Patents by Inventor Brian E. Jacobs

Brian E. Jacobs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250040931
    Abstract: Surgical stapling devices have a surgical buttress attached to an anvil jaw member, a cartridge jaw member, or both. In use, the surgical buttress reinforces a staple line formed upon application of staples from the surgical stapling device and minimizes leaks which may exude from the staple line and/or tissue being stapled by the surgical stapling device.
    Type: Application
    Filed: August 9, 2024
    Publication date: February 6, 2025
    Applicant: Covidien LP
    Inventors: Mingfei Chen, Rhonda L. Staneart, Emily E. Jacobs, Gerald N. Hodgkinson, Brian C. Graham, Monideepa Chatterjee
  • Patent number: 4512509
    Abstract: A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.
    Type: Grant
    Filed: February 25, 1983
    Date of Patent: April 23, 1985
    Assignee: AT&T Technologies, Inc.
    Inventors: Roland Ellis, Jr., Brian E. Jacobs, Edward J. March, Raymond J. Newman
  • Patent number: 4466791
    Abstract: A condensation soldering facility (10) comprised of a housing (12) having a divider member (22) therein which separates the housing into a drying chamber (24) in an upper section and a soldering chamber (26) in a lower section. A transfer member (76) is pivotably mounted within the drying chamber (24) to receive articles (112--112) to be soldered through an access door (71) in the top of the drying chamber (24) and arcuately transfer the articles through an access door (44) in the divider member (22) to solder the articles in the soldering chamber (26).
    Type: Grant
    Filed: October 27, 1982
    Date of Patent: August 21, 1984
    Assignee: AT&T Technologies, Inc.
    Inventors: Brian E. Jacobs, Edward J. March