Abstract: Methods and systems for accelerated training of a machine learning based model for semiconductor applications are provided. One method for training a machine learning based model includes acquiring information for non-nominal instances of specimen(s) on which a process is performed. The machine learning based model is configured for performing simulation(s) for the specimens. The machine learning based model is trained with only information for nominal instances of additional specimen(s). The method also includes re-training the machine learning based model with the information for the non-nominal instances of the specimen(s) thereby performing transfer learning of the information for the non-nominal instances of the specimen(s) to the machine learning based model.

Abstract: Hybrid inspectors are provided. One system includes computer subsystems) configured for receiving optical based output and electron beam based output generated for a specimen. The computer subsystem(s) include one or more virtual systems configured for performing one or more functions using at least some of the optical based output and the electron beam based output generated for the specimen. The system also includes one or more components executed by the computer subsystem(s), which include one or more models configured for performing one or more simulations for the specimen. The computer subsystem(s) are configured for detecting defects on the specimen based on at least two of the optical based output, the electron beam based output, results of the one or more functions, and results of the one or more simulations.

Abstract: Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for inspection of a wafer are provided.

Abstract: Methods and systems for determining characteristic(s) of patterns of interest (POIs) are provided. One system is configured to acquire output of an inspection system generated at the POI instances without detecting defects at the POI instances. The output is then used to generate a selection of the POI instances. The system then acquires output from an output acquisition subsystem for the selected POI instances. The system also determines characteristic(s) of the POI using the output acquired from the output acquisition subsystem.

Abstract: A voltage contrast imaging defect detection system includes a voltage contrast imaging tool and a controller coupled to the voltage contrast imaging tool. The controller is configured to generate one or more voltage contrast imaging metrics for one or more structures on a sample, determine one or more target areas on the sample based on the one or more voltage contrast imaging metrics, receive a voltage contrast imaging dataset for the one or more target areas on the sample from the voltage contrast imaging tool, and detect one or more defects based on the voltage contrast imaging dataset.

Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.

Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

Abstract: Methods and systems for determining coordinates for an area of interest on a specimen are provided. One system includes one or more computer subsystems configured for, for an area of interest on a specimen being inspected, identifying one or more targets located closest to the area of interest. The computer subsystem(s) are also configured for aligning one or more images for the one or more targets to a reference for the specimen. The image(s) for the target(s) and an image for the area of interest are acquired by an inspection subsystem during inspection of the specimen. The computer subsystem(s) are further configured for determining an offset between the image(s) for the target(s) and the reference based on results of the aligning and determining modified coordinates of the area of interest based on the offset and coordinates of the area of interest reported by the inspection subsystem.

Abstract: Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with one or more other modes. The computer subsystem(s) are also configured for acquiring, from the storage medium, one or more images generated with the one or more other modes at a location on the specimen corresponding to the first defect. In addition, the computer subsystem(s) are configured for determining one or more characteristics of the acquired one or more images and determining one or more characteristics of the first defect based on the one or more characteristics of the acquired one or more images.

Abstract: Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein.

Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes creating a searchable database for a design for a wafer, which includes assigning values to different portions of the design based on patterns in the different portions of the design and storing the assigned values in the searchable database. Different portions of the design having substantially the same patterns are assigned the same values in the searchable database. The searchable database is configured such that searching of the database can be synchronized with generation of output for the wafer by one or more detectors of a wafer inspection system. Therefore, as the wafer is being scanned, design information for the output can be determined as fast as the output is generated, which enables multiple, desirable design based inspection capabilities.

Abstract: A universal inside corner patch for patching inside corners formed by protrusions from a commercial low slope roof is disclosed. The universal inside corner patch includes a body having a central portion and a peripheral portion. A cutout is formed in the body extending from the peripheral portion to the central portion thereof. The cutout defines in the body a skirt having an edge on one side of the cutout and a flap having an edge on an opposite side of the cutout. Folding locations such as lines or other indicia on the body correspond to respective angles of an inside corner to be patched. When the skirt portion is overlapped with the flap portion with the edge of the skirt portion registering with one of the folding locations, the inside corner patch is configured to conform to an inside corner with an angle corresponding to the one of the folding locations. An adhesive may be disposed on a back surface of the body for adhering and sealing the corner patch in place.

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes creating a searchable database for a design for a wafer, which includes assigning values to different portions of the design based on patterns in the different portions of the design and storing the assigned values in the searchable database. Different portions of the design having substantially the same patterns are assigned the same values in the searchable database. The searchable database is configured such that searching of the database can be synchronized with generation of output for the wafer by one or more detectors of a wafer inspection system. Therefore, as the wafer is being scanned, design information for the output can be determined as fast as the output is generated, which enables multiple, desirable design based inspection capabilities.

Abstract: Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein.

Abstract: An impeller exhaust ridge vent is provided for covering a ridge slot formed along the ridge of a roof. The ridge vent has an elongated laterally flexible center panel with edge portions along which vents are formed. Standoffs can depend from the bottom of the center panel for supporting the center panel a predetermined distance above the roof deck so that attic air can vent through the ridge slot, beneath the center panel, and exit through the vents. A base panel can be provided to cover the roof deck and form a smooth substantially sealed air duct for passage of the air. Upstanding wind baffles are disposed outboard of and spaced from the vents. One or more tangential impellers is rotatably mounted in the pace between the vents and wind baffles and can be free spinning or driven by an electric motor. Rotation of the tangential impellers creates a cross-flow fan effect that draws air forcibly from beneath the center panel and exhausts it to ambience. The attic space is thereby actively ventilated.

Abstract: A universal inside corner patch for patching inside corners formed by protrusions from a commercial low slope roof is disclosed. The universal inside corner patch includes a body having a central portion and a peripheral portion. A cutout is formed in the body extending from the peripheral portion to the central portion thereof. The cutout defines in the body a skirt having an edge on one side of the cutout and a flap having an edge on an opposite side of the cutout. Folding locations such as lines or other indicia on the body correspond to respective angles of an inside corner to be patched. When the skirt portion is overlapped with the flap portion with the edge of the skirt portion registering with one of the folding locations, the inside corner patch is configured to conform to an inside corner with an angle corresponding to the one of the folding locations. An adhesive may be disposed on a back surface of the body for adhering and sealing the corner patch in place.

Abstract: Various methods, carrier media, and systems for monitoring a characteristic of a specimen are provided. One computer-implemented method for monitoring a characteristic of a specimen includes determining a property of individual pixels on the specimen using output generated by inspecting the specimen with an inspection system. The method also includes determining a characteristic of individual regions on the specimen using the properties of the individual pixels in the individual regions. The method further includes monitoring the characteristic of the specimen based on the characteristics of the individual regions.

Abstract: Systems and methods for monitoring time-varying classification performance are disclosed.