate; (b) a cure initiating component; and (c) a polymer material selected from the group consisting of: (i) block polymers represented by S-A-S where S is polystyrene and A stands for a polymer or copolymer formed from one or more of ethylene, propylene, butylene, and styrene, which are optionally substituted with carboxylic acid or maleic anhydride; provided that when A comprises styrene then A is a copolymer of styrene with at least one of ethylene, propylene and butylene, and is optionally substituted with carboxylic acid or maleic anhydride; and (ii) polystyrene-poly(ethylene-propylene) (“SEP”); and (iii) any combination of said polymer materials. The composition is applied to a part then photocured. It is dry to touch. Thereafter a thermoplastic material such as a polyolefin is overmolded (e.g. injection molded) over the applied composition. It enhances bond strength of the polyolefin to the part.