Patents by Inventor Brian E. O'Donnelly

Brian E. O'Donnelly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package with stress relief channel
    Patent number: 5315155
    Abstract: There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.
    Type: Grant
    Filed: July 13, 1992
    Date of Patent: May 24, 1994
    Assignee: Olin Corporation
    Inventors: Brian E. O'Donnelly, Brian Mravic, Jacob Crane, Deepak Mahulikar
  • Semiconductor die attach system
    Patent number: 4978052
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: December 18, 1990
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Satyam C. Cherukuri, Deepak Mahulikar, Brian E. O'Donnelly
  • Semiconductor die attach system
    Patent number: 4872047
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.
    Type: Grant
    Filed: November 7, 1986
    Date of Patent: October 3, 1989
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Satyam C. Cherukuri, Deepak Mahulikar, Brian E. O'Donnelly
  • Forming a circuit pattern in a metallic tape by electrical discharge machining
    Patent number: 4735678
    Abstract: The present invention is directed to the process of forming a circuit pattern in a strip of metallic tape with an electrical discharge machining apparatus having an electrode and a pool of dielectric material. The electrode, having a negative image of the circuit pattern cut into a first end thereof, is submerged in the dielectric material. By controlling the pulsing of direct current across the gap between the electrode and the strip of metallic material for a period of time, a spark discharging across the gap causes small quantities of the metallic foil to be removed so as to cut the circuit pattern.
    Type: Grant
    Filed: April 13, 1987
    Date of Patent: April 5, 1988
    Assignee: Olin Corporation
    Inventors: Frank N. Mandigo, Brian E. O'Donnelly