Patents by Inventor Brian E. Dewes

Brian E. Dewes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7880113
    Abstract: A method and structure use characteristics of a plasma discharge for verifying a hermetic seal. The plasma discharge is created in a hermetically sealed cavity by a pair of spaced electrodes that extend from tips inside the hermetically sealed cavity to contacts outside the sealed cavity. An electrical bias is applied to the contacts that is sufficient to create a plasma discharge in a properly hermetically sealed cavity but not in an unsealed cavity.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: February 1, 2011
    Assignee: Delphi Technologies, Inc.
    Inventors: Brian E. Dewes, Denise R. Dewes, Richard D. Harlan
  • Publication number: 20100265989
    Abstract: A thermopile-based thermal detector is provided by a thermocouple, formed from a single sheet of material, which is made dissimilar with a P-doped and an N-doped junction electrically isolated via a naturally forming depletion region. The thermopile P-N sheet is uniform and planar, addressing stress and manufacturing issues. The usual non-active area of a conventional thermopile is significantly reduced or eliminated, and thus the output signal per unit diaphragm area of the detector is substantially increased, without the typical reduction in the signal-to-noise ratio. Also, a significant reduction in size of the thermal detector area is provided without a reduction in signal or signal-to-noise ratio. In an aspect, a second layer of thermocouples is axially positioned over, and connected with, a first layer of thermocouples. Additional axially stacked thermopiles can be provided within the same fabrication process. Signal processing circuitry may be electrically interconnected with the thermocouple.
    Type: Application
    Filed: July 1, 2010
    Publication date: October 21, 2010
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: BRIAN E. DEWES, PEDRO E. CASTILLO-BORELLY
  • Patent number: 7785002
    Abstract: A thermopile-based thermal detector is provided by a thermocouple, formed from a single sheet of material, which is made dissimilar with a P-doped and an N-doped junction electrically isolated via a naturally forming depletion region. The thermopile P-N sheet is uniform and planar, addressing stress and manufacturing issues. The usual non-active area of a conventional thermopile is significantly reduced or eliminated, and thus the output signal per unit diaphragm area of the detector is substantially increased, without the typical reduction in the signal-to-noise ratio. Also, a significant reduction in size of the thermal detector area is provided without a reduction in signal or signal-to-noise ratio. In an aspect, a second layer of thermocouples is axially positioned over, and connected with, a first layer of thermocouples. Additional axially stacked thermopiles can be provided within the same fabrication process. Signal processing circuitry may be electrically interconnected with the thermocouple.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: August 31, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Brian E. Dewes, Pedro E. Castillo-Borelly
  • Publication number: 20080130710
    Abstract: A thermopile-based thermal detector is provided by a thermocouple, formed from a single sheet of material, which is made dissimilar with a P-doped and an N-doped junction electrically isolated via a naturally forming depletion region. The thermopile P-N sheet is uniform and planar, addressing stress and manufacturing issues. The usual non-active area of a conventional thermopile is significantly reduced or eliminated, and thus the output signal per unit diaphragm area of the detector is substantially increased, without the typical reduction in the signal-to-noise ratio. Also, a significant reduction in size of the thermal detector area is provided without a reduction in signal or signal-to-noise ratio. In an aspect, a second layer of thermocouples is axially positioned over, and connected with, a first layer of thermocouples. Additional axially stacked thermopiles can be provided within the same fabrication process. Signal processing circuitry may be electrically interconnected with the thermocouple.
    Type: Application
    Filed: December 5, 2006
    Publication date: June 5, 2008
    Inventors: Brian E. Dewes, Pedro E. Castillo-Borelly