Patents by Inventor Brian E. Curcio
Brian E. Curcio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9798259Abstract: Described herein is an electrostatic ink composition comprising a liquid carrier; and chargeable particles comprising a co-polymer of an alkylene monomer and an acrylic acid monomer, and a pearlescent, non-metallic pigment, wherein the chargeable particles are dispersed in the liquid carrier. Also described herein are a method of electrophotographic printing and a print substrate.Type: GrantFiled: January 29, 2013Date of Patent: October 24, 2017Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alexey S. Kabalnov, Guang Jin Li, Brian E. Curcio, Yaron Grinwald, Reut Avigdor
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Publication number: 20150323879Abstract: Described herein is an electrostatic ink composition comprising a liquid carrier; and chargeable particles comprising a co-polymer of an alkylene monomer and an acrylic acid monomer, and a pearlescent, non-metallic pigment, wherein the chargeable particles are dispersed in the liquid carrier. Also described herein are a method of electrophotographic printing and a print substrate.Type: ApplicationFiled: January 29, 2013Publication date: November 12, 2015Inventors: Alexey S. Kabalnov, Guang Jin Li, Brian E. Curcio, Yaron Grinwald, Reut Avigdor
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Patent number: 8596746Abstract: An inkjet pen includes a printhead firing chamber, a nozzle plate having at least one nozzle in fluid communication with the firing chamber, and a layer of shipping fluid within the firing chamber and covering the nozzle plate and the at least one nozzle. The shipping fluid has a density that is different than that of the ink that will be ejected from the firing chamber to form an image on media.Type: GrantFiled: March 31, 2009Date of Patent: December 3, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brian E. Curcio, Chorng Ing Sow, Alexey S. Kabalnov
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Patent number: 8474934Abstract: A method for improving gloss of a print includes configuring a printing system to deposit ink drops from a plurality of inks in an ink set onto a print surface. During the depositing, the printing system is further configured to control micro-coalescence of the ink drops. The micro-coalescence is controlled by i) depositing the ink drops onto the print surface according to a predefined order of color based upon solids content, ii) adjusting a number of printing passes, iii) adjusting a delay time between the printing passes, and/or iv) depositing different amounts of the ink drops onto the print surface during different printing passes.Type: GrantFiled: April 30, 2010Date of Patent: July 2, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brian E. Curcio, Joshua A. Mann, Dustin W. Blair, Glenn Thomas Haddick, Thomas Jeffrey Winter
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Patent number: 8356878Abstract: A method of printing an image includes co-dispensing a compensation vehicle and an ink from an ink set to sites on a printing medium to form a printed image. A combined amount of the ink and the compensation vehicle dispensed to each site is at least substantially equal to a minimum site value that is predetermined for the ink set and the printing medium. The method further includes applying an amount of an overcoat liquid to the printed image to obtain a predetermined ratio of gloss to haze.Type: GrantFiled: May 20, 2011Date of Patent: January 22, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kai-Kong Iu, Brian E. Curcio, Ryan Tung Vu
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Publication number: 20120293574Abstract: A method of printing an image includes co-dispensing a compensation vehicle and an ink from an ink set to sites on a printing medium to form a printed image. A combined amount of the ink and the compensation vehicle dispensed to each site is at least substantially equal to a minimum site value that is predetermined for the ink set and the printing medium. The method further includes applying an amount of an overcoat liquid to the printed image to obtain a predetermined ratio of gloss to haze.Type: ApplicationFiled: May 20, 2011Publication date: November 22, 2012Inventors: Kai-Kong Iu, Brian E. Curcio, Ryan Tung Vu
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Patent number: 8267498Abstract: Example methods, apparatus and articles of manufacture to control gloss quality in printed images are disclosed. A disclosed example apparatus includes a print engine to print a plurality of images for respective ones of a plurality of colors, each image representing a plurality of different print parameter combinations, a scan module to measure a first plurality of light reflectances for respective ones of the plurality of images and the print parameter combinations, and a calibrator to calibrate an operation of the print engine for respective ones of the plurality of colors based on the first plurality of measured light reflectances, the operations of the print engine including at least one of an order of ink application, a rate of ink application, a density of ink application, or an applied amount of gloss enhancer.Type: GrantFiled: June 1, 2010Date of Patent: September 18, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dustin W. Blair, Brian E. Curcio, David S. Vejtasa, Glenn Thomas Haddick
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Publication number: 20110310181Abstract: An inkjet pen includes a printhead firing chamber, a nozzle plate having at least one nozzle in fluid communication with the firing chamber, and a layer of shipping fluid within the firing chamber and covering the nozzle plate and the at least one nozzle. The shipping fluid has a density that is different than that of the ink that will be ejected from the firing chamber to form an image on media.Type: ApplicationFiled: March 31, 2009Publication date: December 22, 2011Applicant: Hewlett-Packard Development Company, L.P.Inventors: Brian E. Curcio, Chorng Ing Sow, Alexey S. Kabalnov
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Patent number: 7914110Abstract: Fluid is purged from a plurality of fluid-ejection nozzles of a fluid-ejection mechanism. A first series of spit-wipe operations is performed. A second series of spit-wipe operations is then performed.Type: GrantFiled: January 31, 2007Date of Patent: March 29, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brian E. Curcio, Jeffrey Anderson, Cynthia Jarom, Jeffrey D. Rutland
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Publication number: 20090073219Abstract: Fluid is purged from a plurality of fluid-ejection nozzles of a fluid-ejection mechanism. A first series of spit-wipe operations is performed. A second series of spit-wipe operations is then performed.Type: ApplicationFiled: January 31, 2007Publication date: March 19, 2009Inventors: Brian E. Curcio, Jeffrey Anderson, Cynthia Jarom, Jeffrey D. Rutland
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Patent number: 7402254Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.Type: GrantFiled: September 8, 2003Date of Patent: July 22, 2008Assignee: International Business Machines CorporationInventors: Brian E. Curcio, Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks
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Patent number: 7303639Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.Type: GrantFiled: August 22, 2005Date of Patent: December 4, 2007Assignee: International Business Machines CorporationInventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
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Patent number: 7076869Abstract: The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The first via is totally filled with a first solid conductive plug and an end of the first solid conductive plug includes a first contact pad that is in contact with a surface of the first layer. A second via extending through a total thickness of a second layer is formed. The second via totally filling with a second solid conductive plug and an end of the second solid conductive plug includes a second contact pad that is in contact with a surface of the second layer. The second layer is electrically and mechanically coupled to the first layer by an electrically conductive adhesive that is in electrical and mechanical contact with both the end of the first plug and the end of the second plug.Type: GrantFiled: September 27, 2002Date of Patent: July 18, 2006Assignee: International Business Machines CorporationInventors: Brian E. Curcio, Donald S. Farquhar, Voya R. Markovich, Konstantinos I. Papathomas
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Patent number: 6969436Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.Type: GrantFiled: August 13, 2003Date of Patent: November 29, 2005Assignee: International Business Machines CorporationInventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
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Patent number: 6955849Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.Type: GrantFiled: May 26, 2004Date of Patent: October 18, 2005Assignee: International Business Machines CorporationInventors: Brian E. Curcio, Frank D. Egitto, Robert M. Japp, Thomas R. Miller, Manh-Quan T. Nguyen, Douglas O. Powell
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Patent number: 6790305Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.Type: GrantFiled: October 8, 2002Date of Patent: September 14, 2004Assignee: International Business Machines CorporationInventors: Brian E. Curcio, Frank D. Egitto, Robert M. Japp, Thomas R. Miller, Manh-Quan T. Nguyen, Douglas O. Powell
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Patent number: 6776852Abstract: A process of removing excess holefill material from a surface of an electronic substrate in which the holefill residue is contacted with a swelling agent followed by planarizing of the surface in the presence of an agent no stronger than a liquid having a pH of about 6 to about 8.Type: GrantFiled: January 14, 2002Date of Patent: August 17, 2004Assignee: International Business Machines CorporationInventors: Christina M. Boyko, Brian E. Curcio, Donald S. Farquhar, Michael Wozniak
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Publication number: 20040084137Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.Type: ApplicationFiled: August 13, 2003Publication date: May 6, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
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Publication number: 20040067347Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.Type: ApplicationFiled: October 8, 2002Publication date: April 8, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian E. Curcio, Frank D. Egitto, Robert M. Japp, Thomas R. Miller, Manh-Quan T. Nguyen, Douglas O. Powell
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Publication number: 20040052945Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.Type: ApplicationFiled: September 8, 2003Publication date: March 18, 2004Applicant: International Business Machines CorporationInventors: Brian E. Curcio, Donald S. Farquhar, Konstantinos I. Papathomas, Mark D. Poliks