Abstract: An imaging detector (214) includes a scintillator array (216) including a scintillator element (228) and a material (230) and a photosensor array (218) including a detector element (222) having a light sensitive region (224) and a non-sensitive region (226). The light sensitive region is separated from the scintillator element by a gap, the light sensitive region is in one-to-one mechanical alignment with the scintillator element, and the non-sensitive region is in mechanical alignment with the material. The detector further includes structure (234) that includes one or more material free channels. The structure is located between the non-sensitive region and the material and not between the light sensitive region and the scintillator element. An optical adhesive (232) is located in the gap, filling the entire gap, and mechanically and optically coupling the light sensitive region and the scintillator element.

Abstract: A radiation detector module (22) particularly well suited for use in computed tomography (CT) applications includes a scintillator (200), a photodetector array (202), and signal processing electronics (205). The photodetector array (202) includes a semiconductor substrate (208) having a plurality of photodetectors and metalization (210) fabricated on non-illuminated side of the substrate (208). The metalization routes electrical signals between the photodetectors and the signal processing electronics (205) and between the signal processing electronics (205) and an electrical connector (209).

Abstract: An imaging detector (214) includes a scintillator array (216) including a scintillator element (228) and a material (230) and a photosensor array (218) including a detector element (222) having a light sensitive region (224) and a non-sensitive region (226). The light sensitive region is separated from the scintillator element by a gap, the light sensitive region is in one-to-one mechanical alignment with the scintillator element, and the non-sensitive region is in mechanical alignment with the material. The detector further includes structure (234) that includes one or more material free channels. The structure is located between the non-sensitive region and the material and not between the light sensitive region and the scintillator element. An optical adhesive (232) is located in the gap, filling the entire gap, and mechanically and optically coupling the light sensitive region and the scintillator element.

Abstract: An imaging detector includes processing electronics with a thermal coefficient about equal to a negative of a summation of thermal coefficients of a photosensor array and a scintillator array of the detector. In another instance, the imaging detector includes an A/D converter that alternately converts first charge corresponding to impinging radiation into a first signal and second charge corresponding to decaying charge into a second signal and a logic unit that corrects the first signal based on the second signal. In another instance, the imaging detector includes an A/D converter, an integrator offset voltage signal determiner, and a logic unit, wherein the determiner induces an electrical current via an offset voltage, the A/D converter measures the current, and the logic unit calculates a resistance of the photosensor array based on the reference voltage and the measured current.

Abstract: An imaging detector includes processing electronics with a thermal coefficient about equal to a negative of a summation of thermal coefficients of a photosensor array and a scintillator array of the detector. In another instance, the imaging detector includes an A/D converter that alternately converts first charge corresponding to impinging radiation into a first signal and second charge corresponding to decaying charge into a second signal and a logic unit that corrects the first signal based on the second signal. In another instance, the imaging detector includes an A/D converter, an integrator offset voltage signal determiner, and a logic unit, wherein the determiner induces an electrical current via an offset voltage, the A/D converter measures the current, and the logic unit calculates a resistance of the photosensor array based on the reference voltage and the measured current.

Abstract: An imaging system (100) includes a radiation source (108) that emits radiation that traverses an examination region (106) and a detection system (114) that detects radiation that traverses the examination region (106) and generates a signal indicative thereof. The detection system (114) includes a first detector array (1141-114N) and a second detector array (1141-114N). The first and second detector arrays (1141-114N) are separately distinct detector arrays and at least one of the detector arrays (1141-114N) is moveable with respect to the radiation beam. A reconstructor (116) reconstructs the signal and generates volumetric image data indicative thereof.

Abstract: A radiation sensitive detector array includes a plurality of detector modules (118) extending along a z-axis direction and aligned along an x-axis direction with respect to the imaging system (100). At least one of the detector modules (118) includes a module backbone (124) and at least one detector tile (122). The at least one detector tile (122) is coupled to the module backbone (124) through a non-threaded fastener (142). The at least one detector tile (122) includes a two-dimensional detector (126) and a two-dimensional anti-scatter grid (128) that is focused at a focal spot (112) of an imaging system (100).

Abstract: An imaging detector includes processing electronics (208) with a thermal coefficient about equal to a negative of a summation of thermal coefficients of a photosensor array (204) and a scintillator array (202) of the detector. In another instance, the imaging detector includes an A/D converter (302) that alternately converts first charge corresponding to impinging radiation into a first signal and second charge corresponding to decaying charge into a second signal and a logic unit (308) that corrects the first signal based on the second signal. In another instance, the imaging detector includes an A/D converter (302), an integrator offset voltage signal determiner (318), and a logic unit (308), wherein the determiner (318) induces an electrical current via an offset voltage, the A/D converter (302) measures the current, and the logic unit (308) calculates a resistance of the photosensor array (204) based on the reference voltage and the measured current.

Abstract: An imaging system (100) includes a radiation source (108) that emits radiation that traverses an examination region (106) and a detection system (114) that detects radiation that traverses the examination region (106) and generates a signal indicative thereof. The detection system (114) includes a first detector array (1141-114N) and a second detector array (1141-114N). The first and second detector arrays (1141-114N) are separately distinct detector arrays and at least one of the detector arrays (1141-114N) is moveable with respect to the radiation beam. A reconstructor (116) reconstructs the signal and generates volumetric image data indicative thereof.

Abstract: A radiation sensitive detector array includes a plurality of detector modules (118) extending along a z-axis direction and aligned along an x-axis direction with respect to the imaging system (100). At least one of the detector modules (118) includes a module backbone (124) and at least one detector tile (122). The at least one detector tile (122) is coupled to the module backbone (124) through a non-threaded fastener (142). The at least one detector tile (122) includes a two-dimensional detector (126) and a two-dimensional anti-scatter grid (128) that is focused at a focal spot (112) of an imaging system (100).

Abstract: An imaging detector includes processing electronics with a thermal coefficient about equal to a negative of a summation of thermal coefficients of a photosensor array and a scintillator array of the detector. In another instance, the imaging detector includes an A/D converter that alternately converts first charge corresponding to impinging radiation into a first signal and second charge corresponding to decaying charge into a second signal and a logic unit that corrects the first signal based on the second signal. In another instance, the imaging detector includes an A/D converter, an integrator offset voltage signal determiner, and a logic unit, wherein the determiner induces an electrical current via an off-set voltage, the A/D converter measures the current, and the logic unit calculates a resistance of the photosensor array based on the reference voltage and the measured current.

Abstract: A radiographic imaging apparatus (10) comprises a primary radiation source (14) which projects a beam of radiation into an examination region (16). A detector (18) converts detected radiation passing through the examination region (16) into electrical detector signals representative of the detected radiation. The detector (18) has at least one temporally changing characteristic such as an offset B(t) or gain A(t). A grid pulse means (64) turns the primary radiation source (14) ON and OFF at a rate between 1000 and 5000 pulses per second, such that at least the offset B(t) is re-measured between 1000 and 5000 times per second and corrected a plurality of times during generation of the detector signals. The gain A(t) is measured by pulsing a second pulsed source (86, 100, 138) of a constant intensity (XRef) with a second pulse means (88). The gain A(t) is re-measured and corrected a plurality of times per second during generation of the detector signals.

Abstract: A radiographic imaging apparatus (10) comprises a primary radiation source (14) which projects a beam of radiation into an examination region (16). A detector (18) converts detected radiation passing through the examination region (16) into electrical detector signals representative of the detected radiation. The detector (18) has at least one temporally changing characteristic such as an offset B(t) or gain A(t). A grid pulse means (64) turns the primary radiation source (14) ON and OFF at a rate between 1000 and 5000 pulses per second, such that at least the offset B(t) is re-measured between 1000 and 5000 times per second and corrected a plurality of times during generation of the detector signals. The gain A(t) is measured by pulsing a second pulsed source (86, 100, 138) of a constant intensity (XRef) with a second pulse means (88). The gain A(t) is re-measured and corrected a plurality of times per second during generation of the detector signals.

Abstract: A radiation detector module (22) particularly well suited for use in computed tomography (CT) applications includes a scintillator (200), a photodetector array (202), and signal processing electronics (205). The photodetector array (202) includes a semiconductor substrate (208) having a plurality of photodetectors and metalization (210) fabricated on non-illuminated side of the substrate (208). The metalization routes electrical signals between the photodetectors and the signal processing electronics (205) and between the signal processing electronics (205) and an electrical connector (209).