Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: A fluid pumping system for an engine or other system which reduces the high speed driving power consumption by hydraulic unloading of the mechanically-driven pump element through the use of recirculation through a jet pump when a system fluid pressure target value is achieved. A pressure-activated flow control valve is utilized to efficiently recycle excessive flow volume from the pump through the jet pump and back to the pump's intake with minimized pressure loss, thereby hydraulically unloading the pump in comparison with conventional systems. Energy conservation by the jet pump and recirculation conduit acts to also prevent cavitation of the hydraulically unloaded pump element at high speeds. The fluid system is useful in conjunction with an engine balance shaft system to control gear rattle at low speeds without adding undue gear loads at high speeds.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: The invention relates to a cutting apparatus and method for breaking down of a vehicle tyre. The apparatus comprises support means for supporting a tyre in position, cutting means for cutting the tyre and rotation means for rotating the tyre during a cutting operation. The apparatus includes a track or guide (14) which is a conveying means for directing tyres toward a frame (15). The frame (15) forms part of the support means and communicates with a hopper (16) into which constituent tyre parts are deposited automatically after a cutting operation has been carried out. The cutting means comprises cutter arms (17). A support means also comprises pivot arms (18) which carry tyre guides (19) and are connected to a pivot support arm (20). Rollers (21) are provided for supporting the tyre (7) in the cutting position. The rotation means comprises a driving wheel (22).

Abstract: A protective sleeve for a yoyo toy is made of resiliently stretchable material. The sleeve is coaxially engaged over the yoyo when not in use. The sleeve, not only protects the yoyo against chips, scratches and other damages, but also keeps its string from unraveling or tangling.

Abstract: A robot end effector for automated processing facilitates wet wafer processing by improving the maintenance of the end effector. In particular, the end effector may be exposed to a variety of chemical conditions in the course of its operation. By making the end effector finger removable from the arm, maintenance of the end effector finger is facilitated. By providing alignment means between the end effector finger and the arm, one can insure that the finger is accurately positioned on the arm after such maintenance.

Abstract: A quartz tank for wet semiconductor wafer processing includes one or more ports extending through the tank for the exchange of fluids with the tank. The openings may be aligned with a T-shaped quartz stem having an enlarged end retained on the interior side of said quartz tank in sealing abutment therewith. The lower end of the quartz stem may have external threads to abut with a suitable union. The union may include a nut having a reduced diameter lower end to engage an enlarged end of the tubing member connected to the bottom of the quartz stem. An o-ring seal may be sandwiched between the tubing and the lower end of the quartz stem. The nut may be formed of a carbon-fiber reinforced fluorocarbon material such as perfluoroalkoxy.

Abstract: A quartz tank for wet semiconductor wafer processing includes one or more ports extending through the tank for the exchange of fluids with the tank. The openings may be aligned with a T-shaped quartz stem having an enlarged end retained on the interior side of said quartz tank in sealing abutment therewith. The lower end of the quartz stem may have external threads to abut with a suitable union. The union may include a nut having a reduced diameter lower end to engage an enlarged end of the tubing member connected to the bottom of the quartz stem. An o-ring seal may be sandwiched between the tubing and the lower end of the quartz stem. The nut may be formed of a carbon-fiber reinforced fluorocarbon material such as perfluoroalkoxy.

Abstract: A light delivery device including an interchangeable handpiece and a semiconductor light source module adapted to releasably attach to the handpiece. The light source module includes a two-dimensional array of light emitting diodes (LED's) disposed on a surface of a fluid-cooled electrically conductive support plate. The device is adapted for uniformly illuminating a tissue surface with phototherapeutic light. The phototherapeutic light is produced by an array of over-driven LED's mounted on the surface of the heat-sinked support. The semiconductor light source employs a multi-layer construction wherein electrically conductive layers are thermally isolated from each other. The device is rugged, inexpensive and can produce high optical power while operating at a temperature well below the temperature at which device failure occurs. The light source module is adapted to be releasably connected to an interchangeable LED handpiece which provides power to the LED's and conducts a coolant fluid.

Abstract: An improved handle for attaching to and supporting a wafer carrier is described in which robotic fixtures of the wafer carrier are utilized. The locking mechanism of the handle engages the robotic fixtures and then a configuration of flanges and shaped voids attaches to the robotic fixtures in a manner which is secure, even at elevated temperatures common to semiconductor manufacturing processes. Manipulation of the handle conveniently detaches the locking mechanism.

Abstract: Improvements to an integrated circuit wafer rinsing and washing machine which include a streamlined housing for low turbulence air flow, improved rear maintenance capability, improved wafer carriers, foot operated switches and improved rotating part fastening means.

Abstract: An insulation slicing terminal, stamped from electrically conducting sheet material, has a base portion and two cantilevered legs extending from the base portion providing opposed side edges between which a conductor is positioned. The top edge and side edge of each leg intersect at an abrupt angle to form insulation slicing edges, the two top edges forming a shallow Vee formation. An initial small gap is provided between the side edges by a first swage on one leg near the junction with the base portion. A further swage on one of the legs nearer the top of the leg acts to prevent movement of the conductor out of the terminal once the wire is inserted past the further swage. As a further feature, the shallow Vee formation, of the top edges, has an apex prior to slitting which is a radiused flat, permitting off-center tolerances on slitting without detrimentally affecting the insulation slicing edges.